LCMXO2-7000HE-6BG332C

The LCMXO2-7000HE-6BG332C is a MachXO2 family FPGA IC offering a flexible logic architecture with 6,864 logic elements and extensive I/O capability. Designed for commercial embedded systems, it combines on-chip memory, non-volatile configuration, and low-power operation to address glue-logic, control, and interface functions in a variety of electronic designs.

Its combination of programmable logic, embedded RAM, and a wide I/O set enables integration of interface bridging, control, and timing functions while reducing external component count and simplifying system design.

Key Features

• Logic Resources  6,864 logic elements suitable for implementing glue logic, state machines, and moderate-density programmable functions.
• Embedded Memory  Approximately 245,760 bits (≈0.246 Mbits) of on-chip RAM for buffering, FIFOs and small data stores; family supports distributed RAM and embedded block RAM configurations.
• On-Chip Non-Volatile Configuration  MachXO2 family supports on-chip user flash memory and instant-on capability for single-chip, non-volatile configuration and background programming.
• I/O Density & Flexibility  278 programmable I/Os with support for a wide range of signaling options provided by the MachXO2 I/O buffer architecture (differential and single‑Ended interfaces supported in the family).
• Low Power Operation  Built on a low-power process with standby modes available; family datasheet lists ultra-low standby power options for energy-conscious designs.
• Clocking & PLLs  Family-level clocking resources include multiple primary clocks and up to two analog PLLs for flexible frequency synthesis and timing control.
• Package & Mounting  332-ball FBGA package (supplier package: 332-CABGA, 17 × 17 mm) designed for surface-mount assembly and high I/O density.
• Power & Temperature  Supply voltage range 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
• Standards & Reliability  RoHS compliant and supports industry-standard configuration and test features at the family level.

Typical Applications

• Interface Bridging  Use as a protocol bridge or I/O consolidator to translate between various digital interfaces and reduce system BOM.
• User Interface Control  Implement keypad scanning, LED/segment drivers and display gearing with dedicated I/O and embedded memory to buffer animation or frame data.
• Peripheral & Sensor Aggregation  Aggregate multiple sensors or peripherals and implement preprocessing, filtering or timing functions in programmable logic.
• Glue Logic & System Control  Replace multiple discrete logic devices and CPLs with a single programmable device for board-level control, sequencing and state-machine functions.

Unique Advantages

• Highly Integrated I/O Count: 278 I/Os in a single 332-ball FBGA reduce the need for external multiplexers and expanders, simplifying PCB routing and lowering BOM cost.
• Non-Volatile, Instant-On Capability: On-chip configuration flash enables single-chip power-up with background programming and secure configuration options.
• Embedded Memory Resources: Approximately 0.246 Mbits of on-chip RAM supports FIFOs, buffering and small program/data storage without external SRAM.
• Low-Power Architecture: Family-level low standby power and power-saving modes support energy-efficient system designs.
• Compact High-Density Package: 332-CABGA (17 × 17 mm) package provides high I/O density in a compact footprint suitable for space-constrained applications.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match commercial embedded product requirements.

Why Choose LCMXO2-7000HE-6BG332C?

The LCMXO2-7000HE-6BG332C delivers a balanced combination of moderate logic capacity, substantial I/O density and on-chip memory within a compact 332-ball FBGA package. It is well suited for designers looking to consolidate interface logic, implement system control functions, or add programmable peripherals without the overhead of larger FPGA families.

Backed by MachXO2 family features—such as non-volatile configuration, embedded memory and low-power operation—this device offers a scalable solution for commercial embedded applications where integration, flexibility and predictable supply-voltage and temperature ranges matter.

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