LCMXO2-7000ZE-1FTG256C

The LCMXO2-7000ZE-1FTG256C is a MachXO2 family FPGA IC from Lattice Semiconductor designed for low-power, non-volatile reconfigurable logic. It combines a flexible LUT-based architecture with embedded memory and a high-density I/O fabric to support system control, interface bridging and display/memory interface tasks.

Built for instant-on operation and in-field reconfiguration, this commercial-grade device offers 6,864 logic elements, approximately 245.8 kbits of embedded RAM, and 206 I/Os in a 256-ball LBGA package, making it well suited to applications that require compact, power-efficient programmable logic with rich I/O and on-chip flash.

Key Features

• Logic Core 
  6,864 logic elements provide ample LUT4-based resources for glue logic, state machines and small-to-medium FPGA functions.
• Embedded Memory 
  Approximately 245,760 bits of on-chip RAM (sysMEM and distributed RAM) for buffering, FIFOs and small data storage needs.
• On-Chip Non-Volatile Flash 
  Up to 256 kbits of user flash memory with 100,000 write cycles; programmable through JTAG, SPI and I2C for secure, single-chip configuration and background programming.
• High I/O Count & Flexible Interfaces 
  206 I/Os with programmable sysIO™ buffer support for LVCMOS, LVTTL and a range of differential standards; features include programmable pull-ups/pull-downs and on-chip differential termination.
• Pre-Engineered Source-Synchronous I/O 
  DDR registers in I/O cells, dedicated gearing logic and display gearing (7:1) plus support for generic DDR, DDRX2 and DDRX4 interfaces and dedicated DDR/DDR2/LPDDR with DQS support.
• Low Power & Instant-On 
  Built on an advanced 65 nm low-power process with standby power as low as 22 μW and instant-on, non-volatile operation for fast system availability.
• Clocking & PLLs 
  Multiple on-chip clocks (eight primary clocks) and up to two analog PLLs with fractional-N synthesis and a wide input frequency range for flexible clock management.
• Package & Operating Range 
  256-LBGA (supplier: 256-FTBGA, 17×17) surface-mount package; commercial grade operation from 0 °C to 85 °C and single-supply operation from 1.14 V to 1.26 V.
• System-Level Functions 
  On-chip hardened functions including SPI, I2C, timer/counter, on-chip oscillator, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming; features for security and traceability such as TraceID and optional OTP mode.

Typical Applications

• Display and Video Interfaces 
  Programmable gearing and DDR I/O support make the device suitable for driving and adapting display interfaces where display timing and data alignment are required.
• Memory Interface and Buffering 
  Dedicated DDR/DDR2/LPDDR support with DQS and embedded RAM allow use as an interface bridge or buffering element between processors and external memory subsystems.
• In-Field Logic Updates 
  TransFR reconfiguration and background programming enable safe in-field logic updates and dual-boot configurations for systems that require live firmware or logic evolution.
• Interface Bridging and Glue Logic 
  High I/O count and programmable sysIO buffers support protocol adaptation, signal translation and board-level glue functions across a wide range of interfaces.

Unique Advantages

• Highly Integrated Logic and I/O 
  6,864 logic elements combined with 206 I/Os reduce external components and simplify PCB routing for compact designs.
• Non-Volatile, Instant-On Operation 
  On-chip user flash and instant-on capability eliminate the need for external configuration memory while enabling fast system start-up.
• Robust On-Chip Memory 
  Approximately 245.8 kbits of embedded RAM plus distributed RAM and dedicated FIFO logic support low-latency buffering and deterministic data flows.
• Low-Power Standby 
  Advanced low-power process technology and standby currents as low as 22 μW reduce system power consumption in idle states.
• Flexible Clocking and PLLs 
  Multiple primary clocks and up to two analog PLLs provide versatile frequency synthesis and clock distribution for heterogeneous system requirements.
• Commercial Temperature and Single-Supply Operation 
  Designed for 0 °C to 85 °C operation with a single supply range of 1.14 V to 1.26 V to match many modern system power rails.

Why Choose LCMXO2-7000ZE-1FTG256C?

The LCMXO2-7000ZE-1FTG256C positions itself as a compact, low-power, non-volatile FPGA option within the MachXO2 family, offering a balance of logic density, embedded memory and extensive I/O in a 256-ball LBGA package. Its family-level features—instant-on, in-field reconfiguration, hardened peripherals and flexible I/O—make it well suited for designers who need reliable, reprogrammable logic with minimal external components.

Choose this device when you require a scalable MachXO2-family solution that supports density migration, on-chip system functions (SPI, I2C, timers, oscillator), and proven configuration options for secure and maintainable designs.

Request a quote or submit a procurement inquiry to begin pricing and availability for the LCMXO2-7000ZE-1FTG256C.