LCMXO2-7000HE-4FG484C

The LCMXO2-7000HE-4FG484C is a MachXO2 family FPGA offering 6,864 logic elements and high I/O density in a 484‑ball BGA package. Designed for commercial-grade applications, it delivers flexible logic, embedded memory, on-chip non-volatile storage and broad I/O support for board-level control, interface bridging and display/memory interfacing.

Key Features

• Core Logic  Approximately 6,864 logic elements for implementing mid-density programmable logic and glue functions.
• Memory  Total on-chip RAM of 245,760 bits (approximately 240 kbits) plus on-chip user flash memory (up to 256 kbits) with 100,000 write cycles for configuration and data storage.
• I/O Capability  Up to 334 I/Os with programmable sysIO buffers; supports a wide range of standards for flexible interfacing at board level.
• Power and Supply  Operates from a supply range of 1.14 V to 1.26 V and is built on an advanced low-power process with standby modes and very low standby power.
• Clocking and PLLs  Multiple on-chip clocks and up to two analog PLLs with fractional‑N synthesis to support a variety of timing requirements.
• On‑Chip Peripherals  Built-in SPI, I²C, timer/counter blocks and an on-chip oscillator to simplify system integration and reduce external component count.
• Reconfiguration and Security  Non-volatile, instant-on configuration with background programming, optional dual-boot and TransFR in-field update capability for in-system logic updates.
• Package and Mounting  Surface-mount 484‑BBGA (supplier package: 484‑FBGA, 23 mm × 23 mm) in a RoHS‑compliant package suitable for compact designs.
• Operating Conditions  Commercial-grade operating temperature range of 0 °C to 85 °C.

Typical Applications

• Interface Bridging and Protocol Conversion  High I/O count and flexible sysIO support enable protocol translation and board-level interface consolidation.
• Display and Video I/O  Pre‑engineered source-synchronous I/O, DDR registers and dedicated display gearing support display interface implementations and timing-critical data paths.
• Memory Interface and Buffering  Dedicated DDR/DDR2/LPDDR memory support and embedded FIFO control logic facilitate memory interface conditioning and buffering tasks.
• System Control and Glue Logic  On-chip SPI, I²C, timers and non-volatile configuration make the device well suited for board control, sequencing and system glue applications.

Unique Advantages

• High I/O Density: 334 available I/Os support complex multi‑interface designs without extensive external multiplexing.
• On‑Chip Non‑Volatile Storage: Integrated user flash (up to 256 kbits) enables single-chip, instant-on configurations and in-field updates.
• Embedded RAM Resources: Approximately 240 kbits of on-chip RAM and distributed RAM options reduce dependency on external memory for buffering and state storage.
• Low Standby Power: Low-power process technology and standby modes reduce system idle power for energy-conscious designs.
• System-Level Integration: Hardened I²C, SPI, timers and oscillator lower BOM count and simplify software/firmware integration.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and offered in a compact, surface-mount BGA package suitable for mainstream commercial products.

Why Choose LCMXO2-7000HE-4FG484C?

The LCMXO2-7000HE-4FG484C positions itself as a versatile, mid-density FPGA for designers needing significant I/O, embedded memory and non-volatile configuration in a single-chip solution. Its combination of approximately 6,864 logic elements, ~240 kbits of embedded RAM, on-chip user flash and extensive system-level peripherals make it well suited for board-level control, interface bridging, display and memory interface tasks in commercial products.

With instant-on non-volatile configuration, reconfiguration support for in-field updates and a compact 484‑BBGA footprint, this device supports scalable designs across the MachXO2 family while helping reduce external components and simplify system architecture.

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