LCMXO2280C-3FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 564 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3FTN256C – MachXO FPGA, 2,280 Logic Elements, 211 I/Os, 256-LBGA
The LCMXO2280C-3FTN256C is a MachXO family field-programmable gate array (FPGA) optimized for glue logic, bus interfacing and low-to-medium density control applications. It combines non-volatile instant-on configuration with a LUT-based fabric and embedded memory to deliver flexible, reconfigurable logic in a single surface-mount package.
With 2,280 logic elements, 211 user I/Os and embedded memory resources, this commercial-grade device is aimed at system designers who need fast power-up, secure single-chip configuration and flexible I/O support across a 1.71 V to 3.465 V supply range.
Key Features
- Core Logic 2,280 logic elements for implementing glue logic, bus bridging and control functions with high pin-to-pin performance.
- Embedded Memory Approximately 27.6 Kbits of on-chip RAM (sysMEM/EBR and distributed RAM) for buffering, FIFOs and state storage.
- Non-Volatile, Instant-On Configuration Single-chip non-volatile configuration eliminates the need for external configuration memory and enables microsecond power-up.
- Reconfiguration Supports in-field reconfiguration with fast SRAM updates and background programming of non-volatile memory.
- Flexible I/O Programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling options.
- Clocking Up to two analog PLLs on-device for clock multiply, divide and phase shifting to simplify clock management.
- Low-Power Modes Sleep mode offers substantial static current reduction for power-sensitive applications.
- Packaging & Mounting 256-ball LBGA surface-mount package (supplier package: 256-FTBGA, 17×17 mm) suitable for compact board designs.
- Electrical & Environmental Operates from 1.71 V to 3.465 V and rated for commercial temperature range 0 °C to 85 °C; RoHS compliant.
- System Support Onboard oscillator, IEEE 1149.1 boundary-scan support and IEEE 1532-compliant in-system programming for streamlined development and manufacturing.
Typical Applications
- Interface Bridging Implement protocol translators and bus bridges where flexible I/O standards and moderate logic density are required.
- Control & Sequencing Use for power-up control, reset sequencing and board-level control logic benefiting from instant-on non-volatile configuration.
- Glue Logic Replace discrete gates and CPLDs with a single reconfigurable device to reduce BOM and PCB area.
- User Interfaces & Peripherals Drive custom UI logic, LED control, and peripheral interfacing using abundant I/O and embedded memory for buffering.
Unique Advantages
- Instant-on single-chip solution: Eliminates external configuration memory and enables rapid power-up with secure on-chip configuration.
- Flexible I/O support: Wide range of supported signaling standards reduces the need for level translators and simplifies system integration.
- On-chip memory and PLLs: Embedded RAM and up to two PLLs provide local buffering and clocking resources that simplify board-level design.
- Field reconfigurability: Background programming and SRAM updates allow in-field logic updates without full system downtime.
- Compact surface-mount package: 256-ball LBGA (256-FTBGA 17×17 mm) enables dense, space-constrained layouts while maintaining high I/O count.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream embedded systems.
Why Choose LCMXO2280C-3FTN256C?
The LCMXO2280C-3FTN256C positions itself as a highly integrated, secure and reconfigurable solution for designers needing instant-on behavior, flexible I/O and moderate logic density. Its combination of 2,280 logic elements, roughly 27.6 Kbits of embedded memory, dual PLL capability and a high I/O count makes it suitable for replacing CPLDs and low-capacity FPGAs in control, interfacing and glue-logic roles.
For engineering teams looking to reduce board count and simplify configuration infrastructure while retaining in-field update capability and a broad set of interface options, this MachXO device delivers a practical balance of performance, integration and manufacturability backed by MachXO family design support.
Request a quote or submit an inquiry to purchase the LCMXO2280C-3FTN256C and discuss availability and pricing for your design needs.