LCMXO2-7000ZE-3BG256I

The LCMXO2-7000ZE-3BG256I is a MachXO2 series FPGA from Lattice Semiconductor Corporation featuring 6,864 logic elements and extensive on-chip memory. Designed as a low-power, non-volatile programmable logic device, it targets system control, I/O bridging and memory/display interface tasks in industrial designs where compact package, broad I/O capability and reliable operation across a wide temperature range are required.

Key Features

• Core Logic — 6,864 logic elements (LUT-based architecture) to implement glue logic, control state machines and mid-density custom logic functions.
• Embedded Memory — 245,760 total RAM bits of on-chip memory plus support for on-chip user flash memory (up to 256 kbits in the MachXO2 family) for configuration and data storage.
• I/O and Interfaces — 206 I/Os with programmable sysIO buffer support across multiple standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus-LVDS and others), plus on-chip differential termination and programmable pull modes.
• Power — Operates from a core supply range of 1.14 V to 1.26 V; family features include ultra low-power operation with standby modes (as low as 22 μW standby power noted in the MachXO2 family data).
• Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device for fractional-N frequency synthesis and wide input frequency support.
• Non-volatile Configuration — Instant-on, single-chip non-volatile architecture with in-field reconfiguration (TransFR) and support for programming via JTAG, SPI and I²C interfaces.
• Package & Mounting — Surface mount 256-LFBGA package (supplier device package: 256-CABGA 14 × 14 mm) for compact board integration.
• Industrial Temperature — Rated for -40 °C to 100 °C operation, suitable for industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement real-time control logic, protocol bridging and deterministic I/O handling across wide temperature ranges.
• Display and Memory Interfaces — Use pre-engineered source-synchronous I/O, DDR gearing and dedicated I/O registers for interfacing displays and external memory subsystems.
• Embedded System Glue Logic — Replace discrete glue components with a single reconfigurable device for board-level integration and BOM reduction.
• Secure Configuration & Field Updates — Non-volatile configuration and TransFR reconfiguration enable firmware updates and in-field logic changes without external flash in many use cases.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 6,864 logic elements with substantial on-chip RAM (245,760 bits) and family UFM capability to consolidate functions on a single device.
• Broad, Programmable I/O: 206 configurable I/Os with support for numerous signaling standards reduce the need for external level translators and simplify multi-voltage system interfaces.
• Low-Power Operation: Core supply range of 1.14–1.26 V and family-level standby modes enable reduced power draw in always-on and low-power applications.
• Robust Industrial Operation: Surface-mount 256-LFBGA package and -40 °C to 100 °C rating support deployment in industrial environments.
• Non-Volatile, Field-Updatable: Instant-on non-volatile configuration with JTAG/SPI/I²C programming and in-field reconfiguration capabilities streamline development and maintenance.
• Compact Packaging: 256-ball BGA options provide a high I/O count in a small footprint for space-constrained PCBs.

Why Choose LCMXO2-7000ZE-3BG256I?

The LCMXO2-7000ZE-3BG256I delivers a balanced mix of mid-range logic capacity, embedded memory and high-density I/O in a low-power, non-volatile FPGA package from Lattice Semiconductor Corporation. Its combination of 6,864 logic elements, 245,760 bits of on-chip RAM, flexible I/O signaling and industrial temperature rating makes it well suited for industrial control, interface bridging, and embedded system consolidation where reliable operation and field update capability are important.

Engineers and procurement teams will find this device appropriate for designs that require reduced BOM complexity, reconfigurability in the field, and a compact BGA footprint without sacrificing I/O flexibility or memory resources.

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