LCMXO2-7000ZE-1BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 325 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-1BG256C – MachXO2 Field Programmable Gate Array (FPGA), 206 I/Os, 6864 Logic Elements

The LCMXO2-7000ZE-1BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded designs. It combines a flexible logic architecture with dense I/O, significant on-chip RAM, and non-volatile user flash to address interface bridging, system control, and reconfigurable logic needs.

With 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and support for programmable I/O standards, this device is suited for applications that require instant-on non-volatile logic, secure in-field updates, and a compact 256-ball BGA package.

Key Features

  • Logic Capacity: 6,864 logic elements provide ample programmable fabric for glue logic, protocol bridging, and control functions.
  • On-Chip Memory: Approximately 245,760 bits of total RAM and support for up to 256 kbits of user flash memory enable local buffering, state storage, and non-volatile configuration.
  • I/O Density and Flexibility: 206 I/Os in a 256-ball package with programmable sysIO buffers supporting a wide range of signaling standards for flexible interfacing.
  • Low-Power Operation: Ultra low power family characteristics including standby power as low as 22 μW and programmable power-saving modes help minimize system-level energy use.
  • Clocking and PLLs: Up to two analog PLLs with fractional-n synthesis and multiple primary clocks support a variety of timing and high-speed I/O requirements.
  • Non-Volatile, Reconfigurable: Single-chip instant-on with on-chip user flash, background programming, and TransFR in-field reconfiguration for secure, updateable logic.
  • Embedded Functions: On-chip hardened peripherals such as SPI, I²C and timer/counter reduce external component count and simplify system design.
  • Package & Mounting: 256-LFBGA package case (supplier device package: 256-CABGA, 14×14) designed for surface-mount assembly; RoHS compliant.
  • Commercial Temperature & Voltage: Rated for 0 °C to 85 °C operating temperature and a supply voltage range of 1.14 V to 1.26 V.

Typical Applications

  • Interface Bridging and Glue Logic: Dense I/O and flexible sysIO buffer support make the device suitable for protocol conversion and board-level interface consolidation.
  • Boot and Configuration Control: Non-volatile user flash and instant-on capability allow the device to act as a secure configuration controller or boot manager.
  • Display and Memory Interfaces: Pre-engineered source synchronous I/O, DDR registers, and gearing support are useful for display I/O and dedicated DDR/DDR2/LPDDR memory interfacing.
  • System Control and Peripheral Management: Hardened SPI, I²C and timer/counter blocks simplify integration of peripheral control and monitoring functions.

Unique Advantages

  • Instant-On Non-Volatile Logic: Powers up in microseconds from on-chip flash, enabling fast system startup without external configuration memory.
  • High I/O Count in Compact Package: 206 programmable I/Os in a 256-ball BGA package reduce board complexity while supporting numerous interfaces.
  • Embedded Memory and Flash: Combined on-chip RAM and up to 256 kbits of user flash let designs store firmware and runtime data locally.
  • Low Standby Power: Ultra low-power architecture with standby operation down to micro-watt levels helps extend battery or low-power system life.
  • Flexible Clocking: Multiple primary clocks and up to two PLLs with fractional-n synthesis provide timing flexibility for diverse I/O and interface requirements.
  • Reduced BOM and System Complexity: On-chip peripherals (SPI, I²C, timers) and programmable I/O standards reduce the need for separate interface components.

Why Choose LCMXO2-7000ZE-1BG256C?

This MachXO2 FPGA delivers a balanced mix of programmable logic, embedded memory, and extensive I/O in a commercial-grade, surface-mount 256-ball package. It is a practical choice for designers who need instant-on non-volatile logic, compact board-level integration, and flexible interfacing for control, bridging, and configuration tasks.

For teams focused on reducing component count, enabling in-field updates, and achieving low standby power in space-constrained designs, the LCMXO2-7000ZE-1BG256C provides a consolidated, reconfigurable platform backed by MachXO2 family capabilities.

Request a quote or submit an inquiry to receive pricing, availability, and delivery details for the LCMXO2-7000ZE-1BG256C.

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