LCMXO2-7000ZE-1BG332C

IC FPGA 278 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA

Quantity 1,316 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case332-FBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-1BG332C – MachXO2 FPGA, 332-FBGA, 6864 Logic Elements

The LCMXO2-7000ZE-1BG332C is a MachXO2 family field programmable gate array (FPGA) by Lattice Semiconductor. This commercial-grade, surface-mount device integrates 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and 278 I/Os in a 332-ball caBGA (17 × 17 mm) package.

Designed for low-power, instantly configurable applications, the device provides non-volatile on-chip flash, flexible I/O standards, and a broad set of on-chip peripherals and clocking resources to support system-level integration and reconfiguration.

Key Features

  • Core Logic  Includes 6,864 logic elements for implementing combinational and sequential logic functions.
  • Embedded and Distributed Memory  Approximately 245,760 bits of on-chip RAM, with both embedded block RAM and distributed RAM architectures available for buffering and state storage.
  • On-Chip User Flash (UFM)  Up to 256 kbits of on-chip user flash memory supporting background programming, dual-boot options, and up to 100,000 write cycles for non-volatile configuration storage.
  • I/O Flexibility  278 I/Os with programmable sysIO buffers supporting a wide range of standards and programmable on-chip differential termination, DDR registers in I/O cells, and hot-socketing capability.
  • Pre-Engineered Source-Synchronous I/O  Dedicated DDR/DDR2/LPDDR memory support with DQS, generic DDR modes, and 7:1 gearing for display I/Os to simplify high-speed interface implementation.
  • Low Power Operation  Manufactured on an advanced 65 nm low-power process with standby power as low as 22 µW and multiple power-saving modes.
  • Flexible Clocking and PLLs  Eight primary clocks, up to two edge clocks for high-speed I/O, and up to two analog PLLs with fractional-N synthesis (wide input frequency range) for flexible timing architectures.
  • On-Chip Peripherals and System Features  Includes hardened I2C and SPI, timer/counter, on-chip oscillator (5.5% accuracy), TraceID for system tracking, OTP mode, IEEE 1149.1 boundary scan, and IEEE 1532 in-system programming support.
  • Packaging and Operating Conditions  332-FBGA (332-CABGA, 17 × 17 mm) surface-mount package, commercial grade with operating supply voltage range 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Display and Video Interfaces  Pre-engineered source-synchronous I/O, DDR gearing, and dedicated display gearing make this device suitable for implementing display timing, buffering, and interface logic.
  • Memory Interface and Buffering  Dedicated DDR/DDR2/LPDDR support with DQS plus embedded RAM and FIFO control logic supports memory controller glue logic and data buffering.
  • System Control and Configuration  On-chip user flash, instant-on non-volatile configuration, and multiple programming interfaces (JTAG, SPI, I2C) enable secure boot, in-field updates, and system management tasks.

Unique Advantages

  • Highly Integrated FPGA Fabric  6,864 logic elements combined with substantial on-chip RAM reduce external component count and simplify board-level design.
  • Non-Volatile Instant-On  On-chip flash enables instant-on behavior and in-field reconfiguration without external configuration memory.
  • Flexible, High-Speed I/O  Wide range of sysIO standards, built-in DDR registers, and dedicated gear logic streamline implementation of high-speed interfaces and display subsystems.
  • Low Standby Power  Advanced 65 nm low-power process and standby options provide low static power for power-sensitive applications.
  • System-Level Features  Hardened SPI/I2C, timers, oscillator, and trace identification simplify integration of common system functions on-chip.
  • Density Migration Support  Part of the MachXO2 family allowing straightforward migration across densities where design scalability is required.

Why Choose LCMXO2-7000ZE-1BG332C?

The LCMXO2-7000ZE-1BG332C combines a substantial logic capacity with flexible I/O, embedded RAM, and non-volatile configuration to deliver a compact, low-power FPGA solution for system-level integration. Its on-chip flash, hardened peripherals, and advanced clocking make it well suited to designs that need instant-on behavior, in-field updates, and robust interface support.

This commercial-grade MachXO2 device is appropriate for designers seeking a reconfigurable, power-efficient FPGA with broad I/O capability and integrated system features, and for projects that benefit from scalable density options within the MachXO2 family.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO2-7000ZE-1BG332C.

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