LCMXO2-7000HE-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 661 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HE-6BG256I – MachXO2 Field Programmable Gate Array (FPGA) IC, 206 I/Os, 245,760 bits RAM, 6,864 logic elements, 256-LFBGA

The LCMXO2-7000HE-6BG256I is a MachXO2 family FPGA device providing 6,864 logic elements, 245,760 bits of embedded RAM and 206 I/O pins in a 256-ball BGA package. It implements a flexible LUT‑based architecture and on-chip non-volatile options described in the MachXO2 family data, delivering reconfigurable logic and integrated system functions for industrial designs.

Designed for applications that require dense I/O, embedded memory and instant-on reconfiguration, this device targets system control, interface bridging and display or memory interface roles where low standby power and configurable I/O standards are important.

Key Features

  • Logic Capacity — 6,864 logic elements (LUT4-based architecture) suitable for medium-density programmable logic implementations.
  • Embedded Memory — 245,760 bits of on-chip RAM; MachXO2 family supports up to approximately 240 kbits of embedded block RAM and up to 54 kbits of distributed RAM.
  • I/O Density and Flexibility — 206 I/O pins in the 256-ball package with programmable sysIO™ buffer support across multiple signaling standards noted for the MachXO2 family.
  • Non-volatile On-chip Memory — Family-level support for on-chip user Flash memory (up to 256 kbits UFM) providing background programming and secure instant-on capability.
  • Power and Voltage — Single supply operating range listed at 1.14 V to 1.26 V for the device, with MachXO2 family features that include ultra low standby power options.
  • Clocking and PLLs — Family supports multiple primary clocks and up to two analog PLLs with fractional‑N synthesis for flexible clock management (family-level capability).
  • Package Options — Device available in a 256-LFBGA package; supplier device package listed as 256-CABGA (14×14 mm).
  • Industrial Grade Temperature — Rated for operation from −40 °C to 100 °C.
  • RoHS Compliant — Device meets RoHS requirements for reduced hazardous substances.

Typical Applications

  • Interface and Glue Logic — Use the device’s 206 I/Os and flexible I/O buffering to implement protocol conversion, signal aggregation and board-level interface functions.
  • Display and Video I/O — Family-level pre‑engineered source-synchronous and gearing features support display interfaces and DDR-style signaling for display-controller glue logic.
  • Memory Interface Support — Dedicate FPGA resources and DDR/DDR2/LPDDR support capabilities at the family level to implement memory timing, DQS handling and FIFO control logic.
  • System Control and Configuration — On-chip user Flash and instant-on reconfiguration enable secure boot options, in-field updates and configuration storage for system management tasks.

Unique Advantages

  • Integrated Memory and Logic — Combines 6,864 logic elements with 245,760 bits of embedded RAM to reduce external memory needs and simplify board layout.
  • High I/O Count — 206 I/Os in a compact 256-ball package enable dense connectivity for multi-interface designs without larger packages.
  • Non-volatile Configuration — Family support for on-chip user Flash simplifies system boot and enables background programming and secure instant-on behavior.
  • Industrial Temperature Range — Rated −40 °C to 100 °C to meet many industrial environmental requirements.
  • Low Voltage Operation — Narrow supply window (1.14 V to 1.26 V) suitable for designs targeting single‑supply core domains common to the MachXO2 family.
  • Standby and Power Options — Family-level ultra low power modes and standby power options reduce system power draw during idle periods.

Why Choose LCMXO2-7000HE-6BG256I?

The LCMXO2-7000HE-6BG256I is positioned for engineers who need a medium-density, industrial-temperature FPGA with substantial I/O count and embedded memory, combined with non-volatile configuration and family-provided power-saving features. Its package and I/O capacity simplify system-level integration where board space and connectivity density matter.

This device is well suited to customers implementing interface bridging, display or memory interface logic, and system control functions that benefit from on-chip Flash, instant-on behavior and the MachXO2 family’s flexible clocking and I/O capabilities. The combination of logic, memory and configurable I/O provides a scalable option within the MachXO2 family for long-term designs.

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