LCMXO2280C-3FTN256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 564 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3FTN256C – MachXO FPGA, 2,280 Logic Elements, 211 I/Os, 256-LBGA

The LCMXO2280C-3FTN256C is a MachXO family field-programmable gate array (FPGA) optimized for glue logic, bus interfacing and low-to-medium density control applications. It combines non-volatile instant-on configuration with a LUT-based fabric and embedded memory to deliver flexible, reconfigurable logic in a single surface-mount package.

With 2,280 logic elements, 211 user I/Os and embedded memory resources, this commercial-grade device is aimed at system designers who need fast power-up, secure single-chip configuration and flexible I/O support across a 1.71 V to 3.465 V supply range.

Key Features

  • Core Logic 2,280 logic elements for implementing glue logic, bus bridging and control functions with high pin-to-pin performance.
  • Embedded Memory Approximately 27.6 Kbits of on-chip RAM (sysMEM/EBR and distributed RAM) for buffering, FIFOs and state storage.
  • Non-Volatile, Instant-On Configuration Single-chip non-volatile configuration eliminates the need for external configuration memory and enables microsecond power-up.
  • Reconfiguration Supports in-field reconfiguration with fast SRAM updates and background programming of non-volatile memory.
  • Flexible I/O Programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling options.
  • Clocking Up to two analog PLLs on-device for clock multiply, divide and phase shifting to simplify clock management.
  • Low-Power Modes Sleep mode offers substantial static current reduction for power-sensitive applications.
  • Packaging & Mounting 256-ball LBGA surface-mount package (supplier package: 256-FTBGA, 17×17 mm) suitable for compact board designs.
  • Electrical & Environmental Operates from 1.71 V to 3.465 V and rated for commercial temperature range 0 °C to 85 °C; RoHS compliant.
  • System Support Onboard oscillator, IEEE 1149.1 boundary-scan support and IEEE 1532-compliant in-system programming for streamlined development and manufacturing.

Typical Applications

  • Interface Bridging Implement protocol translators and bus bridges where flexible I/O standards and moderate logic density are required.
  • Control & Sequencing Use for power-up control, reset sequencing and board-level control logic benefiting from instant-on non-volatile configuration.
  • Glue Logic Replace discrete gates and CPLDs with a single reconfigurable device to reduce BOM and PCB area.
  • User Interfaces & Peripherals Drive custom UI logic, LED control, and peripheral interfacing using abundant I/O and embedded memory for buffering.

Unique Advantages

  • Instant-on single-chip solution: Eliminates external configuration memory and enables rapid power-up with secure on-chip configuration.
  • Flexible I/O support: Wide range of supported signaling standards reduces the need for level translators and simplifies system integration.
  • On-chip memory and PLLs: Embedded RAM and up to two PLLs provide local buffering and clocking resources that simplify board-level design.
  • Field reconfigurability: Background programming and SRAM updates allow in-field logic updates without full system downtime.
  • Compact surface-mount package: 256-ball LBGA (256-FTBGA 17×17 mm) enables dense, space-constrained layouts while maintaining high I/O count.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream embedded systems.

Why Choose LCMXO2280C-3FTN256C?

The LCMXO2280C-3FTN256C positions itself as a highly integrated, secure and reconfigurable solution for designers needing instant-on behavior, flexible I/O and moderate logic density. Its combination of 2,280 logic elements, roughly 27.6 Kbits of embedded memory, dual PLL capability and a high I/O count makes it suitable for replacing CPLDs and low-capacity FPGAs in control, interfacing and glue-logic roles.

For engineering teams looking to reduce board count and simplify configuration infrastructure while retaining in-field update capability and a broad set of interface options, this MachXO device delivers a practical balance of performance, integration and manufacturability backed by MachXO family design support.

Request a quote or submit an inquiry to purchase the LCMXO2280C-3FTN256C and discuss availability and pricing for your design needs.

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