LCMXO2-7000HE-4FG484I

The LCMXO2-7000HE-4FG484I is a MachXO2 family FPGA IC from Lattice Semiconductor, offering 6,864 logic elements and a high-density I/O count in a 484-ball BGA package. It combines non-volatile instant-on configuration with flexible I/O, embedded memory and on-chip utilities to address I/O-heavy and system-control applications in industrial environments.

This device targets applications requiring broad interface support, on-chip memory and low standby power while operating across an industrial temperature range and a tightly specified core supply voltage.

Key Features

• Core Logic — 6,864 logic elements provide programmable look-up resources suitable for complex glue logic, protocol bridging and control functions.
• I/O Density — 334 user I/Os in a 484-ball BGA package support high-pin-count designs and extensive peripheral connectivity.
• Embedded Memory — Approximately 240 kbits of embedded block RAM plus distributed RAM capacity for FIFOs, buffers and small data stores; on-chip user flash memory up to 256 kbits supports configuration and user storage.
• Flexible I/O Standards — Programmable sysIO buffers and on-chip differential termination support a wide range of interfaces and signaling options for system integration.
• Low Power — Built on a low-power 65 nm process with standby power as low as 22 μW, enabling energy-conscious designs.
• Non-Volatile, Instant-On — Single-chip non-volatile configuration provides fast power-up and secure in-field reconfiguration (TransFR) while supporting background programming.
• On-Chip System Functions — Hardened peripherals including SPI, I²C and timer/counter; on-chip oscillator and IEEE 1149.1 boundary-scan support system-level integration and testability.
• Package & Supply — 484-BBGA (supplier package 484-FBGA, 23 × 23 mm) surface-mount package; core supply range 1.14 V to 1.26 V.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.

Typical Applications

• Interface Bridging and Protocol Translation — High I/O count and flexible I/O standards make the device suitable for bridging disparate buses and handling multiple peripheral interfaces.
• Display and Memory Interfaces — Pre‑engineered source-synchronous I/O and memory interface support enable display controllers and external memory interfacing.
• System Control and Glue Logic — Compact on-chip memory, timers and serial peripherals allow consolidation of control functions and reduction of external components.
• Industrial I/O Expansion — Industrial operating temperature and high pin count support expansion and aggregation of sensors, actuators and field I/Os in industrial systems.

Unique Advantages

• High I/O and Logic Integration: 6,864 logic elements with 334 I/Os reduce external components and simplify board-level routing for complex systems.
• Non-Volatile Instant-On: Single-chip configuration enables fast, secure startup without external configuration memory.
• Low Standby Power: Ultra-low standby consumption (as low as 22 μW) helps meet tight power budgets in always-on and standby modes.
• On-Chip Peripherals: Built-in SPI, I²C and timers along with an on-chip oscillator streamline system design and lower BOM count.
• Industrial Robustness: Specified for −40 °C to 100 °C operation and surface-mount 484-BBGA packaging for reliable deployment in industrial environments.
• Field Reconfiguration: TransFR in-field update capability supports in-service logic updates and iterative feature enhancements.

Why Choose LCMXO2-7000HE-4FG484I?

Part of the MachXO2 family from Lattice Semiconductor, the LCMXO2-7000HE-4FG484I combines a high logic element count with extensive I/O and embedded memory, delivering a compact, integrated solution for interface-intensive and control-oriented designs. Its non-volatile instant-on behavior, low standby power and on-chip peripherals make it suitable for industrial applications where reliable startup, flexible interfacing and power efficiency matter.

This device is best suited for design teams looking to consolidate glue logic, manage multiple high-speed or mixed-signal interfaces, and retain the ability to update logic in the field while operating across an industrial temperature range.

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