LCMXO2-7000HE-6BG256C

The LCMXO2-7000HE-6BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) IC optimized for low-power, instant-on system logic and flexible I/O interfacing. Built to provide a compact, non-volatile programmable fabric, this device targets embedded systems requiring configurable glue logic, protocol bridging and system control in a commercial-temperature-rated product.

With 6,864 logic elements, approximately 240 kbits of embedded RAM and 206 user I/Os in a 256-ball package, the device delivers a balance of integration and I/O density for designs that need on-chip memory, configurable I/O standards and in-field reconfiguration capability.

Key Features

• Core Logic  6,864 logic elements suitable for glue logic, control functions and moderate-density programmable logic tasks.
• Embedded Memory  Approximately 240 kbits of on-chip RAM (245,760 total RAM bits) for FIFOs, buffers and small data storage without external memory.
• I/O Density and Flexibility  206 user I/Os provide broad connectivity for interfaces, sensors and peripherals in a single device footprint.
• Non-Volatile Configuration  MachXO2 family features include on-chip user Flash memory and instant-on, enabling single-chip, non-volatile configuration and in-field reconfiguration (series-level capability).
• Low Power Operation  Designed on an advanced low-power process (MachXO2 family characteristic) to support energy-conscious embedded designs.
• Clocking and Timing  Family-level support for multiple primary clocks and PLLs provides flexible clocking options for synchronous designs.
• Package and Mounting  256-ball LFBGA package; supplier device package listed as 256-CABGA (14×14). Surface-mount mounting type simplifies PCB assembly for compact systems.
• Supply and Temperature  Operating supply range: 1.14 V to 1.26 V. Commercial temperature range: 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant for reduced hazardous substances in manufacturing and assembly.

Typical Applications

• Embedded control and system glue  Use the MachXO2 FPGA to implement board-level control logic, sequencers and interface translators without external CPLDs or discrete logic.
• Interface bridging and protocol handling  High I/O count and flexible I/O options make the device suitable for bridging between peripheral buses, sensors and host interfaces.
• Display and peripheral timing  On-chip memory and configurable clocking support timing-critical tasks such as FIFO buffering and display gear-down functions.
• Sensor and I/O aggregation  Aggregate signals from multiple sensors or user controls and provide conditioned, debounced or formatted outputs to system controllers.

Unique Advantages

• High integration in a compact package: 6,864 logic elements and 206 I/Os in a 256-ball BGA package reduce board-level part count and simplify routing for dense designs.
• On-chip RAM for local buffering: Approximately 240 kbits of embedded memory enables internal FIFOs and data buffering without external SRAM.
• Non-volatile, instant-on capability: Series-level on-chip Flash configuration supports single-chip, instant-on systems and field updates without external configuration PROM.
• Flexible power and clock options: Narrow supply range and family clocking features support stable, low-noise operation and multiple clock domains within a design.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, appropriate for indoor and controlled-environment electronic products.
• RoHS compliance: Helps meet environmental and regulatory requirements for assembled products.

Why Choose LCMXO2-7000HE-6BG256C?

The LCMXO2-7000HE-6BG256C positions itself as a versatile, low-power FPGA option for designers needing moderate logic density, significant I/O capacity and on-chip memory in a compact BGA package. It is well suited for embedded applications that benefit from non-volatile configuration, in-field reconfiguration and integrated buffering without adding external memory or configuration PROMs.

This device is ideal for OEMs and design teams building consumer and commercial embedded systems that require scalable logic, predictable power and a compact footprint. Family-level features support density migration and common system functions, helping preserve design investment across product iterations.

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