LCMXO2280C-3M132C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 926 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3M132C – MachXO FPGA, 2280 Logic Elements, 101 I/Os, 132-CSPBGA
The LCMXO2280C-3M132C is a MachXO family field programmable gate array (FPGA) offered in a 132-ball CSPBGA (8×8 mm) package. It combines non-volatile configuration, a dense logic fabric and on-chip memory to address glue logic, bus bridging, power-up control and other system control functions.
With 2,280 logic elements, 101 I/Os and embedded memory resources, this surface-mount device targets commercial applications that require instant-on operation, flexible I/O and in-field reconfiguration while operating across a broad supply range and standard commercial temperature window.
Key Features
- Logic Capacity — 2,280 logic elements (LUT-based architecture) suitable for glue logic, control and bridging functions.
- I/O and Packaging — 101 user I/Os in a 132-LFBGA / 132-CSPBGA (8×8 mm) package; surface mount for compact board designs.
- Embedded and Distributed Memory — On-chip memory resources including up to 27.6 Kbits of embedded block RAM and up to 7.7 Kbits of distributed RAM for FIFOs and small data buffers.
- Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration enables immediate start-up without external configuration memory and supports in-field reconfiguration.
- Reconfiguration and Low Power — Support for background programming and TransFR™ reconfiguration for in-field logic updates; sleep mode allows significant static current reduction.
- Clocking — Up to two analog PLLs per device (family-level feature) for clock multiply/divide and phase shifting.
- Flexible I/O Standards — Programmable I/O buffers support a broad range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS (family-level capability).
- Supply and Temperature — Operates over a supply range of 1.71 V to 3.465 V and a commercial operating temperature range of 0 °C to 85 °C.
- Standards and Compliance — RoHS compliant packaging and IEEE 1149.1 boundary-scan support (family-level features).
Typical Applications
- Glue Logic and System Control — Replaces discrete glue logic with programmable logic to simplify board design and centralize control functions.
- Bus Bridging and Interfacing — Implements protocol bridging and bus-level interfacing leveraging flexible I/O standards and abundant I/O pins.
- Power-up and Reset Management — Handles power sequencing, reset distribution and supervisory control using non-volatile instant-on configuration.
- User Interfaces and Peripheral Control — Manages keypad, LED, sensor and peripheral interfaces with embedded RAM for buffering and PLLs for clock generation.
Unique Advantages
- Single-chip Non-volatile Configuration: Eliminates the need for external configuration memory and enables microsecond-scale power-up behavior.
- High I/O-to-Logic Density: 101 I/Os paired with 2,280 logic elements provide a balance of connectivity and logic resources for mid-density designs.
- On-chip Memory and PLLs: Embedded block RAM and distributed RAM with up to two PLLs support buffering, FIFOs and flexible clocking without external components.
- In-field Reconfiguration: Background programming and TransFR™ allow updates to logic while the system remains operational, reducing downtime for feature updates.
- Compact CSPBGA Package: 132-ball CSPBGA (8×8 mm) gives a small footprint for space-constrained designs while maintaining ample I/O.
- Commercial Temperature and RoHS Compliance: Designed for commercial applications with a 0 °C to 85 °C operating range and lead-free, RoHS-compliant packaging.
Why Choose LCMXO2280C-3M132C?
The LCMXO2280C-3M132C positions itself as a compact, non-volatile FPGA solution for designers needing immediate start-up, flexible I/O and in-field update capability. With 2,280 logic elements, embedded memory and up to two PLLs, it suits mid-density control, interfacing and glue-logic roles in commercial products.
Supported by MachXO family design flows and ispLEVER toolchain compatibility (as provided by the family datasheet), this device offers a practical path from development to deployment while reducing BOM complexity through on-chip memory, clocking and configuration features.
Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2280C-3M132C and to discuss how it fits your next design.