LCMXO2280C-3M132I

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

Quantity 994 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3M132I – MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

The LCMXO2280C-3M132I is a MachXO family FPGA combining non-volatile configuration with FPGA-style LUT logic and embedded memory. It provides 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM (28,262 total RAM bits), and 101 general-purpose I/Os in a 132-ball CSPBGA / LFBGA package.

Designed for industrial environments, this single‑chip device delivers instant-on, in-system reconfiguration and a broad supply-voltage range (1.71 V to 3.465 V), making it suitable for glue logic, bus bridging, control and interface tasks where compact, reconfigurable hardware is required.

Key Features

  • Core Logic: 2,280 logic elements available for implementing combinational and sequential logic, optimized for glue logic and low-to-moderate density FPGA tasks.
  • Embedded Memory: Approximately 28.3 Kbits (28,262 bits) of on-chip RAM supporting distributed and block RAM use.
  • I/O Density: 101 I/Os in the 132-ball package, providing high pin-to-logic ratio for interfacing and bus applications.
  • Non-volatile, Instant-On: Single-chip non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
  • Reconfiguration & Programming: Supports background programming and JTAG-based programming; in-field reconfiguration capability for updating logic while the system operates.
  • Clocking: Family documentation indicates support for on-chip PLLs to handle clock multiplication, division, and phase shifting.
  • Power & Low-Power Modes: Operates across 1.71 V to 3.465 V supply range and includes sleep-mode support for substantial static current reduction.
  • Package & Temperature: 132-ball CSPBGA (8×8 mm) / 132-LFBGA package; industrial grade operation from −40 °C to 100 °C.
  • Standards & Compliance: RoHS-compliant packaging and IEEE-standard JTAG programming support as indicated in family documentation.

Typical Applications

  • System Glue Logic: Replace discrete glue logic with compact reconfigurable logic to simplify PCB routing and reduce BOM count.
  • Bus Bridging and Interfacing: Implement bus translators, protocol adapters, and interface logic using the device’s high I/O count and flexible I/O buffer options.
  • Power-Up Control and Sequencing: Use non-volatile instant-on behavior for reliable power-up control, system resets and sequencing functions.
  • Control and State Machines: Implement device control, user interfaces, and supervisory state machines where industrial temperature range and reconfigurability are required.

Unique Advantages

  • Single-Chip Non-Volatile Configuration: Eliminates external configuration memory and enables instant-on operation for faster system initialization.
  • In-Field Reconfiguration: Background programming and reconfiguration while the system is running allow firmware updates and feature changes without full system downtime.
  • High Pin-to-Logic Ratio: 101 I/Os paired with 2,280 logic elements deliver efficient integration of interface logic and functional blocks in a compact package.
  • Wide Supply Range: Supports multiple common I/O and core voltage domains across 1.71 V to 3.465 V for flexible board-level power architectures.
  • Industrial Temperature Operation: Rated for −40 °C to 100 °C, enabling deployment in industrial environments that require broader temperature tolerance.
  • RoHS-Compliant Packaging: Environmentally compliant package suitable for modern manufacturing processes.

Why Choose LCMXO2280C-3M132I?

The LCMXO2280C-3M132I positions itself as a compact, industrial-grade MachXO FPGA that balances reconfigurable logic density with non-volatile instant-on operation. Its combination of 2,280 logic elements, roughly 28 Kbits of on-chip memory, and 101 I/Os in a 132-ball package makes it well-suited for designs requiring reliable control, interface, and bridging functions without the complexity of external configuration devices.

Engineers targeting industrial and embedded applications will find this device useful for reducing BOM count, accelerating system boot, and enabling in-field updates—backed by the MachXO family feature set for configurable I/O, programmable clocking and power management modes.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the LCMXO2280C-3M132I.

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