LCMXO2-7000ZE-2TG144I

The LCMXO2-7000ZE-2TG144I is a MachXO2 family FPGA from Lattice Semiconductor, delivered in a 144-pin LQFP package for surface-mount assembly. This industrial-grade device provides 6,864 logic elements, 114 user I/Os and approximately 245,760 bits of on-chip RAM, making it suitable for control, glue-logic and mid-density FPGA tasks.

Designed for low-power embedded systems, the device operates from a 1.14 V to 1.26 V supply and across an industrial temperature range of −40°C to 100°C. It combines reconfigurable logic, embedded memory and on-chip non-volatile flash for single-chip, instant-on system designs.

Key Features

• Logic Capacity – 6,864 logic elements (LUT-based) for mid-density combinational and sequential logic implementation.
• I/O Count and Flexibility – 114 user I/Os in a 144-LQFP package; programmable sysIO buffer architecture supports a broad set of interface options.
• Embedded Memory – Approximately 245,760 bits of embedded RAM and on-chip User Flash Memory (family support up to 256 kbits) for code, configuration and data storage.
• Low Power Process – Built on an advanced low-power process with standby and power-saving options suited to energy-conscious applications.
• High-Performance I/O and Memory Interfaces – Family features include DDR register support in I/Os, dedicated gearing for display I/Os and support for DDR/DDR2/LPDDR memory interfaces.
• Programmability and Reconfiguration – Non-volatile, reconfigurable device with instant-on capability; supports programming via JTAG, SPI and I²C and in-field TransFR reconfiguration for live updates.
• Clocking and PLLs – Up to two PLLs per device (family) with fractional-N synthesis and multiple primary clocks for flexible clocking schemes.
• Package and Mounting – 144-LQFP (144-TQFP 20×20) surface-mount package, RoHS compliant and specified for industrial operation.
• Temperature and Supply – Specified operating temperature −40°C to 100°C and voltage supply range 1.14 V to 1.26 V.

Typical Applications

• Display and Video Interfaces – Utilize pre-engineered source-synchronous I/O and display gearing to implement display bridging and timing control.
• Memory Interface Control – Implement DDR/DDR2/LPDDR interface logic with dedicated I/O DDR registers and DQS support for external memory peripherals.
• Peripheral and Bus Bridging – Hardened on-chip functions (SPI, I²C, timer/counter) and flexible I/Os simplify peripheral aggregation and protocol bridging.
• System Control and Security – On-chip User Flash Memory and instant-on reconfiguration enable single-chip control, boot management and secure configuration storage.

Unique Advantages

• Integrated Mid-Density Logic: 6,864 logic elements combined with on-chip RAM provide a compact platform for control and glue-logic without external FPGA resources.
• Wide I/O Versatility: 114 programmable I/Os and sysIO buffer support for a range of signaling standards reduce the need for external level translators.
• Non-Volatile, Instant-On: On-chip user flash and instant-on capability enable rapid system boot and in-field updates without external configuration memory.
• Industrial Temperature Range: Specified −40°C to 100°C operation supports deployment in temperature-demanding environments.
• Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) suited to designs targeting single-supply, low-voltage domains.
• On-Board System Features: Built-in SPI, I²C, timers/counters and trace ID support system-level functions and tracking without additional components.

Why Choose LCMXO2-7000ZE-2TG144I?

The LCMXO2-7000ZE-2TG144I positions itself as a compact, industrial-grade FPGA option for designers who need mid-range logic capacity, flexible high-speed I/O and embedded non-volatile configuration in a 144-LQFP surface-mount package. Its combination of approximately 245,760 bits of on-chip RAM, 6,864 logic elements and 114 I/Os delivers integration that can reduce board-level complexity and BOM count.

With family-proven features such as DDR-capable I/Os, programmable sysIO buffers, on-chip flash and instant-on reconfiguration, this MachXO2 device is well suited for embedded control, interface bridging and system management applications where reliable operation across −40°C to 100°C and low-power behavior are required.

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