LCMXO2280C-3T100C

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 471 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3T100C – MachXO FPGA, 2280 logic elements, 73 I/Os, 100-LQFP

The LCMXO2280C-3T100C is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile configuration and FPGA-style LUT-based logic to deliver instant-on, reconfigurable functionality in a single, surface-mount 100-pin LQFP package.

With 2,280 logic elements, embedded and distributed memory resources, programmable I/O and low-power features, this device targets compact system designs that require fast start-up, in-field updates and flexible I/O support.

Key Features

  • Core Logic — 2,280 logic elements (LUT4s) for implementing glue logic, state machines and small FPGA functions.
  • Embedded and Distributed Memory — Up to approximately 27.6 Kbits of sysMEM™ embedded block RAM plus up to 7.7 Kbits of distributed RAM for FIFOs, buffers and small data stores.
  • Programmable I/O — 73 I/Os in the 100-pin package with a flexible sysIO™ buffer supporting a wide range of interface standards including LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Non-Volatile Configuration — Single-chip, non-volatile architecture provides instant-on behavior and removes the need for external configuration memory.
  • In-Field Reconfiguration — TransFR™ Reconfiguration (TFR) enables in-field logic updates while the system operates; SRAM-based logic can be reconfigured in milliseconds.
  • Low Power Modes — Sleep mode reduces static current by up to 100× to support low-power system states.
  • Clocking — Up to two analog PLLs for clock multiply/divide and phase shifting to support common timing requirements.
  • Packaging & Mounting — Surface-mount 100-LQFP (supplier device package listed as 100-TQFP 14×14) for compact PCB implementation.
  • Supply & Temperature — Voltage supply range 1.71 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
  • Compliance — RoHS compliant packaging.

Typical Applications

  • Glue Logic — Replace discrete glue logic with a single programmable device to consolidate control signals and simplify PCB routing.
  • Bus Bridging & Interfacing — Implement bus converters and protocol adapters using programmable I/O and on-chip logic.
  • Power-Up & Sequencing Control — Manage system power sequencing and reset logic with instant-on, non-volatile configuration behavior.
  • General Control Logic — Replace small CPLDs or low-capacity FPGAs for state machines, peripheral control and system glue.

Unique Advantages

  • Instant-on, single-chip solution: Non-volatile configuration eliminates external configuration memory and enables microsecond power-up behavior.
  • In-field update capability: TransFR reconfiguration and JTAG-updatable non-volatile memory allow safe, background updates without removing the device from the board.
  • Flexible I/O support: Wide protocol and signaling support reduces the need for external translators and level shifters, simplifying BOM and layout.
  • Low-power operation: Sleep mode offers dramatic static current reduction for power-sensitive applications.
  • Compact package with robust I/O count: 73 I/Os in a 100-pin LQFP package balance board space and connectivity for mid-density designs.
  • Integrated clocking and memory: On-chip PLLs and embedded/distributed RAM simplify common system tasks such as buffering and clock management.

Why Choose LCMXO2280C-3T100C?

The LCMXO2280C-3T100C positions itself as a compact, non-volatile FPGA for designers who need instant-on behavior, flexible I/O and the ability to perform field updates. Its combination of 2,280 logic elements, embedded memory blocks, low-power modes and up to two PLLs makes it suitable for replacing discrete logic or low-capacity FPGAs in control and interface roles.

Engineers building mid-density, space-constrained systems will find the 100-LQFP package and programmable I/O useful for consolidating functions, reducing BOM and accelerating time-to-market, while the MachXO family design tools support implementation and migration within the series.

Request a quote or submit a pricing request to check availability and lead times for the LCMXO2280C-3T100C.

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