LCMXO2-7000ZE-1BG332C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA |
|---|---|
| Quantity | 1,316 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 278 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-1BG332C – MachXO2 FPGA, 332-FBGA, 6864 Logic Elements
The LCMXO2-7000ZE-1BG332C is a MachXO2 family field programmable gate array (FPGA) by Lattice Semiconductor. This commercial-grade, surface-mount device integrates 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and 278 I/Os in a 332-ball caBGA (17 × 17 mm) package.
Designed for low-power, instantly configurable applications, the device provides non-volatile on-chip flash, flexible I/O standards, and a broad set of on-chip peripherals and clocking resources to support system-level integration and reconfiguration.
Key Features
- Core Logic Includes 6,864 logic elements for implementing combinational and sequential logic functions.
- Embedded and Distributed Memory Approximately 245,760 bits of on-chip RAM, with both embedded block RAM and distributed RAM architectures available for buffering and state storage.
- On-Chip User Flash (UFM) Up to 256 kbits of on-chip user flash memory supporting background programming, dual-boot options, and up to 100,000 write cycles for non-volatile configuration storage.
- I/O Flexibility 278 I/Os with programmable sysIO buffers supporting a wide range of standards and programmable on-chip differential termination, DDR registers in I/O cells, and hot-socketing capability.
- Pre-Engineered Source-Synchronous I/O Dedicated DDR/DDR2/LPDDR memory support with DQS, generic DDR modes, and 7:1 gearing for display I/Os to simplify high-speed interface implementation.
- Low Power Operation Manufactured on an advanced 65 nm low-power process with standby power as low as 22 µW and multiple power-saving modes.
- Flexible Clocking and PLLs Eight primary clocks, up to two edge clocks for high-speed I/O, and up to two analog PLLs with fractional-N synthesis (wide input frequency range) for flexible timing architectures.
- On-Chip Peripherals and System Features Includes hardened I2C and SPI, timer/counter, on-chip oscillator (5.5% accuracy), TraceID for system tracking, OTP mode, IEEE 1149.1 boundary scan, and IEEE 1532 in-system programming support.
- Packaging and Operating Conditions 332-FBGA (332-CABGA, 17 × 17 mm) surface-mount package, commercial grade with operating supply voltage range 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C. RoHS compliant.
Typical Applications
- Display and Video Interfaces Pre-engineered source-synchronous I/O, DDR gearing, and dedicated display gearing make this device suitable for implementing display timing, buffering, and interface logic.
- Memory Interface and Buffering Dedicated DDR/DDR2/LPDDR support with DQS plus embedded RAM and FIFO control logic supports memory controller glue logic and data buffering.
- System Control and Configuration On-chip user flash, instant-on non-volatile configuration, and multiple programming interfaces (JTAG, SPI, I2C) enable secure boot, in-field updates, and system management tasks.
Unique Advantages
- Highly Integrated FPGA Fabric 6,864 logic elements combined with substantial on-chip RAM reduce external component count and simplify board-level design.
- Non-Volatile Instant-On On-chip flash enables instant-on behavior and in-field reconfiguration without external configuration memory.
- Flexible, High-Speed I/O Wide range of sysIO standards, built-in DDR registers, and dedicated gear logic streamline implementation of high-speed interfaces and display subsystems.
- Low Standby Power Advanced 65 nm low-power process and standby options provide low static power for power-sensitive applications.
- System-Level Features Hardened SPI/I2C, timers, oscillator, and trace identification simplify integration of common system functions on-chip.
- Density Migration Support Part of the MachXO2 family allowing straightforward migration across densities where design scalability is required.
Why Choose LCMXO2-7000ZE-1BG332C?
The LCMXO2-7000ZE-1BG332C combines a substantial logic capacity with flexible I/O, embedded RAM, and non-volatile configuration to deliver a compact, low-power FPGA solution for system-level integration. Its on-chip flash, hardened peripherals, and advanced clocking make it well suited to designs that need instant-on behavior, in-field updates, and robust interface support.
This commercial-grade MachXO2 device is appropriate for designers seeking a reconfigurable, power-efficient FPGA with broad I/O capability and integrated system features, and for projects that benefit from scalable density options within the MachXO2 family.
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