LCMXO2280C-3FT324I

The LCMXO2280C-3FT324I is a MachXO family FPGA offering non-volatile, instant-on logic in a 324-ball LBGA package. It combines a high I/O count with a moderate logic fabric and on‑chip RAM to address glue logic, bus interfacing, power-up control and general control logic in industrial applications.

Built for flexible system integration, the device supports in-field reconfiguration and a broad I/O and voltage range, enabling designers to consolidate functions while meeting industrial temperature and mounting requirements.

Key Features

• Logic Capacity — 2,280 logic elements (cells) for implementing glue logic, bridging and control functions.
• I/O Density — 271 user I/Os to support wide peripheral and bus connectivity in a single device.
• On‑Chip Memory — 28,262 bits of total on‑chip RAM for embedded and distributed memory needs within designs.
• Non‑volatile, Instant‑On Architecture — MachXO family non‑volatile technology provides single‑chip configuration with immediate power‑up operation and no external configuration memory required.
• Reconfiguration & Security — Background programming and in-field reconfiguration capability (TransFR™) with support for JTAG programming and SRAM/non‑volatile updates.
• Clocking — Up to two analog PLLs per device (MachXO family feature) for clock multiplication, division and phase shifting.
• Flexible I/O — Programmable I/O buffers supporting a wide range of interfaces as defined by the MachXO family, enabling LVCMOS and multiple differential standards.
• Power and Temperature — Wide supply range of 1.71 V to 3.465 V and industrial operating range from −40 °C to 100 °C.
• Package & Mounting — 324‑LBGA (supplier package: 324‑FTBGA 19×19) for compact, surface‑mount integration; RoHS compliant packaging.

Typical Applications

• Glue Logic & Bus Bridging — Implement bus interfacing and protocol translation between legacy and modern system buses using the device’s I/O count and logic capacity.
• Power‑Up & Reset Control — Instant‑on non‑volatile configuration makes the device suitable for managing power sequencing and system initialization tasks.
• Control Logic — Replace discrete logic and small CPLDs for board-level state machines, handshaking and control functions.
• Peripheral & Interface Aggregation — High I/O count enables aggregation of multiple sensors, GPIOs and communication endpoints into a single programmable device.

Unique Advantages

• Single‑Chip Non‑Volatile Solution: Eliminates the need for external configuration memory, enabling instant-on operation and simplifying BOM and board layout.
• High I/O-to-Logic Ratio: 271 I/Os paired with 2,280 logic elements lets you maximize board-level connectivity without needing multiple devices.
• Industrial Operating Range: Specified for −40 °C to 100 °C, suitable for demanding environments that require extended temperature tolerance.
• Flexible Powering: Operates across 1.71 V to 3.465 V supply range to match a variety of system power domains.
• Field Update Capability: Supports background and in-field reconfiguration, enabling firmware and logic updates with minimal system disruption.
• Design Tool Support (MachXO Family): Built to work within the MachXO family ecosystem and design flows referenced in the family datasheet for predictable development and migration.

Why Choose LCMXO2280C-3FT324I?

The LCMXO2280C-3FT324I positions itself as a compact, industrial-grade MachXO FPGA option for applications that need immediate, non‑volatile configuration, high I/O density and a moderate logic/memory footprint. Its combination of 2,280 logic elements, approximately 28.3 Kbits of on‑chip RAM and 271 I/Os offers a practical platform for consolidating glue logic, control functions and bus interfacing into a single surface‑mount device.

For teams focused on reliable system startup, flexible in-field updates and simplified BOMs, this MachXO device provides a purpose‑built balance of integration, programmability and industrial operating tolerance while aligning with the family’s design and programming features.

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