LCMXO2-7000HE-4TG144I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP |
|---|---|
| Quantity | 401 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 114 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-4TG144I – MachXO2 FPGA, 114 I/Os, 6864 logic elements, 144-LQFP
The LCMXO2-7000HE-4TG144I is a MachXO2 family Field Programmable Gate Array (FPGA) IC offering 6,864 logic elements, approximately 240 kbits of embedded RAM (245,760 bits), and 114 general-purpose I/Os in a 144-pin LQFP/TQFP package. Designed for industrial-grade applications, it combines medium-to-high logic density, extensive I/O capability, and low-power operation for embedded control, interface bridging, and system glue logic.
Built on a low-power process and including family-level features such as on-chip non-volatile flash, flexible I/O standards and DDR support, the device is suited to applications that require robust temperature range, instant-on configuration, and reconfigurable logic in a compact surface-mount package.
Key Features
- Core Logic – 6,864 logic elements (cells) providing programmable logic capacity for glue logic, state machines, and mid-density processing tasks.
- Embedded Memory – Approximately 240 kbits of on-chip RAM (245,760 bits) for FIFOs, buffers, and local data storage.
- I/O Resources – 114 I/Os with programmable sysIO buffer options and support for a wide range of interfaces; includes features for source-synchronous and DDR signaling.
- Low-Power Operation – Family-level low-power 65 nm process and standby power as low as 22 μW (family data) help minimize system power consumption.
- Non-volatile Configuration – MachXO2 family supports on-chip user flash memory and instant-on behavior for single-chip, a secure configuration with background programming options.
- Clocking and PLLs – Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device (family-level capability) for fractional-N synthesis and broad input frequency support.
- System Functions – Hardened on-chip peripherals at the family level including SPI, I²C, timer/counter and an on-chip oscillator for embedded control and system monitoring.
- Package & Mounting – Surface-mount 144-LQFP (supplier package listed as 144-TQFP, 20×20 mm) for compact PCB layouts; RoHS compliant.
- Industrial Temperature Range – Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Voltage Supply – Supported supply range listed as 1.14 V to 1.26 V for the core domain.
Typical Applications
- Industrial Control – Programmable logic, timers and I/O density enable motor control supervision, protocol bridging, and deterministic control in industrial systems across −40 °C to 100 °C.
- Interface Bridging and Glue Logic – Use the device to consolidate interface translation, level shifting and board-level glue functions with ample I/Os and embedded memory for buffering.
- Memory and High-Speed I/O Interfaces – Pre-engineered source-synchronous and DDR-capable I/O cells and gearing options support memory interface control and high-speed data capture.
- Embedded System Control – On-chip SPI/I²C, timer/counter and oscillator resources simplify supervisory tasks, configuration management and peripheral control in compact systems.
Unique Advantages
- Medium-to-High Logic Density – 6,864 logic elements allow implementation of complex glue logic and moderate-scale processing without external CPLDs or discrete logic.
- Significant On-Chip Memory – Approximately 240 kbits of embedded RAM supports FIFO buffering and local data storage, reducing external memory requirements.
- Broad I/O Flexibility – 114 I/Os with programmable buffer types and DDR/source-synchronous support enable a wide range of interface standards and system topologies.
- Low Standby Power – Family-level low-power silicon and standby modes help reduce overall system power draw for energy-conscious designs.
- Industrial Reliability – Industrial operating temperature range and surface-mount 144-pin package provide robustness for demanding field deployments.
- Non-volatile, Reconfigurable – Instant-on behavior with on-chip user flash and background programming options enables secure, single-chip configuration with in-field updates.
Why Choose LCMXO2-7000HE-4TG144I?
The LCMXO2-7000HE-4TG144I positions itself as a versatile, industrial-grade MachXO2 FPGA option for designs that need a balance of logic capacity, I/O count and embedded memory in a compact LQFP/TQFP package. Its combination of low-power operation, non-volatile configuration and on-chip system peripherals reduces BOM complexity while supporting reliable operation across a wide temperature range.
This device is well suited to embedded and industrial engineers building systems that require reconfigurability, robust I/O interfacing and localized memory for buffering or state retention. Family-level features such as DDR-capable I/Os, PLL-based clocking and on-chip communication peripherals provide long-term flexibility and in-field update capability for evolving system requirements.
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