LCMXO2-7000ZE-1FG484C

IC FPGA 334 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA

Quantity 550 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O334Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-1FG484C – MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA

The LCMXO2-7000ZE-1FG484C is a MachXO2 family field programmable gate array offering 6,864 logic elements and up to 334 I/Os in a 484-ball BGA package. It combines a flexible logic architecture with embedded RAM and on-chip user flash memory to support designs that require configurable logic, dense I/O, and low-power operation.

Designed for commercial-grade systems, this device provides instant-on non-volatile configuration, programmable I/O standards and multiple clocking options, making it suitable for system control, I/O bridging and in-field logic updates where compact packaging and power efficiency matter.

Key Features

  • Programmable Logic Capacity  6,864 logic elements for custom logic implementation and glue-logic integration.
  • Embedded and Distributed Memory  Approximately 240 kbits of embedded block RAM (245,760 bits total) plus family support for distributed RAM; supports FIFO control logic for buffered data handling.
  • On-Chip Non-Volatile Memory  Family-level user flash memory up to 256 kbits for configuration storage and in-field updates.
  • High I/O Count & Programmable Interfaces  334 I/Os with programmable sysIO buffer supporting a wide range of interfaces and programmable differential termination options.
  • Low-Power Operation  Built on an advanced 65 nm low-power process with standby power as low as 22 µW (family data), and a single supply operating range of 1.14 V to 1.26 V for core power.
  • Clocking and PLLs  Multiple primary clocks and up to two analog PLLs (family capability) for flexible frequency synthesis and high-speed I/O timing.
  • Instant-On and Reconfiguration  Non-volatile, instantly configurable device with TransFR in-field reconfiguration for live logic updates.
  • Package and Mounting  484-ball BGA package (484-FBGA, 23 × 23 mm) designed for surface-mount assembly.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Display and Video Interfaces  Pre-engineered source-synchronous I/O and gearing features support display timing and DDR-style interfaces for panel and video bridging applications.
  • Memory Interface and Buffering  Dedicated FIFO control logic and DDR register support in I/O cells help implement memory interfaces and data buffering between subsystems.
  • System Control and Glue Logic  Programmable logic and abundant I/Os make the device suitable for control functions, protocol bridging and board-level glue logic.
  • Low-Power Embedded Systems  Ultra-low standby power and single-chip non-volatile configuration address designs with tight power budgets and instant-on requirements.

Unique Advantages

  • Highly integrated solution: Combines thousands of logic elements, embedded RAM and on-chip flash in a single 484-ball BGA package to reduce BOM and board area.
  • Flexible I/O support: Wide range of programmable I/O standards and hot-socketing support simplifies interfacing to diverse peripherals and signaling standards.
  • Non-volatile instant-on: On-chip user flash and instant-on configuration remove the need for external configuration memory and enable fast system startup.
  • Field update capability: TransFR reconfiguration allows in-field logic updates without removing the device from the system.
  • Low standby power: Advanced low-power process and standby modes help minimize energy consumption in idle states.

Why Choose LCMXO2-7000ZE-1FG484C?

This MachXO2 device positions itself as a versatile, low-power FPGA option for commercial designs that need significant logic capacity, high I/O density and non-volatile configuration storage in a compact BGA package. It is well suited to engineers building systems that require instant-on behavior, flexible interfacing and the ability to update logic in the field.

With family-proven features such as embedded RAM, programmable I/O standards, and multiple clocking/PLL options, the LCMXO2-7000ZE-1FG484C offers a balance of integration, configurability and power efficiency for medium-density programmable logic designs.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead-time information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up