LCMXO2-7000ZE-2FTG256C

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA

Quantity 1,749 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-2FTG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA

The LCMXO2-7000ZE-2FTG256C is a MachXO2 family FPGA from Lattice Semiconductor designed for low-power, non-volatile logic integration. It provides 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and 206 I/Os in a compact 256-ball BGA package for surface-mount applications.

Targeted at designers needing flexible on-chip logic, connectivity and in-field reconfiguration, this device combines instant-on non-volatile operation, programmable I/O support and integrated system-level peripherals for a wide range of commercial embedded applications.

Key Features

  • Logic Capacity — 6,864 logic elements provide substantial programmable logic resources for glue logic, control functions and user-designed accelerators.
  • Embedded Memory — Approximately 0.246 Mbits of on-chip RAM for user designs, including embedded block RAM and distributed RAM options.
  • I/O Density & Flexibility — 206 user I/Os with programmable sysIO buffer support for multiple standards, enabling a wide range of single-ended and differential interfaces.
  • Low-Voltage Core — Operates from a core supply of 1.14 V to 1.26 V, suitable for low-power system designs.
  • Ultra Low Power — Built on an advanced 65 nm low-power process with standby power as low as 22 μW and multiple power-saving options.
  • Non-Volatile, Instant-On — On-chip user Flash memory with up to 256 kbits and background programming support enables instant-on operation and in-field updates.
  • Pre-Engineered High-Speed I/O — Source-synchronous I/O with DDR registers, dedicated gearing and DDR/DDR2/LPDDR support for memory and high-speed interfaces.
  • System-Level Peripherals — Built-in SPI, I²C, timer/counter and on-chip oscillator simplify system integration and reduce external component count.
  • Package & Mounting — 256-LBGA (supplier package: 256-FTBGA, 17×17) for surface-mount assembly; RoHS compliant.
  • Commercial Temperature Range — Rated for 0 °C to 85 °C operation.

Typical Applications

  • System Glue Logic — Replace multiple discrete components with programmable logic to consolidate control, address decoding and interface bridging.
  • Display and Video Interfaces — Pre-engineered gearing and DDR I/O capabilities help implement source-synchronous display interfaces and data serialization.
  • Memory Interface Bridging — Dedicated DDR/DDR2/LPDDR support with DQS handling enables interfacing to external memory subsystems.
  • Embedded Control and Peripherals — On-chip SPI, I²C, timers and oscillator support microcontroller offload and peripheral aggregation.

Unique Advantages

  • Non-volatile, Reconfigurable Logic: On-chip user Flash provides instant-on operation and supports background programming and in-field updates for long-term flexibility.
  • High I/O Count in a Compact Package: 206 I/Os in a 256-ball ftBGA (17×17) package enables dense I/O routing in space-constrained designs.
  • Low-Power Operation: Advanced 65 nm low-power process and standby modes deliver ultra-low standby consumption, helping reduce system power budgets.
  • Integrated System Features: Built-in SPI, I²C, timer/counter and oscillator reduce external BOM and simplify system design.
  • Memory and Performance Balance: Combined embedded block RAM and distributed RAM (total ~0.246 Mbits) with 6,864 logic elements supports complex control and buffering tasks.
  • Field Upgradeability: TransFR reconfiguration and background programming enable in-field logic updates without removing the device from the system.

Why Choose LCMXO2-7000ZE-2FTG256C?

This MachXO2 device balances significant programmable logic capacity, on-chip memory and a high I/O count in a compact surface-mount package, making it well suited for commercial embedded systems that require low-power, non-volatile, and field-updatable logic. Integrated system peripherals and pre-engineered I/O capabilities help reduce external components and accelerate development.

For engineers designing control logic, interface bridging, display or memory interfacing, the LCMXO2-7000ZE-2FTG256C offers a scalable, reconfigurable platform with device-level features that support long-term product flexibility and simplified system integration.

Request a quote or submit your requirements to get pricing and availability for the LCMXO2-7000ZE-2FTG256C.

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