LCMXO2-7000HE-4BG332C

The LCMXO2-7000HE-4BG332C is a MachXO2 field-programmable gate array (FPGA) optimized for flexible system integration and low-power operation. It provides 6,864 logic elements, approximately 245.76 kbits of on-chip RAM and a high-density I/O count (278 pins) in a 332-ball caBGA package (17 mm × 17 mm).

Designed for applications that require high I/O density, embedded memory and non-volatile configuration, this device delivers a balance of integration and efficiency for commercial-temperature designs operating from 0 °C to 85 °C with a nominal supply range of 1.14 V to 1.26 V. RoHS compliant and surface-mount packaged, it targets system-level functions such as interface bridging, control logic and I/O-heavy subsystems.

Key Features

• Core Logic  6,864 logic elements delivering flexible LUT4-based logic for glue logic, control and combinational/sequential functions.
• Embedded Memory  Approximately 245.76 kbits of on-chip RAM plus family support for embedded block RAM and distributed RAM for FIFOs and buffering.
• On-Chip Non-Volatile Memory  Family-level on-chip user flash memory (UFM) and background programming options enable single-chip, non-volatile configuration and in-field reconfiguration.
• High-Density I/O  278 programmable I/Os with the MachXO2 sysIO buffer capabilities to support a wide range of standards and differential interfaces.
• Power and Supply  Ultra-low-power family characteristics with sub-milliamp standby modes; device supply range specified at 1.14 V to 1.26 V.
• Clocking and PLLs  Multiple primary clocks and up to two analog PLLs per device (family-level) for flexible clock management and fractional‑N frequency synthesis.
• Pre-engineered I/O Support  Built-in source-synchronous I/O options, DDR registers in I/O cells and dedicated gearing for display interfaces and high-speed data paths.
• Embedded Peripherals & System Features  On-chip SPI, I2C and timer/counter functions, an on-chip oscillator, IEEE 1149.1 boundary-scan support and IEEE 1532 in-system programming capability.
• Package & Temperature  332-ball caBGA (332-FBGA / 332-CABGA, 17×17 mm) surface-mount package; commercial grade, operating range 0 °C to 85 °C. RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic  Use the high I/O count and flexible logic resources to consolidate glue logic and protocol translation between system components.
• Display and Memory Interface  Pre-engineered source-synchronous I/O and DDR/DDR2/LPDDR support enable implementation of display controllers and memory interface logic.
• System Control and Sequencing  Embedded timers, counters, and non-volatile configuration support system management, boot control and hardware state machines.
• Peripheral Aggregation  SPI, I2C and programmable I/Os allow the device to act as a sensor hub, peripheral aggregator or interface concentrator in I/O-heavy designs.

Unique Advantages

• High I/O Density:  278 programmable I/Os reduce the need for external GPIO expanders and simplify board routing for complex interfaces.
• Integrated Memory and Logic:  6,864 logic elements combined with approximately 245.76 kbits of on-chip RAM enable compact implementations of buffering, state machines and small processors without external SRAM.
• Non-Volatile, Instant-On Capability:  On-chip user flash and family-supported instant-on configuration streamline system boot and allow in-field updates.
• Flexible I/O Standards:  Programmable sysIO buffer and on-chip differential termination support a wide range of signaling standards for versatile system integration.
• Low-Voltage, Low-Power Operation:  Specified supply range (1.14 V–1.26 V) and family low-power features support energy-efficient designs where standby and operational power matter.
• System-Level Integration:  Embedded SPI, I2C, timers and boundary-scan help reduce BOM and simplify board-level testing and control functions.

Why Choose LCMXO2-7000HE-4BG332C?

The LCMXO2-7000HE-4BG332C positions itself as a high-density, low-power MachXO2 FPGA option for commercial-temperature systems that require significant I/O, embedded RAM and non-volatile configuration. Its combination of approximately 6,864 logic elements, substantial on-chip memory and family-level features such as programmable I/O standards, PLLs and embedded peripherals makes it a practical choice for designs focused on interface consolidation, system control and I/O-intensive roles.

This device is suitable for engineers seeking a compact, surface-mount FPGA solution in a 332-ball caBGA package with RoHS compliance, a defined commercial operating range (0 °C to 85 °C) and a narrow core supply window (1.14 V–1.26 V). The MachXO2 family-level capabilities provide options for reconfiguration, in-system programming and peripheral integration that support long-term design flexibility and simplified BOMs.

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