LCMXO2-7000ZE-3BG332I

The LCMXO2-7000ZE-3BG332I is a MachXO2 family FPGA: a low-power, non-volatile programmable logic device tailored for high I/O density and system control functions. It delivers approximately 6,864 logic elements and 278 I/Os in a compact 332-ball FBGA package for embedded and industrial designs.

Designed for applications that require flexible interfacing, instant-on configuration and in-field reconfiguration, this industrial-grade device operates over a -40 °C to 100 °C range and accepts a core supply between 1.14 V and 1.26 V.

Key Features

• Core Logic  Approximately 6,864 logic elements provide programmable LUT4-based logic capacity for mid-density control and glue-logic tasks.
• Memory  Approximately 245,760 bits of on-chip RAM (embedded block and distributed RAM capacity in the family) and up to 256 kbits of on-chip user flash memory for non-volatile storage and configuration.
• I/O Density & Flexibility  278 user I/Os with programmable sysIO buffer support for multiple standards, on-chip differential termination and hot-socketing capability to simplify board-level design.
• Ultra Low Power  Family-level low-power architecture including microsecond instant-on and standby modes (family documentation cites standby power levels as low as 22 μW), reducing system power consumption.
• Clocking & Timing  Multiple primary clocks (eight) and up to two analog PLLs per device for flexible clocking, frequency synthesis and source-synchronous I/O support.
• Pre-Engineered Interfaces  Built-in source-synchronous I/O features, DDR register support, dedicated gearing for display I/Os and dedicated memory interface logic (DDR/DDR2/LPDDR with DQS support) as provided by the MachXO2 family.
• On-Chip Configuration & Peripherals  Non-volatile, infinitely reconfigurable architecture with background programming, TransFR in-field reconfiguration, and support for JTAG, SPI and I²C programming; on-chip SPI, I²C and timer/counter peripherals included at the family level.
• Package & Environmental  332-ball FBGA (supplier package: 332-CABGA, 17 × 17 mm), surface-mount mounting, industrial grade operation from -40 °C to 100 °C, and RoHS compliant.

Typical Applications

• Industrial Control & Automation  High I/O count and industrial temperature range make the device suitable for interface bridging, sensor aggregation and real-time control logic.
• Display & Video Interfaces  Pre-engineered gearing and source-synchronous I/O with DDR register support enable display timing management and high-speed panel interfacing.
• Memory Interface & Buffering  Dedicated FIFO control logic and DDR memory support allow use as a bus bridge or buffer between processors and external memory subsystems.
• Embedded System Glue Logic  Non-volatile, instant-on configuration with on-chip user flash and peripheral controllers (SPI, I²C, timers) simplifies board-level integration and reduces BOM.

Unique Advantages

• High I/O Integration: 278 I/Os enable complex interfacing without multiple external translators or GPIO expanders, reducing component count and board complexity.
• Non-Volatile Instant-On: On-chip user flash and instant-on architecture provide single-chip configuration and fast system startup without external configuration memory.
• Low Standby Power: Family-level low-power modes (standby power as low as 22 μW) support energy-conscious designs and reduce overall system power consumption.
• Robust Clocking: Eight primary clocks and up to two analog PLLs provide flexible clock management for mixed-speed interfaces and synchronization tasks.
• Industrial Reliability: Qualified for operation from -40 °C to 100 °C and supplied in a compact 332-FBGA package, supporting demanding embedded and industrial environments.
• Field Reconfiguration: TransFR in-field update capability allows logic updates while the system is operating, enabling remote feature additions and bug fixes.

Why Choose LCMXO2-7000ZE-3BG332I?

The LCMXO2-7000ZE-3BG332I positions itself as a versatile, mid-density FPGA solution for designs that require high I/O counts, non-volatile configuration and low-power operation in industrial environments. Its combination of approximately 6,864 logic elements, substantial on-chip RAM and user flash, and family-provided interface and clocking features make it well suited for embedded control, interface bridging, display timing and memory buffering tasks.

Engineers looking to simplify board-level integration, shorten boot time and retain the ability to update logic in the field will find the MachXO2 family capabilities directly accessible in this industrial-grade, surface-mount 332-FBGA package from Lattice Semiconductor Corporation.

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