LCMXO2-7000HE-5BG256C

The LCMXO2-7000HE-5BG256C is a MachXO2 family FPGA providing a flexible logic architecture with 6,864 logic elements and 206 I/Os in a 256-ball BGA package. It combines embedded and distributed memory, on-chip user flash, and programmable I/O to address control, interface and system-integration tasks in commercial embedded applications.

Designed for low-power, instant-on operation, the device supports advanced I/O standards, dedicated DDR and display gearing logic, and on-chip configuration memory—enabling compact, reconfigurable solutions where integration, board space and power matter.

Key Features

• Core Logic — 6,864 logic elements (LUT4) offering flexible LUT-based architecture for glue logic, control and custom processing functions.
• Embedded and Distributed Memory — 245,760 total RAM bits (up to the family’s documented ~240 kbits of embedded block RAM) plus distributed RAM for FIFOs and buffer storage.
• On-Chip User Flash — Up to 256 kbits of non-volatile user flash memory for configuration or soft-processor PROM, with support for background programming and up to 100,000 write cycles.
• I/O Capacity and Flexibility — 206 I/Os with programmable sysIO buffer support for a wide range of signaling standards and dedicated pre‑engineered source-synchronous I/O including DDR registers and display gearing.
• Low Power Operation — Built on an advanced 65 nm low-power process with standby power as low as 22 μW and programmable power-saving modes.
• Clocking and Timing — Multiple primary clocks, up to two edge clocks for high-speed I/O interfaces, and up to two analog PLLs with fractional-N frequency synthesis.
• System-Level Integration — Hardened functions such as SPI, I2C and timer/counter, on-chip oscillator (~5.5% accuracy), IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
• Non-volatile, Reconfigurable — Instant-on, single-chip secure configuration with support for background programming, optional dual-boot with external SPI memory and TransFR in-field reconfiguration.
• Packaging and Environmental — Available in a 256-ball LFBGA / 256-CABGA (14 × 14 mm) package, surface-mount, RoHS compliant; commercial grade with operating range 0 °C to 85 °C and supply voltage 1.14 V to 1.26 V.

Typical Applications

• Interface Bridging and Glue Logic — High I/O count and flexible I/O standards make the device well-suited for protocol conversion, bus bridging and board-level glue logic.
• Memory and Display Interfaces — Pre-engineered source-synchronous I/O, DDR registers and display gearing support use in DDR memory interfaces and display timing/control implementations.
• Embedded Control and Peripheral Management — On-chip SPI, I2C and timer/counter blocks simplify integration of sensor hubs, local controllers and peripheral management functions.
• Field Upgradeable Logic — On-chip flash with background programming and TransFR reconfiguration enables in-field firmware updates and evolving feature sets without hardware changes.

Unique Advantages

• High integration density: 6,864 logic elements and 245,760 bits of on-chip RAM reduce external component count and simplify board design.
• Extensive I/O capability: 206 programmable I/Os with support for multiple voltage standards and dedicated DDR/display logic allow versatile interface options.
• Non-volatile instant-on: On-chip user flash provides secure, single-chip configuration with fast power-up behavior and background programming.
• Low standby power: Advanced 65 nm low-power process with standby power as low as 22 μW helps minimize system idle power consumption.
• Field reconfiguration: TransFR in-field logic update capability enables live system updates and design iteration after deployment.
• Compact package: 256-ball BGA (14 × 14 mm) offers a small footprint for space-constrained boards while providing high I/O count.

Why Choose LCMXO2-7000HE-5BG256C?

The LCMXO2-7000HE-5BG256C positions itself as a compact, low-power, and highly integrated FPGA option within the MachXO2 family. With 6,864 logic elements, substantial embedded memory, and 206 flexible I/Os, it supports a broad set of embedded control, interface and display-centric designs where instant-on, reconfigurability and system-level integration are important.

Its combination of on-chip non-volatile flash, hardened SPI/I2C/timer functions, and field upgrade capability delivers long-term design flexibility and reduced bill-of-materials for commercial embedded designs requiring robust configuration and interface handling.

Request a quote or submit an RFQ to get pricing, availability and support for integrating the LCMXO2-7000HE-5BG256C into your next design.