LCMXO2-7000HE-4BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 1,279 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HE-4BG256I – MachXO2 Field Programmable Gate Array, 256‑LFBGA

The LCMXO2-7000HE-4BG256I is a MachXO2 family FPGA IC from Lattice Semiconductor designed for industrial applications. It provides a flexible logic architecture with 6,864 logic elements and 206 I/Os in a compact 256‑ball package, targeting control, glue-logic and I/O-centric system functions.

As part of the MachXO2 family, this device benefits from low-power operation, embedded memory and a range of system features that simplify integration into industrial systems requiring non-volatile, reconfigurable logic and broad I/O support.

Key Features

  • Core Logic — 6,864 logic elements, providing programmable logic capacity suitable for mid-density glue logic, state machines and peripheral control functions.
  • On‑chip Memory — 245,760 bits of total on-chip RAM reported for the device. The MachXO2 family also includes embedded block and distributed memory options for buffering and small data storage.
  • I/O Count and Flexibility — 206 I/Os to support broad peripheral and interface connectivity. Family-level features include programmable sysIO buffers and support for a wide range of I/O standards.
  • Power — Single supply operation with a device supply range of 1.14 V to 1.26 V; the MachXO2 family includes ultra-low-power design options and standby modes.
  • Package & Mounting — Surface-mount device provided in a 256‑LFBGA package (supplier package listed as 256‑CABGA, 14×14 mm), enabling compact board integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Non‑volatile and Reconfiguration — Family-level capabilities include on-chip user flash and in-field reconfiguration (TransFR) for updating logic while the system operates.
  • Compliance — RoHS compliant per supplied product data.

Typical Applications

  • System Glue Logic — Bridge and control disparate peripherals, implement protocol adapters and offload microcontroller I/O chores using the device’s logic and plentiful I/Os.
  • Peripheral and Sensor Interfaces — Aggregate and condition sensor data or handle multiple serial interfaces with the family’s I/O flexibility and on-chip memory.
  • Display and Video I/O — Leverage MachXO2 family pre‑engineered source-synchronous I/O and DDR gearing for display or high-speed I/O staging.
  • In-field Updatable Systems — Use non-volatile configuration and TransFR reconfiguration features for remote or in‑field logic updates without removing the device.

Unique Advantages

  • Compact, Mid‑Density Logic — 6,864 logic elements provide a balance of capacity and board space efficiency for control and interfacing tasks.
  • High I/O Count — 206 I/Os enable extensive peripheral connectivity without external multiplexers or extra components, simplifying BOM and board routing.
  • Industrial Readiness — Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsher environments where extended temperature ranges are required.
  • Flexible Power and Low‑Power Modes — Narrow device supply range (1.14 V to 1.26 V) and family-level low-power capabilities reduce system power consumption and simplify power-rail design.
  • On‑board Non‑volatile Options — MachXO2 family support for on-chip user flash and background programming enables secure, single-chip, instant-on configurations.
  • Proven Family Features — Built on the MachXO2 architecture with embedded and distributed memory, programmable I/O standards, and system-level peripherals (SPI, I2C, timer/counter) to accelerate deployment.

Why Choose LCMXO2-7000HE-4BG256I?

This MachXO2 device delivers a balanced combination of programmable logic capacity, high I/O count and industrial temperature performance in a compact 256‑ball package. It is well suited for engineers needing mid-density FPGA resources for system glue logic, interface aggregation and in-field configurable designs where non‑volatile configuration and reconfiguration matter.

By aligning device-level specifications (logic elements, on-chip RAM, I/O count, supply and temperature range) with the MachXO2 family capabilities, the LCMXO2-7000HE-4BG256I offers a robust, reconfigurable building block for industrial applications that demand integration, flexibility and predictable environmental performance.

Request a quote or submit a product inquiry to receive pricing, lead time and availability for the LCMXO2-7000HE-4BG256I.

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