LCMXO2-7000HE-6BG332I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA |
|---|---|
| Quantity | 86 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 278 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-6BG332I – MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA
The LCMXO2-7000HE-6BG332I is a MachXO2 family non-volatile FPGA offering a flexible logic architecture with 6,864 logic elements and 278 general-purpose I/Os. Designed for industrial applications, the device combines on-chip flash, embedded and distributed RAM, and extensive I/O programmability to address system glue logic, interface bridging, and control tasks where low standby power and instant-on behavior are required.
Key Features
- Core Logic 6,864 logic elements provide programmable logic capacity for glue logic, control, and interface functions.
- Embedded and Distributed Memory Approximately 240 kbits of embedded block RAM plus up to 54 kbits of distributed RAM for FIFOs, buffering and small data stores.
- On-Chip User Flash (UFM) Up to 256 kbits of user flash memory with 100,000 write cycles; accessible via WISHBONE, SPI, I²C and JTAG for non-volatile configuration and soft processor code.
- I/O Versatility 278 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS family signaling, SSTL, HSTL and differential interfaces; on-chip differential termination and hot-socketing support.
- Low Power and Power Modes Built on an advanced 65 nm low-power process with standby power as low as 22 μW and programmable power-saving modes.
- Clocking and PLLs Flexible clocking with eight primary clocks and up to two analog PLLs per device to support a wide range of timing and frequency synthesis needs.
- Configuration and Reconfiguration Non-volatile, instant-on operation with support for single-chip secure configuration, background programming of non-volatile memory and in-field logic updates (TransFR).
- System-Level Functions Hardened SPI and I²C, timer/counter, on-chip oscillator (5.5% accuracy), IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
- Package and Environmental 332-ball FBGA package (supplier package: 332-CABGA, 17 × 17 mm) with industrial operating temperature range of -40 °C to 100 °C and RoHS compliance.
- Supply Voltage Core supply specified between 1.14 V and 1.26 V for this device option.
Typical Applications
- Industrial Control Use as interface and control logic in automation equipment where industrial temperature range and non-volatile configuration are required.
- Interface Bridging and Glue Logic Implement protocol adaptation, bus bridging and signal conditioning using abundant I/Os and programmable logic.
- Display and Video I/O Pre‑engineered source-synchronous I/O and DDR gearing support display timing, buffering and data alignment tasks.
- Embedded System Management Store boot code or configuration parameters in on-chip user flash and use hardened I²C/SPI peripherals for system monitoring and control.
Unique Advantages
- Highly integrated I/O and logic: 6,864 logic elements with 278 I/Os reduce external glue components and simplify board-level design.
- Non‑volatile instant-on: On-chip flash enables immediate start-up without external configuration memory.
- Low standby power: Advanced low-power process and power-saving modes minimize energy use in standby and duty-cycled applications.
- Flexible memory options: Embedded block RAM, distributed RAM and user flash support a range of buffering and persistent storage needs.
- Industrial temperature capability: Specified for -40 °C to 100 °C operation for robust performance in harsh environments.
- System-friendly features: Hardened SPI/I²C, PLLs, on-chip oscillator and standard boundary-scan support streamline integration and debug.
Why Choose LCMXO2-7000HE-6BG332I?
The LCMXO2-7000HE-6BG332I positions itself as a compact, non-volatile FPGA option for industrial designs that require a balance of logic capacity, extensive I/O, embedded memory and low standby power. Its combination of on-chip user flash, embedded RAM and pre-engineered I/O primitives simplifies system architecture and shortens development time for control, interface and display-centric applications.
This device is suited for engineers and procurement teams looking for a scalable FPGA building block that supports in-field updates, multiple configuration interfaces and a broad temperature range, while retaining the system-level features needed for reliable deployment in industrial environments.
Request a quote or contact sales to discuss availability, lead times and pricing for the LCMXO2-7000HE-6BG332I.

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