LCMXO2280C-3T100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP |
|---|---|
| Quantity | 471 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3T100C – MachXO FPGA, 2280 logic elements, 73 I/Os, 100-LQFP
The LCMXO2280C-3T100C is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile configuration and FPGA-style LUT-based logic to deliver instant-on, reconfigurable functionality in a single, surface-mount 100-pin LQFP package.
With 2,280 logic elements, embedded and distributed memory resources, programmable I/O and low-power features, this device targets compact system designs that require fast start-up, in-field updates and flexible I/O support.
Key Features
- Core Logic — 2,280 logic elements (LUT4s) for implementing glue logic, state machines and small FPGA functions.
- Embedded and Distributed Memory — Up to approximately 27.6 Kbits of sysMEM™ embedded block RAM plus up to 7.7 Kbits of distributed RAM for FIFOs, buffers and small data stores.
- Programmable I/O — 73 I/Os in the 100-pin package with a flexible sysIO™ buffer supporting a wide range of interface standards including LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- Non-Volatile Configuration — Single-chip, non-volatile architecture provides instant-on behavior and removes the need for external configuration memory.
- In-Field Reconfiguration — TransFR™ Reconfiguration (TFR) enables in-field logic updates while the system operates; SRAM-based logic can be reconfigured in milliseconds.
- Low Power Modes — Sleep mode reduces static current by up to 100× to support low-power system states.
- Clocking — Up to two analog PLLs for clock multiply/divide and phase shifting to support common timing requirements.
- Packaging & Mounting — Surface-mount 100-LQFP (supplier device package listed as 100-TQFP 14×14) for compact PCB implementation.
- Supply & Temperature — Voltage supply range 1.71 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
- Compliance — RoHS compliant packaging.
Typical Applications
- Glue Logic — Replace discrete glue logic with a single programmable device to consolidate control signals and simplify PCB routing.
- Bus Bridging & Interfacing — Implement bus converters and protocol adapters using programmable I/O and on-chip logic.
- Power-Up & Sequencing Control — Manage system power sequencing and reset logic with instant-on, non-volatile configuration behavior.
- General Control Logic — Replace small CPLDs or low-capacity FPGAs for state machines, peripheral control and system glue.
Unique Advantages
- Instant-on, single-chip solution: Non-volatile configuration eliminates external configuration memory and enables microsecond power-up behavior.
- In-field update capability: TransFR reconfiguration and JTAG-updatable non-volatile memory allow safe, background updates without removing the device from the board.
- Flexible I/O support: Wide protocol and signaling support reduces the need for external translators and level shifters, simplifying BOM and layout.
- Low-power operation: Sleep mode offers dramatic static current reduction for power-sensitive applications.
- Compact package with robust I/O count: 73 I/Os in a 100-pin LQFP package balance board space and connectivity for mid-density designs.
- Integrated clocking and memory: On-chip PLLs and embedded/distributed RAM simplify common system tasks such as buffering and clock management.
Why Choose LCMXO2280C-3T100C?
The LCMXO2280C-3T100C positions itself as a compact, non-volatile FPGA for designers who need instant-on behavior, flexible I/O and the ability to perform field updates. Its combination of 2,280 logic elements, embedded memory blocks, low-power modes and up to two PLLs makes it suitable for replacing discrete logic or low-capacity FPGAs in control and interface roles.
Engineers building mid-density, space-constrained systems will find the 100-LQFP package and programmable I/O useful for consolidating functions, reducing BOM and accelerating time-to-market, while the MachXO family design tools support implementation and migration within the series.
Request a quote or submit a pricing request to check availability and lead times for the LCMXO2280C-3T100C.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016