LCMXO2280C-3MN132C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 41 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3MN132C – MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA
The LCMXO2280C-3MN132C is a MachXO family non-volatile FPGA optimized for glue logic, bus interfacing, power-up control and general control logic. It combines reconfigurable logic with on-chip non-volatile configuration to provide instant-on behavior and flexible in-field update capability.
This surface-mount device provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM, and 101 user I/O pins in a 132-ball CSPBGA (8×8 mm) package. It is specified for commercial-grade operation from 0 °C to 85 °C and supports supply voltages from 1.71 V to 3.465 V.
Key Features
- Non-volatile, instant-on configuration Single-chip non-volatile architecture removes the need for external configuration memory and enables rapid power-up.
- Reconfigurable logic 2,280 logic elements support flexible implementation of glue logic, state machines and control functions.
- On-chip memory Approximately 28,262 bits of embedded RAM for distributed and block memory use within the design.
- Flexible I/O 101 user I/Os in the 132-ball CSPBGA package with programmable sysIO buffer support for multiple interface standards as documented for the MachXO family.
- Power and voltage options Supports operation over a supply range of 1.71 V to 3.465 V to match common system rails.
- Low-power and field updates Sleep mode available for significant static current reduction and TransFR reconfiguration for in-field logic updates while the system operates (family feature).
- Commercial temperature grade Specified for operation from 0 °C to 85 °C.
- Package and mounting Surface mount 132-LFBGA (132-CSPBGA, 8×8 mm) package for compact board-level integration.
- Compliance RoHS compliant.
Typical Applications
- Glue logic and board-level glue Implement address decoding, bus arbitration, and custom glue between heterogeneous IP blocks.
- Bus bridging and interfacing Bridge or adapt signals between bus standards and perform protocol translation using reconfigurable logic and flexible I/Os.
- Power-up and reset control Centralize power sequencing, reset distribution, and supervisory control with instant-on configuration.
- Control and state machines Implement deterministic control logic, finite-state machines, and peripheral control functions.
- Field-updatable systems Enable in-field logic updates and incremental feature additions using background programming and TransFR family capabilities.
Unique Advantages
- Single-chip non-volatile configuration: Eliminates external configuration memory and delivers immediate functional availability at power-up.
- High logic density in compact package: 2,280 logic elements with 101 I/Os in a 132-ball CSPBGA (8×8 mm) package reduces board area and BOM complexity.
- On-chip memory for control and buffering: Approximately 28,262 bits of embedded RAM support FIFOs, small buffers, and distributed storage for control logic.
- Flexible I/O and voltage support: Programmable I/O buffer capability and a wide supply range (1.71–3.465 V) allow integration with diverse system rails and interfaces.
- Low-power operational modes: Sleep mode offers substantial static current reduction for energy-sensitive designs.
- RoHS compliant commercial device: RoHS compliance supports mainstream commercial product development and manufacturing.
Why Choose LCMXO2280C-3MN132C?
The LCMXO2280C-3MN132C positions itself as a compact, reconfigurable system glue and control device for commercial applications. With 2,280 logic elements, on-chip RAM and 101 I/Os in a 132-ball CSPBGA package, it is suited to designs that require instant-on behavior, in-field update capability and flexible I/O integration without adding external configuration memory.
This device is appropriate for engineers building bus bridges, power-control logic, interface adapters and embedded control functions where board space, configuration security and low static power modes are important considerations. Its MachXO family features such as non-volatile configuration, background programming and TransFR reconfiguration provide a clear upgrade path for evolving system requirements.
Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time information for the LCMXO2280C-3MN132C.