LCMXO2-7000HE-4BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA |
|---|---|
| Quantity | 1,279 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-4BG256I – MachXO2 Field Programmable Gate Array, 256‑LFBGA
The LCMXO2-7000HE-4BG256I is a MachXO2 family FPGA IC from Lattice Semiconductor designed for industrial applications. It provides a flexible logic architecture with 6,864 logic elements and 206 I/Os in a compact 256‑ball package, targeting control, glue-logic and I/O-centric system functions.
As part of the MachXO2 family, this device benefits from low-power operation, embedded memory and a range of system features that simplify integration into industrial systems requiring non-volatile, reconfigurable logic and broad I/O support.
Key Features
- Core Logic — 6,864 logic elements, providing programmable logic capacity suitable for mid-density glue logic, state machines and peripheral control functions.
- On‑chip Memory — 245,760 bits of total on-chip RAM reported for the device. The MachXO2 family also includes embedded block and distributed memory options for buffering and small data storage.
- I/O Count and Flexibility — 206 I/Os to support broad peripheral and interface connectivity. Family-level features include programmable sysIO buffers and support for a wide range of I/O standards.
- Power — Single supply operation with a device supply range of 1.14 V to 1.26 V; the MachXO2 family includes ultra-low-power design options and standby modes.
- Package & Mounting — Surface-mount device provided in a 256‑LFBGA package (supplier package listed as 256‑CABGA, 14×14 mm), enabling compact board integration.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
- Non‑volatile and Reconfiguration — Family-level capabilities include on-chip user flash and in-field reconfiguration (TransFR) for updating logic while the system operates.
- Compliance — RoHS compliant per supplied product data.
Typical Applications
- System Glue Logic — Bridge and control disparate peripherals, implement protocol adapters and offload microcontroller I/O chores using the device’s logic and plentiful I/Os.
- Peripheral and Sensor Interfaces — Aggregate and condition sensor data or handle multiple serial interfaces with the family’s I/O flexibility and on-chip memory.
- Display and Video I/O — Leverage MachXO2 family pre‑engineered source-synchronous I/O and DDR gearing for display or high-speed I/O staging.
- In-field Updatable Systems — Use non-volatile configuration and TransFR reconfiguration features for remote or in‑field logic updates without removing the device.
Unique Advantages
- Compact, Mid‑Density Logic — 6,864 logic elements provide a balance of capacity and board space efficiency for control and interfacing tasks.
- High I/O Count — 206 I/Os enable extensive peripheral connectivity without external multiplexers or extra components, simplifying BOM and board routing.
- Industrial Readiness — Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsher environments where extended temperature ranges are required.
- Flexible Power and Low‑Power Modes — Narrow device supply range (1.14 V to 1.26 V) and family-level low-power capabilities reduce system power consumption and simplify power-rail design.
- On‑board Non‑volatile Options — MachXO2 family support for on-chip user flash and background programming enables secure, single-chip, instant-on configurations.
- Proven Family Features — Built on the MachXO2 architecture with embedded and distributed memory, programmable I/O standards, and system-level peripherals (SPI, I2C, timer/counter) to accelerate deployment.
Why Choose LCMXO2-7000HE-4BG256I?
This MachXO2 device delivers a balanced combination of programmable logic capacity, high I/O count and industrial temperature performance in a compact 256‑ball package. It is well suited for engineers needing mid-density FPGA resources for system glue logic, interface aggregation and in-field configurable designs where non‑volatile configuration and reconfiguration matter.
By aligning device-level specifications (logic elements, on-chip RAM, I/O count, supply and temperature range) with the MachXO2 family capabilities, the LCMXO2-7000HE-4BG256I offers a robust, reconfigurable building block for industrial applications that demand integration, flexibility and predictable environmental performance.
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