LCMXO2280C-3M132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

Quantity 926 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3M132C – MachXO FPGA, 2280 Logic Elements, 101 I/Os, 132-CSPBGA

The LCMXO2280C-3M132C is a MachXO family field programmable gate array (FPGA) offered in a 132-ball CSPBGA (8×8 mm) package. It combines non-volatile configuration, a dense logic fabric and on-chip memory to address glue logic, bus bridging, power-up control and other system control functions.

With 2,280 logic elements, 101 I/Os and embedded memory resources, this surface-mount device targets commercial applications that require instant-on operation, flexible I/O and in-field reconfiguration while operating across a broad supply range and standard commercial temperature window.

Key Features

  • Logic Capacity — 2,280 logic elements (LUT-based architecture) suitable for glue logic, control and bridging functions.
  • I/O and Packaging — 101 user I/Os in a 132-LFBGA / 132-CSPBGA (8×8 mm) package; surface mount for compact board designs.
  • Embedded and Distributed Memory — On-chip memory resources including up to 27.6 Kbits of embedded block RAM and up to 7.7 Kbits of distributed RAM for FIFOs and small data buffers.
  • Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration enables immediate start-up without external configuration memory and supports in-field reconfiguration.
  • Reconfiguration and Low Power — Support for background programming and TransFR™ reconfiguration for in-field logic updates; sleep mode allows significant static current reduction.
  • Clocking — Up to two analog PLLs per device (family-level feature) for clock multiply/divide and phase shifting.
  • Flexible I/O Standards — Programmable I/O buffers support a broad range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS (family-level capability).
  • Supply and Temperature — Operates over a supply range of 1.71 V to 3.465 V and a commercial operating temperature range of 0 °C to 85 °C.
  • Standards and Compliance — RoHS compliant packaging and IEEE 1149.1 boundary-scan support (family-level features).

Typical Applications

  • Glue Logic and System Control — Replaces discrete glue logic with programmable logic to simplify board design and centralize control functions.
  • Bus Bridging and Interfacing — Implements protocol bridging and bus-level interfacing leveraging flexible I/O standards and abundant I/O pins.
  • Power-up and Reset Management — Handles power sequencing, reset distribution and supervisory control using non-volatile instant-on configuration.
  • User Interfaces and Peripheral Control — Manages keypad, LED, sensor and peripheral interfaces with embedded RAM for buffering and PLLs for clock generation.

Unique Advantages

  • Single-chip Non-volatile Configuration: Eliminates the need for external configuration memory and enables microsecond-scale power-up behavior.
  • High I/O-to-Logic Density: 101 I/Os paired with 2,280 logic elements provide a balance of connectivity and logic resources for mid-density designs.
  • On-chip Memory and PLLs: Embedded block RAM and distributed RAM with up to two PLLs support buffering, FIFOs and flexible clocking without external components.
  • In-field Reconfiguration: Background programming and TransFR™ allow updates to logic while the system remains operational, reducing downtime for feature updates.
  • Compact CSPBGA Package: 132-ball CSPBGA (8×8 mm) gives a small footprint for space-constrained designs while maintaining ample I/O.
  • Commercial Temperature and RoHS Compliance: Designed for commercial applications with a 0 °C to 85 °C operating range and lead-free, RoHS-compliant packaging.

Why Choose LCMXO2280C-3M132C?

The LCMXO2280C-3M132C positions itself as a compact, non-volatile FPGA solution for designers needing immediate start-up, flexible I/O and in-field update capability. With 2,280 logic elements, embedded memory and up to two PLLs, it suits mid-density control, interfacing and glue-logic roles in commercial products.

Supported by MachXO family design flows and ispLEVER toolchain compatibility (as provided by the family datasheet), this device offers a practical path from development to deployment while reducing BOM complexity through on-chip memory, clocking and configuration features.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2280C-3M132C and to discuss how it fits your next design.

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