LCMXO2-7000HE-6BG332I

IC FPGA 278 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA

Quantity 86 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case332-FBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HE-6BG332I – MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA

The LCMXO2-7000HE-6BG332I is a MachXO2 family non-volatile FPGA offering a flexible logic architecture with 6,864 logic elements and 278 general-purpose I/Os. Designed for industrial applications, the device combines on-chip flash, embedded and distributed RAM, and extensive I/O programmability to address system glue logic, interface bridging, and control tasks where low standby power and instant-on behavior are required.

Key Features

  • Core Logic  6,864 logic elements provide programmable logic capacity for glue logic, control, and interface functions.
  • Embedded and Distributed Memory  Approximately 240 kbits of embedded block RAM plus up to 54 kbits of distributed RAM for FIFOs, buffering and small data stores.
  • On-Chip User Flash (UFM)  Up to 256 kbits of user flash memory with 100,000 write cycles; accessible via WISHBONE, SPI, I²C and JTAG for non-volatile configuration and soft processor code.
  • I/O Versatility  278 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS family signaling, SSTL, HSTL and differential interfaces; on-chip differential termination and hot-socketing support.
  • Low Power and Power Modes  Built on an advanced 65 nm low-power process with standby power as low as 22 μW and programmable power-saving modes.
  • Clocking and PLLs  Flexible clocking with eight primary clocks and up to two analog PLLs per device to support a wide range of timing and frequency synthesis needs.
  • Configuration and Reconfiguration  Non-volatile, instant-on operation with support for single-chip secure configuration, background programming of non-volatile memory and in-field logic updates (TransFR).
  • System-Level Functions  Hardened SPI and I²C, timer/counter, on-chip oscillator (5.5% accuracy), IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
  • Package and Environmental  332-ball FBGA package (supplier package: 332-CABGA, 17 × 17 mm) with industrial operating temperature range of -40 °C to 100 °C and RoHS compliance.
  • Supply Voltage  Core supply specified between 1.14 V and 1.26 V for this device option.

Typical Applications

  • Industrial Control  Use as interface and control logic in automation equipment where industrial temperature range and non-volatile configuration are required.
  • Interface Bridging and Glue Logic  Implement protocol adaptation, bus bridging and signal conditioning using abundant I/Os and programmable logic.
  • Display and Video I/O  Pre‑engineered source-synchronous I/O and DDR gearing support display timing, buffering and data alignment tasks.
  • Embedded System Management  Store boot code or configuration parameters in on-chip user flash and use hardened I²C/SPI peripherals for system monitoring and control.

Unique Advantages

  • Highly integrated I/O and logic: 6,864 logic elements with 278 I/Os reduce external glue components and simplify board-level design.
  • Non‑volatile instant-on: On-chip flash enables immediate start-up without external configuration memory.
  • Low standby power: Advanced low-power process and power-saving modes minimize energy use in standby and duty-cycled applications.
  • Flexible memory options: Embedded block RAM, distributed RAM and user flash support a range of buffering and persistent storage needs.
  • Industrial temperature capability: Specified for -40 °C to 100 °C operation for robust performance in harsh environments.
  • System-friendly features: Hardened SPI/I²C, PLLs, on-chip oscillator and standard boundary-scan support streamline integration and debug.

Why Choose LCMXO2-7000HE-6BG332I?

The LCMXO2-7000HE-6BG332I positions itself as a compact, non-volatile FPGA option for industrial designs that require a balance of logic capacity, extensive I/O, embedded memory and low standby power. Its combination of on-chip user flash, embedded RAM and pre-engineered I/O primitives simplifies system architecture and shortens development time for control, interface and display-centric applications.

This device is suited for engineers and procurement teams looking for a scalable FPGA building block that supports in-field updates, multiple configuration interfaces and a broad temperature range, while retaining the system-level features needed for reliable deployment in industrial environments.

Request a quote or contact sales to discuss availability, lead times and pricing for the LCMXO2-7000HE-6BG332I.

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