LCMXO2-7000HE-5FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA |
|---|---|
| Quantity | 493 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-5FTG256C – MachXO2 FPGA, 6864 logic elements, 206 I/Os, 256-LBGA
The LCMXO2-7000HE-5FTG256C is a MachXO2 field programmable gate array from Lattice Semiconductor Corporation. It implements a flexible logic architecture with 6,864 logic elements and support for up to 206 general-purpose I/Os in a compact 256-ball BGA package.
Designed for commercial embedded systems, this device provides on-chip nonvolatile configuration, embedded RAM, programmable I/O signaling, and low-power modes that simplify system integration for display interfaces, memory glue logic, and general-purpose control functions.
Key Features
- Logic Capacity — 6,864 logic elements suitable for medium-density control, interface, and glue-logic implementations.
- On-chip Memory — Total on-chip RAM: 245,760 bits (approximately 246 kbits) for embedded and distributed memory needs.
- I/O and Package — 206 I/Os in a 256-ball LBGA package (supplier device package: 256-FTBGA, 17×17 mm) for high-density board integration.
- Supply and Temperature — Single supply operation in the range 1.14 V to 1.26 V; commercial grade with an operating temperature range of 0 °C to 85 °C.
- Low Power Architecture — Built on an advanced 65 nm low-power process with standby and power-saving options documented for the MachXO2 family.
- On-Chip Flash and Reconfiguration — Nonvolatile user flash memory (up to 256 kbits in the MachXO2 family), instant-on behavior, background programming, and in-field reconfiguration capabilities.
- Flexible I/O and Memory Interfaces — Programmable sysIO buffers supporting a wide range of interfaces and pre-engineered source-synchronous I/O including DDR/DDRx and dedicated gearing for display I/Os.
- Clocking and PLLs — Up to two analog PLLs per device (fractional-n supported) and multiple primary clocks for system timing flexibility.
- System Functions — Hardened on-chip functions such as SPI, I²C and timer/counter, plus an on-chip oscillator and IEEE 1149.1 boundary scan support as part of the MachXO2 feature set.
- Regulatory and Packaging — RoHS-compliant with a variety of BGA package options and advanced halogen-free packaging in the family.
Typical Applications
- Display and Video I/O — Implements display gearing and source-synchronous interfaces for display panels and video path buffering.
- Memory Interface Glue Logic — Provides DDR/DDR2/LPDDR interface support and dedicated gearing logic to bridge processors and external memory subsystems.
- System Control and Glue — Replaces discrete glue logic for board-level control, signal conditioning, and protocol adaptation.
- In-field Updatable Logic — Enables field reconfiguration and background programming for firmware updates and feature additions without full board replacement.
Unique Advantages
- Nonvolatile, Instant‑On Configuration: Single-chip, flash-based configuration enables rapid startup and secure single-chip solutions.
- High I/O Density in a Compact Package: 206 I/Os in a 256-ball BGA (256-FTBGA, 17×17) reduces board area and simplifies routing for complex I/O designs.
- Integrated Memory Resources: Approximately 246 kbits of on-chip RAM supports FIFOs, buffering, and small data structures without external memory.
- Flexible, Programmable I/O Standards: Programmable sysIO buffers and differential I/O options support a broad set of signaling standards for mixed-signal systems.
- Power Management Options: Low-power 65 nm process and standby modes help reduce system power consumption during idle periods.
- Built-in System Functions: On-chip SPI, I²C, timers, oscillator and boundary-scan support reduce BOM and simplify board-level verification.
Why Choose LCMXO2-7000HE-5FTG256C?
This MachXO2 device combines medium-density logic (6,864 logic elements) with substantial I/O count (206 pins), integrated on-chip RAM (approximately 246 kbits), and nonvolatile configuration to deliver a compact, reconfigurable building block for commercial embedded designs. Its programmable I/O, clocking resources and in-field update capability make it well suited to display interfaces, memory bridging, and system glue logic where flexibility, compactness, and low standby power are important.
For designers seeking a commercially graded FPGA solution with single-supply operation (1.14 V to 1.26 V), RoHS compliance, and a 0 °C to 85 °C operating range, the LCMXO2-7000HE-5FTG256C offers a balanced combination of integration, configurability, and on-board system features drawn from the MachXO2 family.
Request a quote or submit an inquiry for pricing and availability of the LCMXO2-7000HE-5FTG256C to evaluate it for your next embedded design.