LCMXO2-7000ZE-2BG332I

The LCMXO2-7000ZE-2BG332I is a MachXO2 family FPGA offering a low-power, highly configurable logic fabric in a compact 332-ball caBGA package. It combines 6,864 logic elements with extensive I/O and on-chip memory to address board-level glue logic, interface bridging, and control functions for industrial embedded systems.

Designed for industrial-grade operation, the device provides multiple power-saving modes, on-chip user flash, and flexible I/O standards—enabling instant-on, reconfigurable implementations where low standby power, deterministic interfacing, and robust temperature range matter.

Key Features

• Logic Capacity  The device includes 6,864 logic elements suitable for medium-density glue logic, protocol adaptation, and control tasks.
• Embedded Memory  Approximately 240 kbits of embedded RAM (245,760 bits total) for FIFOs, buffers, and small-data storage; Distributed RAM resources are also available as part of the family architecture.
• On-Chip User Flash  Up to 256 kbits of user flash memory for non-volatile configuration and field updates, supporting background programming and multiple interface access methods.
• I/O and Interface Flexibility  278 I/Os with programmable sysIO buffer support for wide interface options and source-synchronous DDR features, including dedicated gearing and display-friendly I/O modes.
• Low Power Operation  Built on an advanced low-power process with standby power down to 22 μW and multiple power-saving modes for energy-conscious designs.
• Clocking and PLLs  On-chip clocking includes up to two analog PLLs with fractional-N frequency synthesis and multiple primary clocks for flexible timing architectures.
• Configuration & Reliability  Instant-on architecture with single-chip non-volatile configuration, TransFR reconfiguration for in-field updates, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
• Power, Package & Temperature  Single-supply voltage range of 1.14 V to 1.26 V, surface-mount 332-ball caBGA package (332-CABGA, 17 × 17 mm), and industrial operating temperature range of −40 °C to 100 °C.

Typical Applications

• System Glue Logic  Replace fixed discrete logic with a reconfigurable single-chip solution for protocol translation, bus aggregation, and control sequencing.
• Interface Bridging  Implement board-level interface conversion and timing alignment using the device’s source-synchronous I/O and DDR gearing capabilities.
• Display and Peripheral Control  Drive display interfaces and peripheral timing with dedicated gearing and DDR support for source-synchronous signals.
• Industrial Embedded Control  Provide deterministic control, I/O aggregation, and non-volatile configuration in industrial environments across −40 °C to 100 °C.

Unique Advantages

• Highly integrated logic and I/O: 6,864 logic elements and 278 I/Os reduce external glue components and simplify board designs.
• Non-volatile instant-on capability: On-chip user flash enables single-chip, secure instant-on designs and field reprogramming without external configuration ROM.
• Low standby power: Advanced low-power process and standby modes (as low as 22 μW) minimize energy consumption for always-on systems.
• Flexible interface support: Programmable sysIO buffers and source-synchronous DDR features enable a wide range of signaling standards and timing schemes.
• Industrial temperature rating: Operational range from −40 °C to 100 °C makes the device suitable for demanding embedded environments.
• Single-supply simplicity: Narrow supply range (1.14 V to 1.26 V) supports simplified power architectures for system integration.

Why Choose LCMXO2-7000ZE-2BG332I?

The LCMXO2-7000ZE-2BG332I positions itself as a compact, low-power FPGA solution for medium-density logic integration and robust I/O requirements. With 6,864 logic elements, approximately 240 kbits of embedded RAM, up to 256 kbits of on-chip user flash, and 278 programmable I/Os in a 332-ball caBGA package, it balances integration, configurability, and industrial-grade robustness.

It is well suited to designers seeking a reconfigurable single-chip approach to reduce BOM, enable in-field updates, and deliver deterministic interfacing across industrial temperature ranges—backed by family-level features such as advanced clocking, PLLs, and comprehensive configuration options.

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