LCMXO2-7000ZE-1FG484C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA |
|---|---|
| Quantity | 550 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 334 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-1FG484C – MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA
The LCMXO2-7000ZE-1FG484C is a MachXO2 family field programmable gate array offering 6,864 logic elements and up to 334 I/Os in a 484-ball BGA package. It combines a flexible logic architecture with embedded RAM and on-chip user flash memory to support designs that require configurable logic, dense I/O, and low-power operation.
Designed for commercial-grade systems, this device provides instant-on non-volatile configuration, programmable I/O standards and multiple clocking options, making it suitable for system control, I/O bridging and in-field logic updates where compact packaging and power efficiency matter.
Key Features
- Programmable Logic Capacity 6,864 logic elements for custom logic implementation and glue-logic integration.
- Embedded and Distributed Memory Approximately 240 kbits of embedded block RAM (245,760 bits total) plus family support for distributed RAM; supports FIFO control logic for buffered data handling.
- On-Chip Non-Volatile Memory Family-level user flash memory up to 256 kbits for configuration storage and in-field updates.
- High I/O Count & Programmable Interfaces 334 I/Os with programmable sysIO buffer supporting a wide range of interfaces and programmable differential termination options.
- Low-Power Operation Built on an advanced 65 nm low-power process with standby power as low as 22 µW (family data), and a single supply operating range of 1.14 V to 1.26 V for core power.
- Clocking and PLLs Multiple primary clocks and up to two analog PLLs (family capability) for flexible frequency synthesis and high-speed I/O timing.
- Instant-On and Reconfiguration Non-volatile, instantly configurable device with TransFR in-field reconfiguration for live logic updates.
- Package and Mounting 484-ball BGA package (484-FBGA, 23 × 23 mm) designed for surface-mount assembly.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Display and Video Interfaces Pre-engineered source-synchronous I/O and gearing features support display timing and DDR-style interfaces for panel and video bridging applications.
- Memory Interface and Buffering Dedicated FIFO control logic and DDR register support in I/O cells help implement memory interfaces and data buffering between subsystems.
- System Control and Glue Logic Programmable logic and abundant I/Os make the device suitable for control functions, protocol bridging and board-level glue logic.
- Low-Power Embedded Systems Ultra-low standby power and single-chip non-volatile configuration address designs with tight power budgets and instant-on requirements.
Unique Advantages
- Highly integrated solution: Combines thousands of logic elements, embedded RAM and on-chip flash in a single 484-ball BGA package to reduce BOM and board area.
- Flexible I/O support: Wide range of programmable I/O standards and hot-socketing support simplifies interfacing to diverse peripherals and signaling standards.
- Non-volatile instant-on: On-chip user flash and instant-on configuration remove the need for external configuration memory and enable fast system startup.
- Field update capability: TransFR reconfiguration allows in-field logic updates without removing the device from the system.
- Low standby power: Advanced low-power process and standby modes help minimize energy consumption in idle states.
Why Choose LCMXO2-7000ZE-1FG484C?
This MachXO2 device positions itself as a versatile, low-power FPGA option for commercial designs that need significant logic capacity, high I/O density and non-volatile configuration storage in a compact BGA package. It is well suited to engineers building systems that require instant-on behavior, flexible interfacing and the ability to update logic in the field.
With family-proven features such as embedded RAM, programmable I/O standards, and multiple clocking/PLL options, the LCMXO2-7000ZE-1FG484C offers a balance of integration, configurability and power efficiency for medium-density programmable logic designs.
If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead-time information.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016