LCMXO2-7000ZE-3FTG256I

The LCMXO2-7000ZE-3FTG256I is a MachXO2 field-programmable gate array (FPGA) in a 256-ball BGA package designed for industrial applications. It combines a flexible logic architecture with embedded and distributed on-chip memory, a broad range of programmable I/O options and non-volatile user flash to enable instant-on, reconfigurable system designs.

This device is targeted at applications requiring mid-density programmable logic and extensive I/O connectivity, delivering integration and low-power operation in an industrial temperature range.

Key Features

• Core Logic: Approximately 6,864 logic elements for implementing glue logic, control functions and custom processing pipelines.
• Embedded and Distributed Memory: Total on-chip RAM of 245,760 bits (approximately 240 kbits) plus distributed RAM resources for FIFOs and buffering.
• On-Chip Flash: Non-volatile user flash memory (family support up to 256 kbits) for single-chip, infinitely reconfigurable designs and background programming.
• I/O Capacity and Flexibility: 206 I/Os with programmable sysIO buffer support and on-chip differential termination options suitable for a wide range of interfaces.
• Power and Low-Power Modes: Advanced low-power process with micro-watt standby options and programmable power-saving modes.
• Clocking and PLLs: Multiple primary clocks and up to two analog PLLs supporting fractional-n synthesis and wide input frequency ranges for flexible timing and clock-domain management.
• Reconfiguration and System Functions: Instant-on non-volatile behavior, TransFR in-field reconfiguration, JTAG/SPI/I2C programming interfaces, and hardened peripherals such as SPI, I2C and timer/counter blocks.
• Package, Voltage and Temperature: Surface-mount 256-ball package (listed as 256-LBGA / 256-FTBGA 17×17), supply voltage range 1.14 V to 1.26 V, and industrial operating temperature from −40 °C to 100 °C.

Typical Applications

• Industrial Control and Automation: Use as configurable logic and I/O expansion where extended temperature range and industrial-grade qualification are required.
• Display and Video Interfaces: Pre-engineered source-synchronous I/O features and gearing support make the device suitable for display bridging and timing-critical I/O.
• Memory Interface Bridging: Dedicated DDR/DDR2/LPDDR memory support and DDR registers in I/O cells enable use as memory interface logic and protocol adaptation.
• System Glue Logic and Peripheral Offload: On-chip flash and abundant I/O allow consolidation of peripheral interfaces, protocol converters and system control functions.

Unique Advantages

• High integration in a single chip: Combines logic, embedded RAM and non-volatile user flash to reduce BOM and simplify board-level design.
• Wide I/O capability: 206 programmable I/Os with on-chip differential termination and multiple I/O standards reduce external interface components.
• Low-voltage operation: Single supply operation in the 1.14 V–1.26 V range supports low-power system architectures.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Reconfigurable and secure: Instant-on non-volatile configuration, background programming and TransFR reconfiguration enable field updates and flexible lifecycle management.
• Embedded system utilities: Built-in SPI, I2C, timers and PLLs simplify integration of common system functions without additional silicon.

Why Choose LCMXO2-7000ZE-3FTG256I?

The LCMXO2-7000ZE-3FTG256I positions itself as a mid-density, industrial-grade FPGA that balances logic capacity, extensive I/O and on-chip memory with non-volatile configuration. Its combination of approximately 6,864 logic elements, roughly 245,760 bits of embedded RAM, and programmable I/Os makes it suitable for embedded systems that need reliable, reconfigurable logic and broad interface support.

This device is a practical choice for engineers designing industrial control, display interfacing, memory bridging or system glue logic who require instant-on behavior, field reconfiguration and a compact BGA package. The integrated system functions and programmable interfaces support long-term design flexibility and simplified board-level integration.

Request a quote or submit a product inquiry for LCMXO2-7000ZE-3FTG256I to evaluate fit for your next design and obtain availability and pricing details.