LCMXO2-7000ZE-3BG332C

The LCMXO2-7000ZE-3BG332C is a MachXO2 family field programmable gate array (FPGA) device offering 6,864 logic elements and an extensive I/O count in a compact 332-ball package. It combines flexible logic, embedded memory, on-chip non-volatile flash and programmable I/O to address glue-logic, system control and interface aggregation in commercial embedded designs.

Designed for low-power, instant-on operation, this device targets applications that require a high I/O density, embedded SRAM and field reconfiguration while operating within commercial temperature and supply ranges.

Key Features

• Core Logic – 6,864 logic elements (LUT4-based architecture) for implementing combinational and sequential logic functions in a compact FPGA.
• Embedded Memory – Approximately 245,760 bits of on-chip RAM (sysMEM embedded block RAM and distributed RAM) for buffering, FIFOs and local data storage.
• On-Chip User Flash & Reconfiguration – Non-volatile user flash memory with support for background programming, dual-boot options and in-field TransFR reconfiguration for updates while the system operates.
• I/O Density & Flexibility – 278 user I/Os with programmable sysIO buffer support and on-chip differential termination for a wide range of serial and parallel interfaces.
• Clocking & PLLs – Multiple primary clocks and up to two analog PLLs with fractional-N synthesis for flexible clock generation and high-speed I/O timing.
• Low Power – Advanced low-power process technology with standby power as low as 22 μW and programmable power-saving modes.
• Package & Mounting – Surface-mount 332-FBGA package (supplier device package: 332-CABGA, 17 × 17 mm) for high I/O density in a compact footprint.
• Operating Conditions – Commercial grade with supply voltage range of 1.14 V to 1.26 V and operating temperature range of 0 °C to 85 °C.
• System-Level Functions – Embedded peripherals including SPI, I2C, timer/counter and an on-chip oscillator to reduce external components and simplify system integration.
• Compliance – RoHS compliant.

Typical Applications

• Display and Video Interfaces – Pre-engineered source-synchronous I/O and display gearing support for implementing display controllers and timing gear for panel interfaces.
• Memory Interface and Buffering – Dedicated DDR/DDR2/LPDDR support, DDR registers in I/O cells and on-chip FIFO control logic for memory interface buffering and gear reduction.
• System Control and Peripheral Bridging – On-chip SPI, I2C and timer/counter blocks make the device suitable for control, boot management and bridging between subsystems.
• Field-Updatable Logic – Non-volatile flash and TransFR reconfiguration enable in-field logic updates and background programming for deployed systems.

Unique Advantages

• High I/O Count in a Compact Package: 278 user I/Os in a 332-ball caBGA (17×17 mm) package enable dense interface consolidation without a large board footprint.
• Embedded Memory Resources: Approximately 245,760 bits of on-chip RAM provide local buffering and FIFO capability that reduce dependence on external memory.
• Non-Volatile, Instant-On Operation: On-chip user flash delivers instant-on behavior and supports background programming and dual-boot strategies for flexible system startup.
• Flexible, High-Performance I/O: Programmable sysIO buffers, differential termination and DDR support simplify interfacing to modern high-speed peripherals and displays.
• Low Standby Power: Advanced low-power process and power-saving modes help reduce system idle power consumption.
• Built-In System Functions: Integrated SPI, I2C, timers and an oscillator reduce BOM and simplify common control and monitoring tasks.

Why Choose LCMXO2-7000ZE-3BG332C?

The LCMXO2-7000ZE-3BG332C positions itself as a versatile, commercial-grade FPGA for embedded systems that require high I/O density, on-chip embedded memory and field-update capability. Its combination of non-volatile user flash, flexible clocking and dedicated I/O features makes it well suited for designs that need rapid power-up, reliable configuration and in-field reprogramming.

This device is appropriate for engineering teams building compact, low-power systems that benefit from integrated peripherals (SPI, I2C, timers) and advanced I/O support. The MachXO2 family features embedded system-level functions and memory resources that deliver long-term design flexibility and simplified board-level integration.

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