LCMXO2-7000HE-6FG484C

The LCMXO2-7000HE-6FG484C is a MachXO2 family FPGA from Lattice Semiconductor designed for commercial embedded and interface applications. It offers a mid-density, non-volatile, instant-on FPGA architecture with 6,864 logic elements and up to 334 user I/Os for flexible integration into control, interface-bridging and display systems.

With on-chip embedded block RAM and user flash, a broad programmable I/O set and low-power options, this device is targeted at designs that require versatile I/O, in-field reconfiguration and compact BGA packaging (484-ball, 23 mm × 23 mm).

Key Features

• Core and Logic  6,864 logic elements provide mid-range programmable logic capacity suitable for glue logic, protocol bridging and control tasks.
• Embedded and Distributed Memory  Approximately 240 kbits of embedded block RAM and additional distributed RAM support FIFO and buffering functions for data flow and temporary storage.
• On-Chip User Flash  Family-level support for user flash memory enables non-volatile configuration and background programming for field updates and dual-boot options.
• Flexible I/O and Standards  Up to 334 I/Os with programmable sysIO buffers supporting a wide range of interfaces and on-chip differential termination for signal integrity and interface flexibility.
• Clocking and PLLs  Multiple primary clocks and up to two analog PLLs with fractional-N synthesis enable flexible clocking and frequency generation for high-speed interfaces.
• Power and Operating Range  Single-supply operation with a device core voltage range of 1.14 V to 1.26 V and power-saving modes suitable for low standby power operation.
• Package and Thermal  484-ball BBGA package (484-FBGA, 23×23) in a surface-mount footprint; commercial-grade operating temperature from 0 °C to 85 °C.
• System-Level Features  Hardened peripherals such as SPI, I²C and timer/counter blocks, IEEE 1149.1 boundary scan and in-system programming support simplify integration and manufacturing.

Typical Applications

• Embedded Control and Glue Logic  Mid-density logic and abundant I/Os make the device well suited for consolidating discrete logic, implementing state machines and interfacing board-level peripherals.
• Display and Video I/O  Pre-engineered source-synchronous I/O and dedicated gearing options support display interface timing and data alignment requirements.
• Memory Interface and Buffering  Embedded RAM and dedicated FIFO control logic provide buffering and staging for memory controllers or high-speed data paths.
• Sensor and Peripheral Bridging  Programmable I/O standards and on-chip peripheral blocks (SPI, I²C) enable protocol translation and aggregation of sensor/peripheral signals.
• Field Upgradeable Logic  Non-volatile configuration and background programming support in-field updates and system-level reconfiguration without full system downtime.

Unique Advantages

• Instant-on Non-Volatile Configuration: Powers up quickly with on-chip configuration memory to reduce system initialization time and simplify boot architecture.
• Broad I/O Flexibility: Large I/O count and programmable buffers let designers support multiple signaling standards from a single device, reducing component count.
• Integrated Memory Resources: Combined embedded block RAM and distributed RAM deliver on-chip buffering and storage to streamline data path designs.
• Compact BGA Footprint: 484-ball BGA packaging (23 mm × 23 mm) offers a high I/O density solution in a surface-mount form factor for space-constrained PCBs.
• Commercial-Grade Reliability: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for standard consumer and enterprise applications.

Why Choose LCMXO2-7000HE-6FG484C?

The LCMXO2-7000HE-6FG484C delivers a balance of programmable logic capacity, extensive I/O and on-chip memory in a single non-volatile FPGA device tailored for commercial embedded designs. Its combination of mid-density logic (6,864 logic elements), roughly 240 kbits of embedded memory and up to 334 I/Os makes it a practical choice for interface-heavy and control-oriented applications that require in-field reconfiguration and compact packaging.

Choosing this MachXO2 device provides scalability within the family, system-level peripherals for faster integration, and flexible clocking and I/O options that reduce external component count and simplify board-level design decisions.

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