LCMXO2280C-3M132I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 994 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3M132I – MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA
The LCMXO2280C-3M132I is a MachXO family FPGA combining non-volatile configuration with FPGA-style LUT logic and embedded memory. It provides 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM (28,262 total RAM bits), and 101 general-purpose I/Os in a 132-ball CSPBGA / LFBGA package.
Designed for industrial environments, this single‑chip device delivers instant-on, in-system reconfiguration and a broad supply-voltage range (1.71 V to 3.465 V), making it suitable for glue logic, bus bridging, control and interface tasks where compact, reconfigurable hardware is required.
Key Features
- Core Logic: 2,280 logic elements available for implementing combinational and sequential logic, optimized for glue logic and low-to-moderate density FPGA tasks.
- Embedded Memory: Approximately 28.3 Kbits (28,262 bits) of on-chip RAM supporting distributed and block RAM use.
- I/O Density: 101 I/Os in the 132-ball package, providing high pin-to-logic ratio for interfacing and bus applications.
- Non-volatile, Instant-On: Single-chip non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
- Reconfiguration & Programming: Supports background programming and JTAG-based programming; in-field reconfiguration capability for updating logic while the system operates.
- Clocking: Family documentation indicates support for on-chip PLLs to handle clock multiplication, division, and phase shifting.
- Power & Low-Power Modes: Operates across 1.71 V to 3.465 V supply range and includes sleep-mode support for substantial static current reduction.
- Package & Temperature: 132-ball CSPBGA (8×8 mm) / 132-LFBGA package; industrial grade operation from −40 °C to 100 °C.
- Standards & Compliance: RoHS-compliant packaging and IEEE-standard JTAG programming support as indicated in family documentation.
Typical Applications
- System Glue Logic: Replace discrete glue logic with compact reconfigurable logic to simplify PCB routing and reduce BOM count.
- Bus Bridging and Interfacing: Implement bus translators, protocol adapters, and interface logic using the device’s high I/O count and flexible I/O buffer options.
- Power-Up Control and Sequencing: Use non-volatile instant-on behavior for reliable power-up control, system resets and sequencing functions.
- Control and State Machines: Implement device control, user interfaces, and supervisory state machines where industrial temperature range and reconfigurability are required.
Unique Advantages
- Single-Chip Non-Volatile Configuration: Eliminates external configuration memory and enables instant-on operation for faster system initialization.
- In-Field Reconfiguration: Background programming and reconfiguration while the system is running allow firmware updates and feature changes without full system downtime.
- High Pin-to-Logic Ratio: 101 I/Os paired with 2,280 logic elements deliver efficient integration of interface logic and functional blocks in a compact package.
- Wide Supply Range: Supports multiple common I/O and core voltage domains across 1.71 V to 3.465 V for flexible board-level power architectures.
- Industrial Temperature Operation: Rated for −40 °C to 100 °C, enabling deployment in industrial environments that require broader temperature tolerance.
- RoHS-Compliant Packaging: Environmentally compliant package suitable for modern manufacturing processes.
Why Choose LCMXO2280C-3M132I?
The LCMXO2280C-3M132I positions itself as a compact, industrial-grade MachXO FPGA that balances reconfigurable logic density with non-volatile instant-on operation. Its combination of 2,280 logic elements, roughly 28 Kbits of on-chip memory, and 101 I/Os in a 132-ball package makes it well-suited for designs requiring reliable control, interface, and bridging functions without the complexity of external configuration devices.
Engineers targeting industrial and embedded applications will find this device useful for reducing BOM count, accelerating system boot, and enabling in-field updates—backed by the MachXO family feature set for configurable I/O, programmable clocking and power management modes.
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