LCMXO2280C-3MN132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

Quantity 41 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3MN132C – MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

The LCMXO2280C-3MN132C is a MachXO family non-volatile FPGA optimized for glue logic, bus interfacing, power-up control and general control logic. It combines reconfigurable logic with on-chip non-volatile configuration to provide instant-on behavior and flexible in-field update capability.

This surface-mount device provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM, and 101 user I/O pins in a 132-ball CSPBGA (8×8 mm) package. It is specified for commercial-grade operation from 0 °C to 85 °C and supports supply voltages from 1.71 V to 3.465 V.

Key Features

  • Non-volatile, instant-on configuration  Single-chip non-volatile architecture removes the need for external configuration memory and enables rapid power-up.
  • Reconfigurable logic  2,280 logic elements support flexible implementation of glue logic, state machines and control functions.
  • On-chip memory  Approximately 28,262 bits of embedded RAM for distributed and block memory use within the design.
  • Flexible I/O  101 user I/Os in the 132-ball CSPBGA package with programmable sysIO buffer support for multiple interface standards as documented for the MachXO family.
  • Power and voltage options  Supports operation over a supply range of 1.71 V to 3.465 V to match common system rails.
  • Low-power and field updates  Sleep mode available for significant static current reduction and TransFR reconfiguration for in-field logic updates while the system operates (family feature).
  • Commercial temperature grade  Specified for operation from 0 °C to 85 °C.
  • Package and mounting  Surface mount 132-LFBGA (132-CSPBGA, 8×8 mm) package for compact board-level integration.
  • Compliance  RoHS compliant.

Typical Applications

  • Glue logic and board-level glue  Implement address decoding, bus arbitration, and custom glue between heterogeneous IP blocks.
  • Bus bridging and interfacing  Bridge or adapt signals between bus standards and perform protocol translation using reconfigurable logic and flexible I/Os.
  • Power-up and reset control  Centralize power sequencing, reset distribution, and supervisory control with instant-on configuration.
  • Control and state machines  Implement deterministic control logic, finite-state machines, and peripheral control functions.
  • Field-updatable systems  Enable in-field logic updates and incremental feature additions using background programming and TransFR family capabilities.

Unique Advantages

  • Single-chip non-volatile configuration: Eliminates external configuration memory and delivers immediate functional availability at power-up.
  • High logic density in compact package: 2,280 logic elements with 101 I/Os in a 132-ball CSPBGA (8×8 mm) package reduces board area and BOM complexity.
  • On-chip memory for control and buffering: Approximately 28,262 bits of embedded RAM support FIFOs, small buffers, and distributed storage for control logic.
  • Flexible I/O and voltage support: Programmable I/O buffer capability and a wide supply range (1.71–3.465 V) allow integration with diverse system rails and interfaces.
  • Low-power operational modes: Sleep mode offers substantial static current reduction for energy-sensitive designs.
  • RoHS compliant commercial device: RoHS compliance supports mainstream commercial product development and manufacturing.

Why Choose LCMXO2280C-3MN132C?

The LCMXO2280C-3MN132C positions itself as a compact, reconfigurable system glue and control device for commercial applications. With 2,280 logic elements, on-chip RAM and 101 I/Os in a 132-ball CSPBGA package, it is suited to designs that require instant-on behavior, in-field update capability and flexible I/O integration without adding external configuration memory.

This device is appropriate for engineers building bus bridges, power-control logic, interface adapters and embedded control functions where board space, configuration security and low static power modes are important considerations. Its MachXO family features such as non-volatile configuration, background programming and TransFR reconfiguration provide a clear upgrade path for evolving system requirements.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time information for the LCMXO2280C-3MN132C.

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