LCMXO2-7000HE-5FTG256I

The LCMXO2-7000HE-5FTG256I is a MachXO2 family field programmable gate array (FPGA) IC from Lattice Semiconductor. It provides a flexible logic architecture with 6,864 logic elements and extensive I/O connectivity, targeted at industrial applications requiring reconfigurable logic, interface bridging, and embedded system control.

Designed for low-power operation and system-level integration, this device combines embedded block RAM, on-chip user flash memory, pre-engineered I/O features and non-volatile instant-on configuration to simplify system design and enable in-field updates.

Key Features

• Logic Capacity — 6,864 logic elements suitable for mid-density FPGA functions and glue-logic integration.
• Embedded Memory — Total RAM bits: 245,760 (approximately 240 kbits) of embedded block and distributed RAM for FIFOs, buffers and small data structures.
• On-Chip Non-Volatile Flash — Family supports up to 256 kbits of user flash memory for configuration and user storage; supports background programming and multiple programming interfaces.
• I/O Count & Flexibility — 206 I/Os with programmable sysIO™ buffer support for a wide range of standards and on-chip differential termination and hot-socketing support (pre‑engineered DDR and display gearing available in the family).
• Power — Advanced low-power process with standby modes; family-level standby power can be as low as 22 μW, enabling low-power system designs.
• Clocking & PLLs — Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs (fractional‑n capable) for diverse timing and interface requirements.
• Non-Volatile, Reconfigurable — Instant-on behavior with single-chip non-volatile configuration; supports in-field TransFR™ reconfiguration for logic updates while the system operates.
• System-Level Functions — Hardened SPI and I²C, timer/counter, on-chip oscillator and unique TraceID for tracking; IEEE 1149.1 boundary scan and IEEE 1532 in-system programming supported by the family.
• Package & Temperature — 256-LBGA package (supplier package: 256-FTBGA, 17×17 mm), surface-mount; operating temperature range −40 °C to 100 °C suitable for industrial environments.
• Supply Voltage — Core supply range: 1.14 V to 1.26 V.

Typical Applications

• Industrial Control — Implement motor control glue logic, sensor interfacing and deterministic I/O handling using the device’s I/O density and industrial temperature rating.
• Interface Bridging — Bridge heterogeneous interfaces and implement protocol adaptation leveraging the programmable sysIO buffer options and extensive I/O count.
• Display and Memory Interfaces — Use pre-engineered source synchronous I/O, DDR registers, and display gearing for display controllers and memory interface logic (DDR/DDR2/LPDDR support is provided by the family).
• Embedded System Glue — Provide glue logic, small buffering and control functions with on-chip RAM and user flash for configuration and firmware storage.

Unique Advantages

• High I/O Density: 206 programmable I/Os enable complex system interconnects and multiple external interfaces without external multiplexing.
• Non-Volatile, Instant-On: Single-chip flash-based configuration powers up rapidly and supports in-field updates, simplifying deployment and maintenance.
• Integrated Memory Resources: Approximately 240 kbits of embedded RAM plus on-chip user flash reduce external memory requirements for control and buffering tasks.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to meet many industrial application environmental requirements.
• Flexible Clocking and PLLs: Multiple primary clocks and up to two analog PLLs support diverse timing needs for high-speed interfaces and system synchronization.
• System-Level Integration: Hardened peripherals (SPI, I²C, timers), oscillator, and boundary-scan support simplify board-level design and manufacturing test.

Why Choose LCMXO2-7000HE-5FTG256I?

The LCMXO2-7000HE-5FTG256I positions itself as a mid-density, industrial-grade MachXO2 FPGA offering a balance of logic capacity, on-chip memory and high I/O count in a compact 256-pin ftBGA package. Its non-volatile architecture and in-field reconfiguration capabilities reduce system complexity while enabling rapid boot and deployable updates.

This device is well suited for designers needing reliable, reconfigurable logic for industrial control, interface bridging, display and memory interface tasks, or embedded system glue logic where temperature tolerance, integrated memory and rich I/O options matter.

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