LCMXO2-7000HE-5FG484C

The LCMXO2-7000HE-5FG484C is a MachXO2 family Field Programmable Gate Array (FPGA) IC providing 6864 logic elements and a high-density I/O count in a compact ball-grid package. It combines a flexible logic architecture with embedded memory, on-chip user flash, and advanced I/O features targeted at system control, interface bridging, and display/memory interface applications.

Designed for low-power operation and fast startup, this device targets commercial embedded systems that require dense logic, abundant I/Os, and field reconfiguration capabilities while operating within a 0 °C to 85 °C range and a 1.14 V to 1.26 V supply window.

Key Features

• Core Logic 6864 logic elements (LUT4-based architecture) providing flexible combinational and sequential logic resources for glue logic, protocol conversion, and custom control functions.
• High-density I/O 334 programmable I/Os to support complex interface requirements and multiple parallel buses in a single device.
• Embedded and Distributed Memory Approximately 240 kbits of embedded block RAM and up to 54 kbits of distributed RAM for FIFO buffering, small data stores, and packet queuing.
• On-chip User Flash Family-level support for up to 256 kbits of non-volatile user flash memory enabling single-chip, secure configuration and background programming.
• Advanced I/O Standards Programmable sysIO buffers support a wide range of standards (LVCMOS, LVTTL, LVDS variants, SSTL, HSTL, PCI and others) and include programmable pull modes and on-chip differential termination.
• Source-Synchronous and DDR Support Pre-engineered source-synchronous I/O with DDR registers in I/O cells, gearing for display interfaces, and dedicated logic for DDR/DDR2/LPDDR memory interfaces.
• Clocking and PLLs Up to eight primary clocks, edge clocks for high-speed I/O, and up to two analog PLLs with fractional-N synthesis for flexible clock management.
• Low Power and Fast Startup Built on an advanced 65 nm low-power process with standby options (standby power as low as family-reported 22 μW) and instant-on capability for rapid system availability.
• Reconfiguration and System Support TransFR in-field reconfiguration, background programming, optional dual-boot with external SPI, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
• Package and Environmental 484-ball BGA package (supplier package listed as 484-FBGA, 23 × 23 mm) with surface-mount mounting and commercial temperature grade (0 °C to 85 °C). RoHS compliant.

Typical Applications

• System Control and Glue Logic — Implement board-level control, protocol bridging, and finite-state machines using the device’s dense logic and abundant I/Os.
• Interface Bridging and I/O Expansion — Consolidate multiple parallel and serial interfaces in a single programmable device, leveraging the wide range of supported I/O standards.
• Display and Memory Interfaces — Use pre-engineered source-synchronous I/O, DDR registers, and gearing logic for display pipelines and DDR memory interfacing.
• Field-upgradeable Embedded Systems — Take advantage of TransFR reconfiguration and on-chip user flash for firmware updates and secure configuration without external reprogramming hardware.

Unique Advantages

• Highly integrated I/O and logic: 334 I/Os combined with 6864 logic elements reduce external glue logic and simplify board-level architecture.
• On-chip non-volatile configuration: Built-in user flash enables single-chip configuration and background programming, streamlining system startup and maintenance.
• Memory resources for buffering: Approximately 240 kbits embedded RAM plus distributed RAM support FIFOs and packet buffering without external SRAM.
• Flexible clocking and PLLs: Multiple primary clocks and up to two analog PLLs allow adaptable timing architectures for mixed-speed interfaces.
• Low-power operation and instant-on: 65 nm low-power process with standby modes and fast power-up behavior suits energy-sensitive commercial designs.
• Reconfiguration in field: TransFR enables in-field logic updates while the system operates, reducing downtime for updates and bug fixes.

Why Choose LCMXO2-7000HE-5FG484C?

This MachXO2 device offers a balance of dense logic, extensive I/O capability, embedded memory, and on-chip non-volatile configuration suitable for commercial embedded systems that require flexible interface support and field reconfigurability. Its combination of instant-on behavior, low-power design, and system-level features (PLLs, DDR support, hardened I2C/SPI/timer functions) makes it well suited for applications where integration, maintainability, and fast start-up are important.

Choose this device when your design needs a programmable, reconfigurable fabric with high I/O density in a compact 484-ball BGA package, operating across a commercial temperature range and standard low-voltage supply rails.

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