LCMXO2-7000ZE-3TG144C

The LCMXO2-7000ZE-3TG144C is a MachXO2 family FPGA from Lattice Semiconductor Corporation designed for flexible, low-power logic integration. With 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and 114 user I/Os in a 144-pin LQFP package, it targets designs that require instant-on, non-volatile configuration and a wide range of I/O options.

Built on the MachXO2 architecture, this device delivers embedded memory, on‑chip user flash and programmable I/O capabilities suitable for control, glue logic, and system interface functions in commercial-grade applications.

Key Features

• Core Logic — 6,864 logic elements provide flexible LUT-based logic resources for glue logic, control, and custom peripheral functions.
• Embedded Memory — Approximately 245,760 bits (~240 kbits) of embedded RAM and family support for up to 256 kbits of on-chip user flash memory for configuration and non-volatile storage.
• I/O Capacity & Flexibility — 114 user I/Os in a 144-pin LQFP (supplier package: 144-TQFP 20×20) supporting a broad range of interfaces and enabling dense external connectivity.
• Low Power Architecture — MachXO2 family low-power process and standby modes reduce system power consumption; device supply voltage specified at 1.14 V to 1.26 V.
• Clocking & PLLs — Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device for fractional-n synthesis and varied input frequency support.
• Non-volatile Configuration — On-chip user flash accessible via standard interfaces for instant-on operation and in-field reconfiguration options.
• Package & Mounting — Surface-mount 144-LQFP package (144-TQFP 20×20 supplier variant) for compact PCB implementations; commercial grade with operating temperature 0 °C to 85 °C.

Typical Applications

• System Glue Logic — Replace discrete logic and simplify board-level design by consolidating control and interfacing functions into a single FPGA device.
• Interface Bridging — Implement custom I/O translation, level shifting and protocol adaptation using the device’s flexible I/O and embedded memory resources.
• Configuration & Control — Use on-chip flash and embedded RAM for secure configuration storage, background programming and in-field updates.
• Pre‑Engineered I/O Functions — Deploy source-synchronous and DDR-capable I/O features for display, memory controller pre‑engineering, and high-speed peripheral interfaces.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 6,864 logic elements with substantial embedded RAM to reduce external components and simplify BOM.
• Non-volatile, Instant-on Capability: On-chip user flash enables single-chip, secure, instantly configured designs without external configuration memory.
• Broad I/O Flexibility: 114 user I/Os in a compact LQFP package support diverse interface standards and dense connectivity options.
• Low Power Operation: Family-level low-power process and standby modes help minimize system idle power draw while retaining instant-on behavior.
• Field Reconfigurability: Supports in-field logic updates and background programming to extend product lifetime and enable post-deployment fixes.

Why Choose LCMXO2-7000ZE-3TG144C?

This MachXO2 device balances programmable logic density, embedded memory and flexible I/O in a commercial-grade, surface-mount 144-LQFP package. It is suited to designers who need non-volatile configuration, low-power standby capability, and the ability to consolidate multiple discrete functions into a single, reconfigurable device.

With manufacturer-provided family features such as on-chip flash, multiple PLLs and a wide range of programmable I/O options, the LCMXO2-7000ZE-3TG144C offers a scalable, supportable platform for control, interface and system integration tasks in commercial applications.

Request a quote or submit a product inquiry to evaluate the LCMXO2-7000ZE-3TG144C for your next design.