LCMXO2280C-3BN256I

The LCMXO2280C-3BN256I is a MachXO family field programmable gate array (FPGA) in a 256-ball LFBGA/CSPBGA package designed for surface-mount applications. It combines non-volatile configuration, reconfigurable logic and embedded memory to address glue logic, bus interfacing, control and power-up sequencing needs in industrial environments.

This device provides 2,280 logic elements, 28,262 bits of on-chip RAM, and 211 user I/Os, while supporting a wide supply voltage range and an industrial operating temperature range for robust system integration.

Key Features

• Core Logic  2,280 logic elements (LUT4-based) for implementing glue logic, control finite-state machines and bus bridging functions.
• On‑chip Memory  Total on-chip RAM of 28,262 bits for embedded data buffering and small lookup tables.
• I/O Capacity & Flexibility  211 user I/Os to support a broad range of external interfaces and peripheral connections.
• Non‑volatile, Instant‑on Configuration  Single-chip, non-volatile configuration delivers instant-on operation and eliminates the need for external configuration memory.
• In-field Reconfiguration (TransFR)  Supports background reconfiguration and in-field logic updates while the system operates.
• Programmable Clocking  Up to two analog PLLs available for clock multiply, divide and phase shifting.
• Power and Voltage  Supports supply voltages from 1.71 V to 3.465 V to accommodate multiple I/O standards and system rails.
• Low‑power Modes  Sleep mode capability enables up to 100× static current reduction for lower system standby power.
• Package & Mounting  Surface-mount 256-LFBGA / CSPBGA (supplier device package: 256-CABGA, 14×14 mm) for compact board designs.
• Industrial Temperature & Compliance  Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial deployments.

Typical Applications

• Glue Logic and System Control  Implement custom control finite-state machines and signal conditioning between system blocks.
• Bus Bridging and Interfacing  Perform protocol adaptation and bus interfacing tasks with abundant I/Os and flexible clocking.
• Power‑up Sequencing and Supervisor Functions  Manage power sequencing and system initialization using instant-on non-volatile configuration.
• Embedded Control and Peripheral Aggregation  Aggregate sensor and peripheral signals and implement local decision logic without external configuration memory.

Unique Advantages

• Single‑chip non‑volatile configuration: Eliminates the need for external configuration memory and enables microsecond-class power-up behavior.
• High I/O to logic density: 211 I/Os paired with 2,280 logic elements simplifies board-level routing and reduces the need for external glue ICs.
• In-field update capability: TransFR reconfiguration and background programming let you update logic while the system continues to operate.
• Flexible power support: Wide supply range (1.71 V–3.465 V) supports multiple I/O standards and mixed-voltage systems.
• Industrial robustness: −40 °C to 100 °C operating range and surface-mount 256-ball package enable deployment in industrial environments.
• Low standby power option: Sleep mode reduces static current by up to 100× for energy-sensitive applications.

Why Choose LCMXO2280C-3BN256I?

The LCMXO2280C-3BN256I positions itself as an integrated, non-volatile FPGA suited for designs that require instant-on behavior, flexible reconfiguration and a balance of logic capacity and I/O count. Its 2,280 logic elements, 28,262 bits of on-chip RAM and 211 I/Os make it a practical choice for glue logic, bus interfacing and embedded control functions in industrial systems.

With support for in-field updates, programmable PLLs and a wide supply voltage and temperature range, this MachXO device offers a compact, RoHS-compliant solution that simplifies BOM and system architecture while providing long-term design flexibility.

Request a quote or submit an inquiry today to get pricing and availability for the LCMXO2280C-3BN256I.