LCMXO2-7000HC-6TG144I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP |
|---|---|
| Quantity | 920 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 114 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HC-6TG144I – MachXO2 Field Programmable Gate Array (FPGA) IC, 6,864 Logic Elements, 245,760-bit RAM, 144-LQFP
The LCMXO2-7000HC-6TG144I is a MachXO2 family field programmable gate array (FPGA) IC from Lattice Semiconductor, provided in a 144-pin LQFP surface-mount package. It combines a flexible logic architecture with embedded memory and on-chip flash to support in-field reconfiguration, system glue logic, and interface bridging in industrial applications.
With 6,864 logic elements, approximately 245,760 bits of embedded RAM, and 114 I/O pins, this device targets designs that require moderate logic density, rich I/O capability and non-volatile configuration in an industrial-grade temperature range.
Key Features
- Core Logic 6,864 logic elements provide substantial programmable fabric for glue logic, protocol adaptation and control functions.
- On-Chip Memory Approximately 245,760 bits of embedded RAM plus support for up to 256 kbits of on-chip user Flash Memory for instant-on and non-volatile configuration.
- I/O Density & Flexibility 114 I/Os in a 144-LQFP package with programmable sysIO buffer options and on-chip differential termination for diverse interface standards.
- Low Power Options Built on an advanced low-power process with standby power as low as 22 µW (MachXO2 family specification).
- Clocking & PLLs Multiple on-chip clock resources including up to eight primary clocks and up to two analog PLLs supporting fractional-N synthesis (family specification).
- On-Chip Flash and Reconfiguration Non-volatile user Flash (up to 256 kbits) with 100,000 write cycles and TransFR™ in-field reconfiguration for background updates and dual-boot options.
- Memory Interface Support Pre-engineered source-synchronous I/O with DDR registers in I/O cells and dedicated gearing/DDR support (family specification).
- Package & Mounting 144-LQFP (supplier package 144-TQFP, 20×20 mm) surface-mount package; RoHS compliant.
- Industrial Temperature Range Rated operating temperature from −40 °C to 100 °C and single-supply operation over 2.375 V to 3.465 V.
Typical Applications
- Industrial Control Programmable glue logic, protocol adaptation and system control functions in equipment requiring industrial temperature capability.
- Interface Bridging I/O-rich design implementations that need flexible buffer support and source-synchronous interfaces, including DDR-style logic.
- Embedded System Glue On-chip flash and embedded RAM for instant-on configuration, in-field updates and small-system consolidation.
- Display and High-Speed I/O Pre-engineered source-synchronous I/O and dedicated gearing logic for display and high-speed peripheral interfacing (family specification).
Unique Advantages
- Highly Integrated Solution: Combines 6,864 logic elements, substantial embedded RAM and on-chip Flash to reduce external components and simplify BOM.
- Flexible I/O Standards: Programmable sysIO buffer and on-chip differential termination support a wide range of signaling options for mixed-interface designs (family specification).
- Non-Volatile Instant-On: On-chip user Flash enables single-chip non-volatile configuration and fast power-up behavior suitable for systems that require immediate availability.
- Field Upgrades and Reliability: TransFR™ reconfiguration and background programming of non-volatile memory let you update logic in the field without taking the system offline.
- Industrial-Grade Operation: Temperature rating from −40 °C to 100 °C and robust packaging make this device suitable for demanding environments.
- Density Migration Path: MachXO2 family options and package variety support design scalability and migration across device densities (family specification).
Why Choose LCMXO2-7000HC-6TG144I?
The LCMXO2-7000HC-6TG144I delivers a balanced combination of programmable logic capacity, versatile I/O and non-volatile configuration ideal for industrial embedded designs requiring reliable instant-on operation and field updates. Its on-chip memory and flash, flexible clocking and I/O capabilities simplify system architecture while minimizing external components.
This device is suited for engineers and product teams building industrial control, interface bridging and embedded systems that need a compact, surface-mount FPGA solution with broad I/O and proven family-level features such as low-power modes, PLL-based clocking and in-field reconfiguration.
Request a quote or submit a pricing inquiry to evaluate the LCMXO2-7000HC-6TG144I for your next design project.