LCMXO2280C-3FT324C

The LCMXO2280C-3FT324C is a MachXO family FPGA from Lattice Semiconductor, combining non-volatile configuration with FPGA-style LUT-based logic. The device provides 2,280 logic elements, 285 logic blocks, approximately 27.6 Kbits of on-chip RAM (28,262 bits), and up to 271 I/Os in a 324-ball BGA package.

Designed for glue logic, bus bridging, bus interfacing, power-up control and general control logic, this single-chip solution delivers instant-on capability, flexible I/O support and on-chip memory and PLL resources to simplify system design and reduce BOM size.

Key Features

• Core Logic – 2,280 logic elements and 285 logic blocks provide a dense LUT4-based fabric for glue logic and medium-complexity control functions.
• On-chip Memory – Approximately 27.6 Kbits of embedded block RAM and additional distributed RAM for FIFOs and small buffers.
• I/O Capacity – Up to 271 I/Os available in the 324-LBGA (19×19 mm) package to support complex bus and peripheral interfacing.
• Flexible I/O Buffer – Programmable sysIO buffer supports multiple interface standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Analog PLLs – Two sysCLOCK PLLs for clock multiplication, division and phase shifting to manage system clocks on-chip.
• Non-volatile, Reconfigurable – Instant-on, single-chip non-volatile configuration with in-field reconfiguration and background programming support.
• Low-power Modes – Sleep mode capability for significant static current reduction during low-power states.
• Power and Thermal – Wide supply range from 1.71 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
• Package – 324-ball FTBGA (19×19 mm) package for high pin-count board designs in a compact footprint.
• Standards and Reliability – Non-volatile configuration, in-system programming and boundary-scan support for secure and maintainable system deployment.

Typical Applications

• Glue Logic and System Control – Replace discrete glue logic with a single programmable device for board-level interfacing and control functions.
• Bus Bridging and Interfacing – Implement protocol translation, bus adapters and signal conditioning using the device’s high I/O count and flexible I/O standards.
• Power-up and Reset Control – Use instant-on non-volatile configuration and programmable logic to manage power sequencing and system initialization.
• Embedded Peripheral Control – Implement user interfaces, peripheral aggregation and control logic leveraging on-chip RAM and PLL clocking.

Unique Advantages

• Instant-on Single-chip Solution: Eliminates external configuration memory and enables microsecond power-up behavior while maintaining design security through on-chip configuration.
• High I/O-to-Logic Density: 271 I/Os paired with 2,280 logic elements simplify designs that need a large number of interfaces without multiple devices.
• Flexible Interface Support: Programmable sysIO buffers support a wide range of signaling standards, reducing the need for external level-shifters and interface components.
• On-chip Memory and Clocking: Embedded block RAM and two PLLs allow local buffering and precise clock management for deterministic system behavior.
• Field Reconfiguration: Background programming and in-field logic updates enable non-disruptive firmware and logic changes during system operation.
• Compact High-pin Package: The 324-ball FTBGA (19×19 mm) package delivers high pin-count in a compact footprint suitable for space-constrained PCBs.

Why Choose LCMXO2280C-3FT324C?

The LCMXO2280C-3FT324C positions itself as a versatile, non-volatile FPGA for designs requiring substantial I/O, on-chip memory and instant-on capability. Its combination of 2,280 logic elements, approximately 27.6 Kbits of embedded RAM, two PLLs and programmable I/O standards makes it a practical choice for system glue logic, bus interfacing and control tasks where a single-chip, secure, reconfigurable solution reduces board complexity and BOM.

With a commercial operating range and a 324-ball BGA package, this MachXO device is suited to mainstream embedded and electronic applications where fast startup, flexible interfacing and field reconfigurability are priorities.

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