LCMXO2-7000ZE-2TG144C

The LCMXO2-7000ZE-2TG144C is a MachXO2 family FPGA IC offering a flexible logic architecture with 6,864 logic elements and approximately 0.246 Mbits (245,760 bits) of embedded RAM. Built for low-power, single-chip programmable implementations, it delivers a balance of logic capacity, embedded memory and a high-count I/O set in a 144‑LQFP package.

Designed for commercial-grade systems, this device targets designs that require configurable I/O, embedded flash-based configuration, and compact footprint integration where low standby power and on-chip system functions are valued.

Key Features

• Core Logic — 6,864 logic elements suitable for medium-density glue logic, protocol bridging and control functions.
• Embedded Memory — Approximately 0.246 Mbits (245,760 bits) of on-chip RAM for buffering, FIFOs and small data stores; family devices also support embedded block RAM and distributed RAM architectures.
• On‑Chip Nonvolatile Memory — Family supports on-chip user flash memory (up to 256 kbits) for single-chip, infinitely reconfigurable designs and background programming.
• I/O Capacity and Flexibility — 114 I/Os with programmable sysIO buffer support for multiple interface standards, enabling a wide range of signaling options and hot-socketing support.
• Power and Supply — Operates from a core supply range of 1.14 V to 1.26 V with advanced low-power process characteristics and power-saving modes including ultra-low standby power.
• Clocking and PLLs — Multiple primary clocks and up to two analog PLLs per device with fractional‑n synthesis for flexible timing and high-speed I/O clocking.
• Embedded System Functions — Hardened on-chip blocks for SPI, I2C and timer/counter functions, plus an integrated oscillator and TraceID for system tracking.
• Package and Temperature — 144‑LQFP (20 × 20 mm) package, surface-mount, rated for commercial temperature range 0 °C to 85 °C.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the programmable I/O and abundant logic to implement protocol translators, bus bridging and signal conditioning between subsystems.
• System Glue Logic — Integrate control, monitoring and glue logic in a single chip to reduce BOM and board complexity for embedded systems and consumer electronics.
• Memory and Buffer Management — Leverage on‑chip RAM and FIFO control logic for buffering, data staging and small-scale memory functions in I/O-intensive designs.
• Peripheral and Sensor Control — Implement peripheral interfaces, sensor aggregation and timing functions utilizing on-chip timers, I2C/SPI blocks and configurable I/O standards.

Unique Advantages

• Highly Configurable I/O: 114 programmable I/Os with sysIO buffer options let you support many interface standards from a single device, minimizing external components.
• Nonvolatile, Reconfigurable Logic: On-chip user flash enables instant-on behavior and in-field updates without external configuration memory.
• Embedded Memory Capacity: Approximately 0.246 Mbits of on-chip RAM enables local buffering and FIFO implementations without external SRAM.
• Integrated System Blocks: Built-in SPI, I2C and timers reduce design overhead and speed integration of control functions.
• Low-Power Operation: Advanced low-power process and standby power options reduce system idle power consumption.
• Compact, Surface-Mount Package: 144‑LQFP packaging provides a balance of pin count and small PCB footprint for space-constrained designs.

Why Choose LCMXO2-7000ZE-2TG144C?

The LCMXO2-7000ZE-2TG144C positions itself as a flexible, low-power FPGA option for commercial embedded designs that need moderate logic density, significant on-chip RAM and a high number of configurable I/Os in a compact 144‑LQFP package. Its embedded system functions and on‑chip nonvolatile memory simplify system architecture and enable single-chip configuration and updates.

This part is suitable for engineers and teams building configurable interface logic, glue logic, and embedded control where fast integration, reconfigurability and reduced BOM are priorities. The combination of logic capacity, embedded RAM and programmable I/O supports scalable designs and long-term maintainability.

Request a quote or submit a sales inquiry to receive pricing and availability for the LCMXO2-7000ZE-2TG144C. Our team can provide lead-time information and help match the device to your application requirements.