LCMXO2-7000ZE-2FG484I

The LCMXO2-7000ZE-2FG484I is a MachXO2 family FPGA IC delivering a high-density, low-power, reconfigurable logic fabric. It combines 6,864 logic elements with 334 user I/Os and embedded memory to address industrial-class system control, I/O bridging and glue-logic applications.

Designed for industrial environments, this surface-mount 484-BBGA device supports single-supply operation and fast instant-on configuration while offering on-chip nonvolatile user flash and a flexible programmable I/O suite for mixed-signal and high-speed interface requirements.

Key Features

• Core Logic — 6,864 logic elements suitable for complex glue logic, protocol adaptation and medium-density FPGA tasks.
• Embedded Memory — Approximately 245,760 bits of on-chip RAM and family support for up to 256 kbits of user flash memory for configuration and data storage.
• I/O Density & Flexibility — 334 I/Os with programmable sysIO buffers supporting a wide range of standards, differential terminations, hot-socketing and programmable pull modes.
• Low Power Operation — Built on an advanced low-power process with standby modes; family data indicates ultra-low standby power down to micro-watt levels.
• Clocking & Timing — On-chip clocking resources including up to two analog PLLs for fractional-n frequency synthesis and multiple primary clocks to support varied interface timing.
• Reconfiguration & Nonvolatile Storage — Instant-on single-chip operation with in-field reconfiguration, background programming and multiple programming interfaces (JTAG, SPI, I2C) as supported by the MachXO2 family.
• Package & Mounting — Surface mount 484-BBGA package (supplier device package: 484-FBGA, 23 × 23 mm) for compact system integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial deployments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic, protocol conversion and I/O aggregation using the device’s logic capacity and industrial temperature rating.
• Interface Bridging — Use dense I/O and programmable sysIO buffers to translate and buffer between heterogeneous interfaces on a single chip.
• System Glue Logic — Replace multiple discrete components with a compact FPGA to reduce BOM and simplify board-level integration.
• In-field Programmable Systems — Leverage on-chip user flash and TransFR reconfiguration capability for firmware updates and field upgrades without hardware swaps.

Unique Advantages

• High I/O Count: 334 I/Os enable integration of many peripherals and interfaces without external I/O expanders.
• Significant Logic Capacity: 6,864 logic elements provide headroom for medium-complexity functions while maintaining a compact footprint.
• Embedded Nonvolatile Memory: On-chip user flash plus embedded RAM allow local storage of configuration and critical data, simplifying external memory requirements.
• Industrial Ready: Surface-mount 484-BBGA packaging and −40 °C to 100 °C operating range support deployment in industrial environments.
• Flexible Clocking and Low-Power Modes: Multiple PLLs and power-saving options enable optimized performance across a range of workloads.

Why Choose LCMXO2-7000ZE-2FG484I?

This MachXO2 device balances high I/O density, substantial logic resources and embedded memory in a single industrial-grade package. It is well suited to customers building compact control systems, interface bridges and field-upgradeable products that require reliable operation across extended temperature ranges.

Choosing the LCMXO2-7000ZE-2FG484I provides a scalable, reconfigurable building block that reduces external components, supports rapid in-field updates and aligns with RoHS compliance for modern electronics manufacturing.

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