LCMXO2280C-3B256I

The LCMXO2280C-3B256I is a MachXO family FPGA offering non-volatile, instant-on programmable logic with a balance of I/O capacity and on-chip memory. It combines 2,280 logic elements and approximately 28,262 bits of embedded memory with 211 I/O pins in a 256-ball caBGA package, making it suitable for control, glue-logic and interface tasks in industrial systems.

Its architecture supports single-chip, reconfigurable logic with in-field update capability and low-power modes, enabling designers to consolidate discrete glue logic and control functions while meeting industrial operating ranges and voltage requirements.

Key Features

• Core Logic – 2,280 logic elements provide flexible LUT-based logic for glue logic, control paths, and protocol bridging.
• On-Chip Memory – Approximately 28,262 bits of total RAM for embedded and distributed memory use, plus dedicated FIFO control logic from the MachXO family architecture.
• I/O Capacity – 211 I/O pins available in the 256-ball caBGA (14×14 mm) package to support a broad mix of peripheral and bus interfaces.
• Non-Volatile, Instant-On – Family-level non-volatile memory enables instant-on operation and single-chip configuration with no external configuration memory required.
• Reconfiguration and Programming – Supports in-field reconfiguration and background programming of non-volatile memory through standard programming interfaces as described for the MachXO family.
• Clocking – MachXO family devices support up to two analog PLLs per device for clock multiply, divide, and phase shifting.
• Supply Voltage – Operates across a wide supply range (1.71 V to 3.465 V) to accommodate mixed-voltage systems.
• Package & Mounting – Surface-mount 256-LFBGA (256-CABGA, 14×14 mm) package for compact board integration.
• Industrial Temperature Range – Rated for –40 °C to 100 °C operation, suitable for industrial environments.
• Standards & System Features – Family-level support includes IEEE 1149.1 boundary scan and IEEE 1532 in-system programming compliance.

Typical Applications

• Glue Logic and Control – Replace discrete logic and microcontroller ancillary glue with compact, reconfigurable logic for board-level control and sequencing.
• Bus Bridging and Interfacing – Implement protocol translation, bus isolation, and interface adaptation using the device’s plentiful I/O and programmable logic.
• Power-Up and System Control – Manage power sequencing, reset logic, and system supervisory tasks leveraging instant-on and single-chip non-volatile configuration.
• Peripheral Aggregation – Aggregate multiple sensor or peripheral interfaces and perform deterministic control without external configuration memory.

Unique Advantages

• Instant-On Non-Volatile Configuration – Single-chip, non-volatile memory removes the need for external configuration storage and enables immediate operation after power-up.
• High I/O-to-Logic Density – 211 I/Os paired with 2,280 logic elements allow efficient integration of interface logic and control functions on one device, reducing system BOM.
• Flexible Voltage Support – Broad supply range (1.71 V to 3.465 V) helps integrate the device into multi-voltage systems without complex power signaling.
• Industrial Temperature Rating – Specified for –40 °C to 100 °C to meet industrial environmental requirements.
• Field Reconfiguration – Supports in-field updates and background programming to enable design iteration and feature upgrades after deployment.
• Compact Package – 256-ball caBGA (14×14 mm) delivers high pin count in a compact footprint for space-constrained boards.

Why Choose LCMXO2280C-3B256I?

The LCMXO2280C-3B256I positions itself as a practical, single-chip solution for designers needing reconfigurable logic with substantial I/O and embedded memory in industrial applications. Its combination of approximately 2,280 logic elements, ~28,262 bits of on-chip RAM, and 211 I/O pins in a 256-ball caBGA package simplifies system design and reduces component count.

Engineers targeting control, interfacing, and glue logic roles will find the MachXO family capabilities—non-volatile instant-on configuration, in-field reconfiguration, and industrial temperature support—deliver long-term flexibility and robustness for deployed systems.

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