LCMXO2-7000ZE-3TG144I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP |
|---|---|
| Quantity | 579 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 114 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-3TG144I – MachXO2 Field Programmable Gate Array (FPGA), 114 I/Os, 6,864 logic elements
The LCMXO2-7000ZE-3TG144I is a MachXO2 family FPGA IC from Lattice Semiconductor Corporation providing 6,864 logic elements and 114 general-purpose I/Os in a 144-pin LQFP package. Designed for industrial-grade applications, this device offers on-chip embedded memory, reconfigurable non-volatile flash capability and flexible I/O and clocking options for glue-logic, interface bridging and system-control roles.
Key Features
- Logic Capacity 6,864 logic elements (cells) to implement glue logic, state machines and moderate-density programmable functions.
- Embedded Memory 245,760 total RAM bits of on-chip memory for distributed and block RAM usage; MachXO2 family devices also offer on-chip user flash memory options for non-volatile configuration.
- I/O Flexibility 114 I/Os with programmable sysIO buffer support for multiple interface standards; on-chip differential termination and programmable pull-up/pull-down modes are supported at the family level.
- Low-Power Operation Built on an advanced low-power process with family-level standby power as low as 22 µW and multiple power-saving modes.
- Clocking and PLLs Flexible on-chip clocking with eight primary clocks and up to two analog PLLs per device (family feature) for fractional-n frequency synthesis and wide input frequency range.
- Reconfigurability and Non-Volatile Storage Instant-on, single-chip non-volatile configuration; supports in-field updates (TransFR) and background programming via JTAG, SPI or I2C (family features).
- Hardened System Functions On-chip SPI, I2C and timer/counter primitives plus an on-chip oscillator (~5.5% accuracy) and unique TraceID for system tracking (family features).
- Package & Mounting 144-LQFP (supplier device package: 144-TQFP, 20×20 mm) surface-mount package suitable for industrial PCBs.
- Electrical & Environmental Supply voltage range 1.14 V to 1.26 V; operating temperature range −40 °C to 100 °C; RoHS compliant; industrial grade.
Typical Applications
- Display and Video I/O Pre-engineered source-synchronous I/O and dedicated gearing support at the family level enable display-interface and user-interface timing applications.
- Memory Interface Glue Family-level DDR/DDR2/LPDDR support and dedicated FIFO control logic help implement intermediate buffering and memory interface functions.
- System Control and Supervisory Logic On-chip timers, counters, SPI and I2C primitives plus non-volatile configuration make the device suitable for system supervision and control tasks in industrial equipment.
- Field Updatable Logic TransFR reconfiguration and background programming allow in-field logic updates while the system remains operational.
Unique Advantages
- Compact, reconfigurable system integration: Combines 6,864 logic elements with embedded RAM and non-volatile configuration to reduce external components and BOM complexity.
- Wide I/O versatility: 114 programmable I/Os and family-level support for multiple signaling standards simplify interface consolidation across subsystems.
- Instant-on, non-volatile operation: Single-chip, flash-based configuration enables fast startup and eliminates the need for external configuration memories in many designs.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments.
- In-field update capability: TransFR reconfiguration and background programming allow safe logic updates without full system downtime.
Why Choose LCMXO2-7000ZE-3TG144I?
The LCMXO2-7000ZE-3TG144I positions itself as a flexible, industrial-grade FPGA option for designs that require moderate logic density, substantial on-chip memory, and broad I/O flexibility in a compact 144-LQFP package. Its non-volatile, instant-on configuration and family-level low-power features simplify system architecture and reduce the need for external configuration components.
This device is well suited to engineers building control, interface or display subsystems that benefit from reconfigurable logic, in-field updates and a robust operating temperature range. Family-level system primitives and clocking resources provide additional integration points that help shorten development and deployment timelines.
Request a quote or submit a purchasing inquiry to obtain pricing, availability and technical support for the LCMXO2-7000ZE-3TG144I.

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