LCMXO2-7000ZE-3FG484I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA |
|---|---|
| Quantity | 1,283 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 334 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-3FG484I – MachXO2 Field Programmable Gate Array (FPGA), 6864 Logic Elements, 334 I/Os, 484‑BBGA
The LCMXO2-7000ZE-3FG484I is a MachXO2 family FPGA optimized for low-power, system-level glue logic and I/O-rich applications. It provides a flexible 65 nm FPGA architecture with 6864 logic elements, approximately 240 kbits of embedded RAM, and up to 334 user I/Os in a 484‑ball BGA (23 × 23 mm) package—targeted at industrial-grade designs that require broad I/O support, non-volatile configuration and extended operating temperature.
Key Features
- Core Logic — 6864 logic elements (LUT4-based architecture) to implement combinational and sequential logic for medium-density system functions.
- Embedded Memory — Total on-chip RAM of 245,760 bits (approximately 240 kbits) plus on-chip user flash memory (up to 256 kbits) for configuration and data storage.
- I/O Density & Flexibility — 334 user I/Os with programmable sysIO buffers supporting a wide range of interfaces including multiple LVCMOS levels, LVTTL, PCI and multiple differential standards such as LVDS and LVPECL; on‑chip differential termination and hot-socketing support are included in the family feature set.
- Power & Low-Power Modes — Advanced low-power design with standby power as low as 22 μW and programmable power-saving options to minimize system standby consumption.
- Clocking & PLLs — Multiple primary clocks with on-chip PLL capability (up to two analog PLLs per device) for flexible clock synthesis and timing control.
- Reconfiguration & Non-Volatile Operation — Instant-on non-volatile configuration with in-field TransFR reconfiguration and background programming; supports JTAG, SPI and I²C programming interfaces.
- System-Level Support — Hardened peripherals including SPI, I²C, timers/counters, on-chip oscillator and IEEE 1149.1 boundary-scan support for system integration and debug.
- Package & Temperature — 484‑BBGA (supplier package: 484‑FBGA, 23 × 23 mm), surface-mount mounting; industrial-grade operating range from -40 °C to 100 °C.
- Supply Voltage & Compliance — Single-core voltage range of 1.14 V to 1.26 V and RoHS compliant.
Typical Applications
- Industrial Control and Automation — Implement I/O bridging, deterministic glue logic and timing-critical control functions within industrial systems using the extended -40 °C to 100 °C operating range.
- Interface and Protocol Conversion — Bridge disparate bus standards and provide protocol conversion leveraging the large I/O count and programmable sysIO buffers.
- Embedded System Glue Logic — Replace discrete logic and CPLDs for board-level sequencing, reset control, and peripheral management using non-volatile instant-on configuration.
- Memory and Display Interfaces — Support for source-synchronous DDR and dedicated gearing for display I/Os enables implementation of memory interfaces and display controllers within constrained BOM and board area.
Unique Advantages
- High I/O Capacity with Flexible Signaling: 334 I/Os and programmable sysIO buffers reduce external interface components and simplify multi-standard designs.
- Non-Volatile Instant-On: On-chip user flash and instant-on configuration eliminate external configuration memories and shorten system boot time.
- Low Standby Power: Standby power down to 22 μW enables energy-efficient always-on functions and low-power standby modes.
- Industrial Temperature Range: Rated for -40 °C to 100 °C, suitable for demanding environmental conditions without added thermal qualification notes.
- System-Level Integration: Hardened SPI, I²C, timers and oscillator reduce software overhead and external components for common control tasks.
- Compact, High-Density Package: 484‑ball BGA (23 × 23 mm) provides a high pin-count, surface-mount solution for space-constrained boards.
Why Choose LCMXO2-7000ZE-3FG484I?
This MachXO2 device balances substantial logic capacity and embedded memory with an industry-grade operating range and extensive I/O flexibility. It is well suited for engineers who need a compact, non-volatile FPGA to consolidate glue logic, interface bridging and system control functions while minimizing external components and standby power.
Selected for designs requiring scalable logic, robust system features and programmable I/O standards, the LCMXO2-7000ZE-3FG484I provides long-term value through in-field reconfiguration, on-chip flash and a feature set focused on board-level integration and reliability.
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