LCMXO2-7000HE-6FTG256C

The LCMXO2-7000HE-6FTG256C is a MachXO2 family non-volatile FPGA optimized for commercial embedded applications. It provides a flexible logic architecture with 6,864 logic elements, 206 I/Os, and integrated on-chip memory and flash to support system glue logic, I/O bridging and control functions.

Designed for low-power operation and instant-on behavior, the device delivers programmable I/O, on-chip user Flash, and dedicated clock and memory resources to simplify designs that require compact, reconfigurable logic in a 256-ball LBGA package.

Key Features

• Core Logic 6,864 logic elements for implementing glue logic, state machines and control paths in a single device.
• On-chip Memory 245,760 bits (approximately 240 kbits) of embedded RAM for data buffering and state storage, plus up to 256 kbits of on-chip user Flash memory for non-volatile configuration and application storage.
• I/O Density & Flexibility 206 I/Os with programmable sysIO buffers supporting a wide range of interface standards, enabling diverse peripheral and high-speed I/O connectivity.
• Power Ultra-low power architecture with standby power as low as 22 μW and supported single power-supply operation in the specified voltage range of 1.14 V to 1.26 V.
• Clocking & PLLs Up to two analog PLLs with fractional‑N synthesis and a wide input frequency range (7 MHz to 400 MHz), plus multiple primary clocks for flexible timing architectures.
• Pre‑engineered I/O and Memory Interfaces Built-in support for source-synchronous DDR registers, dedicated gearing for display I/Os, and dedicated DDR/DDR2/LPDDR memory support with DQS where required by system design.
• Reconfiguration & Non‑volatile Operation Instant-on non-volatile configuration, TransFR in-field reconfiguration for updates while the system operates, and multiple programming interfaces (JTAG, SPI, I2C).
• System & Reliability Features On-chip oscillator (5.5% accuracy), hardened SPI and I2C functions, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
• Package & Temperature 256-LBGA package (supplier device package: 256-FTBGA, 17 × 17 mm) with surface-mount mounting; commercial operating temperature range 0 °C to 85 °C.
• Environmental RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic Implement protocol conversion, bus bridging and system control functions using the device’s ample logic and rich I/O set.
• Display and Video I/O Use pre‑engineered gearing and DDR I/O registers for display interfaces and source-synchronous data paths.
• Memory Buffering and PHY Support Leverage embedded RAM, dedicated FIFO control logic and DDR support for memory interface buffering and PHY-level control.
• Embedded System Control Store configuration and application code in on-chip user Flash for secure, non-volatile operation and field updates via TransFR.

Unique Advantages

• Non-volatile, instant-on operation On-chip user Flash enables immediate device startup without external configuration memory, simplifying board-level design.
• Low standby power Ultra-low standby power (as low as 22 μW) reduces system power draw during idle periods and supports energy-efficient designs.
• High I/O count with programmable buffers 206 I/Os and programmable sysIO support a wide range of signaling standards, reducing the need for external level translators.
• Field reconfiguration TransFR enables in-field logic updates while the system is running, allowing iterative feature updates and bug fixes without full system downtime.
• Integrated clocking and PLLs Two analog PLLs with fractional‑N synthesis and broad input frequency support simplify clock management for mixed-speed subsystems.
• Compact package with commercial temperature range 256-LBGA (17 × 17 mm supplier footprint) delivers high density in a compact footprint suited to space-constrained commercial products.

Why Choose LCMXO2-7000HE-6FTG256C?

The LCMXO2-7000HE-6FTG256C positions itself as a commercially graded, highly integrated FPGA option for designers who need non-volatile, low-power reconfigurable logic with extensive I/O and on-chip memory. Its combination of 6,864 logic elements, approximately 240 kbits of embedded RAM, up to 256 kbits of user Flash, and 206 programmable I/Os provides the resources required for complex glue logic, interface management and embedded control tasks.

For commercial embedded system developers and product teams seeking a compact, energy-efficient FPGA that supports instant-on operation, field updates and a wide set of I/O standards, this MachXO2 device offers a balanced, verifiable platform backed by on-chip system features such as hardened SPI/I2C, PLLs and boundary-scan support.

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