LCMXO2-7000HC-6TG144I

IC FPGA 114 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP

Quantity 920 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O114Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-6TG144I – MachXO2 Field Programmable Gate Array (FPGA) IC, 6,864 Logic Elements, 245,760-bit RAM, 144-LQFP

The LCMXO2-7000HC-6TG144I is a MachXO2 family field programmable gate array (FPGA) IC from Lattice Semiconductor, provided in a 144-pin LQFP surface-mount package. It combines a flexible logic architecture with embedded memory and on-chip flash to support in-field reconfiguration, system glue logic, and interface bridging in industrial applications.

With 6,864 logic elements, approximately 245,760 bits of embedded RAM, and 114 I/O pins, this device targets designs that require moderate logic density, rich I/O capability and non-volatile configuration in an industrial-grade temperature range.

Key Features

  • Core Logic  6,864 logic elements provide substantial programmable fabric for glue logic, protocol adaptation and control functions.
  • On-Chip Memory  Approximately 245,760 bits of embedded RAM plus support for up to 256 kbits of on-chip user Flash Memory for instant-on and non-volatile configuration.
  • I/O Density & Flexibility  114 I/Os in a 144-LQFP package with programmable sysIO buffer options and on-chip differential termination for diverse interface standards.
  • Low Power Options  Built on an advanced low-power process with standby power as low as 22 µW (MachXO2 family specification).
  • Clocking & PLLs  Multiple on-chip clock resources including up to eight primary clocks and up to two analog PLLs supporting fractional-N synthesis (family specification).
  • On-Chip Flash and Reconfiguration  Non-volatile user Flash (up to 256 kbits) with 100,000 write cycles and TransFR™ in-field reconfiguration for background updates and dual-boot options.
  • Memory Interface Support  Pre-engineered source-synchronous I/O with DDR registers in I/O cells and dedicated gearing/DDR support (family specification).
  • Package & Mounting  144-LQFP (supplier package 144-TQFP, 20×20 mm) surface-mount package; RoHS compliant.
  • Industrial Temperature Range  Rated operating temperature from −40 °C to 100 °C and single-supply operation over 2.375 V to 3.465 V.

Typical Applications

  • Industrial Control  Programmable glue logic, protocol adaptation and system control functions in equipment requiring industrial temperature capability.
  • Interface Bridging  I/O-rich design implementations that need flexible buffer support and source-synchronous interfaces, including DDR-style logic.
  • Embedded System Glue  On-chip flash and embedded RAM for instant-on configuration, in-field updates and small-system consolidation.
  • Display and High-Speed I/O  Pre-engineered source-synchronous I/O and dedicated gearing logic for display and high-speed peripheral interfacing (family specification).

Unique Advantages

  • Highly Integrated Solution:  Combines 6,864 logic elements, substantial embedded RAM and on-chip Flash to reduce external components and simplify BOM.
  • Flexible I/O Standards:  Programmable sysIO buffer and on-chip differential termination support a wide range of signaling options for mixed-interface designs (family specification).
  • Non-Volatile Instant-On:  On-chip user Flash enables single-chip non-volatile configuration and fast power-up behavior suitable for systems that require immediate availability.
  • Field Upgrades and Reliability:  TransFR™ reconfiguration and background programming of non-volatile memory let you update logic in the field without taking the system offline.
  • Industrial-Grade Operation:  Temperature rating from −40 °C to 100 °C and robust packaging make this device suitable for demanding environments.
  • Density Migration Path:  MachXO2 family options and package variety support design scalability and migration across device densities (family specification).

Why Choose LCMXO2-7000HC-6TG144I?

The LCMXO2-7000HC-6TG144I delivers a balanced combination of programmable logic capacity, versatile I/O and non-volatile configuration ideal for industrial embedded designs requiring reliable instant-on operation and field updates. Its on-chip memory and flash, flexible clocking and I/O capabilities simplify system architecture while minimizing external components.

This device is suited for engineers and product teams building industrial control, interface bridging and embedded systems that need a compact, surface-mount FPGA solution with broad I/O and proven family-level features such as low-power modes, PLL-based clocking and in-field reconfiguration.

Request a quote or submit a pricing inquiry to evaluate the LCMXO2-7000HC-6TG144I for your next design project.

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