LCMXO2-7000ZE-1BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA |
|---|---|
| Quantity | 325 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-1BG256C – MachXO2 Field Programmable Gate Array (FPGA), 206 I/Os, 6864 Logic Elements
The LCMXO2-7000ZE-1BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded designs. It combines a flexible logic architecture with dense I/O, significant on-chip RAM, and non-volatile user flash to address interface bridging, system control, and reconfigurable logic needs.
With 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and support for programmable I/O standards, this device is suited for applications that require instant-on non-volatile logic, secure in-field updates, and a compact 256-ball BGA package.
Key Features
- Logic Capacity: 6,864 logic elements provide ample programmable fabric for glue logic, protocol bridging, and control functions.
- On-Chip Memory: Approximately 245,760 bits of total RAM and support for up to 256 kbits of user flash memory enable local buffering, state storage, and non-volatile configuration.
- I/O Density and Flexibility: 206 I/Os in a 256-ball package with programmable sysIO buffers supporting a wide range of signaling standards for flexible interfacing.
- Low-Power Operation: Ultra low power family characteristics including standby power as low as 22 μW and programmable power-saving modes help minimize system-level energy use.
- Clocking and PLLs: Up to two analog PLLs with fractional-n synthesis and multiple primary clocks support a variety of timing and high-speed I/O requirements.
- Non-Volatile, Reconfigurable: Single-chip instant-on with on-chip user flash, background programming, and TransFR in-field reconfiguration for secure, updateable logic.
- Embedded Functions: On-chip hardened peripherals such as SPI, I²C and timer/counter reduce external component count and simplify system design.
- Package & Mounting: 256-LFBGA package case (supplier device package: 256-CABGA, 14×14) designed for surface-mount assembly; RoHS compliant.
- Commercial Temperature & Voltage: Rated for 0 °C to 85 °C operating temperature and a supply voltage range of 1.14 V to 1.26 V.
Typical Applications
- Interface Bridging and Glue Logic: Dense I/O and flexible sysIO buffer support make the device suitable for protocol conversion and board-level interface consolidation.
- Boot and Configuration Control: Non-volatile user flash and instant-on capability allow the device to act as a secure configuration controller or boot manager.
- Display and Memory Interfaces: Pre-engineered source synchronous I/O, DDR registers, and gearing support are useful for display I/O and dedicated DDR/DDR2/LPDDR memory interfacing.
- System Control and Peripheral Management: Hardened SPI, I²C and timer/counter blocks simplify integration of peripheral control and monitoring functions.
Unique Advantages
- Instant-On Non-Volatile Logic: Powers up in microseconds from on-chip flash, enabling fast system startup without external configuration memory.
- High I/O Count in Compact Package: 206 programmable I/Os in a 256-ball BGA package reduce board complexity while supporting numerous interfaces.
- Embedded Memory and Flash: Combined on-chip RAM and up to 256 kbits of user flash let designs store firmware and runtime data locally.
- Low Standby Power: Ultra low-power architecture with standby operation down to micro-watt levels helps extend battery or low-power system life.
- Flexible Clocking: Multiple primary clocks and up to two PLLs with fractional-n synthesis provide timing flexibility for diverse I/O and interface requirements.
- Reduced BOM and System Complexity: On-chip peripherals (SPI, I²C, timers) and programmable I/O standards reduce the need for separate interface components.
Why Choose LCMXO2-7000ZE-1BG256C?
This MachXO2 FPGA delivers a balanced mix of programmable logic, embedded memory, and extensive I/O in a commercial-grade, surface-mount 256-ball package. It is a practical choice for designers who need instant-on non-volatile logic, compact board-level integration, and flexible interfacing for control, bridging, and configuration tasks.
For teams focused on reducing component count, enabling in-field updates, and achieving low standby power in space-constrained designs, the LCMXO2-7000ZE-1BG256C provides a consolidated, reconfigurable platform backed by MachXO2 family capabilities.
Request a quote or submit an inquiry to receive pricing, availability, and delivery details for the LCMXO2-7000ZE-1BG256C.

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