LCMXO2-7000ZE-2FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA |
|---|---|
| Quantity | 1,749 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-2FTG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA
The LCMXO2-7000ZE-2FTG256C is a MachXO2 family FPGA from Lattice Semiconductor designed for low-power, non-volatile logic integration. It provides 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and 206 I/Os in a compact 256-ball BGA package for surface-mount applications.
Targeted at designers needing flexible on-chip logic, connectivity and in-field reconfiguration, this device combines instant-on non-volatile operation, programmable I/O support and integrated system-level peripherals for a wide range of commercial embedded applications.
Key Features
- Logic Capacity — 6,864 logic elements provide substantial programmable logic resources for glue logic, control functions and user-designed accelerators.
- Embedded Memory — Approximately 0.246 Mbits of on-chip RAM for user designs, including embedded block RAM and distributed RAM options.
- I/O Density & Flexibility — 206 user I/Os with programmable sysIO buffer support for multiple standards, enabling a wide range of single-ended and differential interfaces.
- Low-Voltage Core — Operates from a core supply of 1.14 V to 1.26 V, suitable for low-power system designs.
- Ultra Low Power — Built on an advanced 65 nm low-power process with standby power as low as 22 μW and multiple power-saving options.
- Non-Volatile, Instant-On — On-chip user Flash memory with up to 256 kbits and background programming support enables instant-on operation and in-field updates.
- Pre-Engineered High-Speed I/O — Source-synchronous I/O with DDR registers, dedicated gearing and DDR/DDR2/LPDDR support for memory and high-speed interfaces.
- System-Level Peripherals — Built-in SPI, I²C, timer/counter and on-chip oscillator simplify system integration and reduce external component count.
- Package & Mounting — 256-LBGA (supplier package: 256-FTBGA, 17×17) for surface-mount assembly; RoHS compliant.
- Commercial Temperature Range — Rated for 0 °C to 85 °C operation.
Typical Applications
- System Glue Logic — Replace multiple discrete components with programmable logic to consolidate control, address decoding and interface bridging.
- Display and Video Interfaces — Pre-engineered gearing and DDR I/O capabilities help implement source-synchronous display interfaces and data serialization.
- Memory Interface Bridging — Dedicated DDR/DDR2/LPDDR support with DQS handling enables interfacing to external memory subsystems.
- Embedded Control and Peripherals — On-chip SPI, I²C, timers and oscillator support microcontroller offload and peripheral aggregation.
Unique Advantages
- Non-volatile, Reconfigurable Logic: On-chip user Flash provides instant-on operation and supports background programming and in-field updates for long-term flexibility.
- High I/O Count in a Compact Package: 206 I/Os in a 256-ball ftBGA (17×17) package enables dense I/O routing in space-constrained designs.
- Low-Power Operation: Advanced 65 nm low-power process and standby modes deliver ultra-low standby consumption, helping reduce system power budgets.
- Integrated System Features: Built-in SPI, I²C, timer/counter and oscillator reduce external BOM and simplify system design.
- Memory and Performance Balance: Combined embedded block RAM and distributed RAM (total ~0.246 Mbits) with 6,864 logic elements supports complex control and buffering tasks.
- Field Upgradeability: TransFR reconfiguration and background programming enable in-field logic updates without removing the device from the system.
Why Choose LCMXO2-7000ZE-2FTG256C?
This MachXO2 device balances significant programmable logic capacity, on-chip memory and a high I/O count in a compact surface-mount package, making it well suited for commercial embedded systems that require low-power, non-volatile, and field-updatable logic. Integrated system peripherals and pre-engineered I/O capabilities help reduce external components and accelerate development.
For engineers designing control logic, interface bridging, display or memory interfacing, the LCMXO2-7000ZE-2FTG256C offers a scalable, reconfigurable platform with device-level features that support long-term product flexibility and simplified system integration.
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