LCMXO2-7000HE-5FTG256C

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA

Quantity 493 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HE-5FTG256C – MachXO2 FPGA, 6864 logic elements, 206 I/Os, 256-LBGA

The LCMXO2-7000HE-5FTG256C is a MachXO2 field programmable gate array from Lattice Semiconductor Corporation. It implements a flexible logic architecture with 6,864 logic elements and support for up to 206 general-purpose I/Os in a compact 256-ball BGA package.

Designed for commercial embedded systems, this device provides on-chip nonvolatile configuration, embedded RAM, programmable I/O signaling, and low-power modes that simplify system integration for display interfaces, memory glue logic, and general-purpose control functions.

Key Features

  • Logic Capacity — 6,864 logic elements suitable for medium-density control, interface, and glue-logic implementations.
  • On-chip Memory — Total on-chip RAM: 245,760 bits (approximately 246 kbits) for embedded and distributed memory needs.
  • I/O and Package — 206 I/Os in a 256-ball LBGA package (supplier device package: 256-FTBGA, 17×17 mm) for high-density board integration.
  • Supply and Temperature — Single supply operation in the range 1.14 V to 1.26 V; commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Low Power Architecture — Built on an advanced 65 nm low-power process with standby and power-saving options documented for the MachXO2 family.
  • On-Chip Flash and Reconfiguration — Nonvolatile user flash memory (up to 256 kbits in the MachXO2 family), instant-on behavior, background programming, and in-field reconfiguration capabilities.
  • Flexible I/O and Memory Interfaces — Programmable sysIO buffers supporting a wide range of interfaces and pre-engineered source-synchronous I/O including DDR/DDRx and dedicated gearing for display I/Os.
  • Clocking and PLLs — Up to two analog PLLs per device (fractional-n supported) and multiple primary clocks for system timing flexibility.
  • System Functions — Hardened on-chip functions such as SPI, I²C and timer/counter, plus an on-chip oscillator and IEEE 1149.1 boundary scan support as part of the MachXO2 feature set.
  • Regulatory and Packaging — RoHS-compliant with a variety of BGA package options and advanced halogen-free packaging in the family.

Typical Applications

  • Display and Video I/O — Implements display gearing and source-synchronous interfaces for display panels and video path buffering.
  • Memory Interface Glue Logic — Provides DDR/DDR2/LPDDR interface support and dedicated gearing logic to bridge processors and external memory subsystems.
  • System Control and Glue — Replaces discrete glue logic for board-level control, signal conditioning, and protocol adaptation.
  • In-field Updatable Logic — Enables field reconfiguration and background programming for firmware updates and feature additions without full board replacement.

Unique Advantages

  • Nonvolatile, Instant‑On Configuration: Single-chip, flash-based configuration enables rapid startup and secure single-chip solutions.
  • High I/O Density in a Compact Package: 206 I/Os in a 256-ball BGA (256-FTBGA, 17×17) reduces board area and simplifies routing for complex I/O designs.
  • Integrated Memory Resources: Approximately 246 kbits of on-chip RAM supports FIFOs, buffering, and small data structures without external memory.
  • Flexible, Programmable I/O Standards: Programmable sysIO buffers and differential I/O options support a broad set of signaling standards for mixed-signal systems.
  • Power Management Options: Low-power 65 nm process and standby modes help reduce system power consumption during idle periods.
  • Built-in System Functions: On-chip SPI, I²C, timers, oscillator and boundary-scan support reduce BOM and simplify board-level verification.

Why Choose LCMXO2-7000HE-5FTG256C?

This MachXO2 device combines medium-density logic (6,864 logic elements) with substantial I/O count (206 pins), integrated on-chip RAM (approximately 246 kbits), and nonvolatile configuration to deliver a compact, reconfigurable building block for commercial embedded designs. Its programmable I/O, clocking resources and in-field update capability make it well suited to display interfaces, memory bridging, and system glue logic where flexibility, compactness, and low standby power are important.

For designers seeking a commercially graded FPGA solution with single-supply operation (1.14 V to 1.26 V), RoHS compliance, and a 0 °C to 85 °C operating range, the LCMXO2-7000HE-5FTG256C offers a balanced combination of integration, configurability, and on-board system features drawn from the MachXO2 family.

Request a quote or submit an inquiry for pricing and availability of the LCMXO2-7000HE-5FTG256C to evaluate it for your next embedded design.

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