LCMXO2-7000HE-5FG484I

The LCMXO2-7000HE-5FG484I is a MachXO2 family FPGA delivering 6,864 logic elements, 334 user I/Os and surface-mount 484-ball BGA packaging for compact, high-pin-count designs. It combines flexible low-power logic, on-chip memory and system-level peripherals in an industrial-grade device rated from -40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V.

This device targets embedded and industrial applications that require high I/O density, configurable glue logic, and non-volatile configuration options while maintaining low standby power and robust temperature performance.

Key Features

• Core Logic  Approximately 6,864 logic elements provide programmable LUT4-based fabric for glue logic, control and custom finite-state machines.
• On-chip Memory  Total on-chip RAM of 245,760 bits (approximately 246 kbits) for embedded and distributed RAM requirements, plus family support for User Flash Memory up to 256 kbits.
• I/O Density & Flexibility  334 user I/Os in a 484-ball FBGA package support high-pin-count systems and a wide set of signalling standards via programmable sysIO buffers.
• Low Power Operation  Built on a 65 nm low-power process with standby modes and power-saving options to minimize idle energy consumption.
• Package & Mounting  484-ball FBGA (23 × 23 mm) surface-mount package for compact board-level integration and high I/O routing density.
• Industrial Temperature Range  Rated for -40 °C to 100 °C to meet demanding ambient conditions common in industrial systems.
• Clocking & PLLs  Family supports multiple primary clocks and up to two analog PLLs for flexible clock generation and frequency synthesis.
• Non-volatile Configuration & Reconfiguration  On-chip user flash memory and TransFR reconfiguration capability enable instant-on behavior and in-field logic updates.
• System Integration  On-chip hardened peripherals in the family include SPI, I2C and timers/counters to simplify system-level design.

Typical Applications

• Industrial Control  High I/O count and extended temperature rating make this FPGA suitable for sensor interfacing, I/O aggregation and control logic in factory and process automation.
• Interface Bridging  Programmable sysIO buffers and DDR/gear logic support protocol translation and bus interfacing between legacy and modern peripherals.
• Display & Video Logic  Pre‑engineered source-synchronous I/O and gearing features support display timing, DDR registers and signal conditioning for panel and display controllers.
• Embedded Glue Logic  On-chip memory and plentiful I/Os allow consolidation of glue logic, bus arbitration and peripheral control into a single device, reducing BOM and board area.

Unique Advantages

• High I/O Integration: 334 available I/Os in a single 484-BBGA package reduce the need for external I/O expanders and simplify routing for dense systems.
• Integrated Non-volatile Configuration: On-chip user flash enables single-chip instant-on designs and supports background programming and dual-boot strategies.
• Robust for Industrial Use: Industrial temperature rating (-40 °C to 100 °C) and surface-mount packaging support deployment in harsh environments.
• Memory Resources: Approximately 246 kbits of on-chip RAM provide sufficient embedded memory for FIFOs, buffering and local state storage without external SRAM.
• Flexible Clocking & PLLs: Multiple primary clocks and up to two analog PLLs allow precise frequency synthesis for varied interface timing requirements.
• Reduced System Complexity: Hardened SPI, I2C and timer/counter functions simplify software and firmware design by offloading common tasks to the device.

Why Choose LCMXO2-7000HE-5FG484I?

This MachXO2 device combines substantial logic capacity, high I/O count and embedded memory with industrial temperature operation and low-power characteristics to address demanding embedded and industrial designs. Its on-chip non-volatile configuration and reconfiguration capabilities make it suitable for applications that require instant-on behavior and in-field updates.

Choose the LCMXO2-7000HE-5FG484I for designs that need a compact, highly integrated FPGA solution to consolidate glue logic, interface bridging and control functions while maintaining robust temperature and power profiles.

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