LCMXO2-7000HE-4BG256C

The LCMXO2-7000HE-4BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball caBGA package. It combines 6,864 logic elements with 245,760 bits of on-chip RAM and up to 206 I/O pins for flexible system integration.

Designed for commercial-grade embedded applications, the device delivers non-volatile instant-on operation, reconfigurable in-field updates, and a broad set of I/O and memory features to support display interfaces, memory buffering and general-purpose glue logic.

Key Features

• Core Logic – 6,864 logic elements (LUT4-based architecture) suitable for implementing control, glue logic and mid-density FPGA functions.
• Embedded Memory – 245,760 bits of total RAM on-chip for system buffers and data storage; family supports embedded block RAM and distributed RAM structures.
• On‑Chip Flash (UFM) – Up to 256 kbits of user flash memory (family feature) with background programming and 100,000 write cycles for configuration storage and firmware.
• I/O Density & Flexibility – 206 I/O pins available on the 256-ball caBGA package; programmable sysIO buffer supports multiple I/O standards and includes DDR registers in I/O cells and dedicated gearing for display I/Os.
• Power – Advanced 65 nm low-power process with standby options; family devices can achieve ultra-low standby power (as low as 22 μW in the datasheet).
• Clocking & PLLs – Multiple primary clocks and up to two analog PLLs per device for fractional‑N frequency synthesis and flexible clocking architectures (family capability).
• Reconfiguration & Security – Non-volatile instant-on operation, TransFR in-field reconfiguration for live updates, and optional dual-boot with external SPI memory (family features).
• Package & Mounting – 256-LFBGA / 256-CABGA (14 mm × 14 mm) surface-mount package; RoHS compliant.
• Operating Conditions – Voltage supply range 1.14 V to 1.26 V and commercial operating temperature range 0 °C to 85 °C.

Typical Applications

• Display and Video Interfaces – DDR registers in I/O cells and 7:1 gearing for display I/Os enable timing-critical display and panel interface tasks.
• Memory Interface and Buffering – Dedicated DDR/DDR2/LPDDR memory support with DQS and embedded RAM make the device suited for memory buffering and protocol bridging.
• System Glue & Boot Control – On-chip user flash, instant-on configuration and multiple serial configuration options (JTAG, SPI, I2C) simplify boot logic and system integration.
• Field Upgradeable Logic – TransFR reconfiguration supports in-field logic updates without taking the whole system offline, useful for firmware upgrades and feature additions.

Unique Advantages

• Highly Integrated Mid‑Density FPGA: Combines 6,864 logic elements with substantial on‑chip RAM and UFM to reduce external memory and flash requirements.
• Flexible, High‑Performance I/O: 206 programmable I/Os with DDR support and multiple physical interface standards reduce interface translation hardware and simplify board design.
• Low Standby Power: Family-level low-power process and standby modes help minimize idle power consumption in battery‑sensitive or always‑on systems.
• Instant-On Non-Volatile Configuration: Single-chip instant-on capability and background programming enable fast system start-up and secure configuration storage.
• Field Reconfiguration: In-field TransFR updates allow logic changes during operation, enabling remote feature updates and reduced maintenance downtime.
• Commercial Temperature & RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance align with common embedded product requirements.

Why Choose LCMXO2-7000HE-4BG256C?

The LCMXO2-7000HE-4BG256C positions itself as a versatile, mid-density FPGA solution for commercial embedded systems that require a balance of logic capacity, on-chip memory and flexible I/O. Its non-volatile instant-on behavior, in-field reconfiguration and on-chip user flash simplify system architecture and lifecycle updates.

This device suits designers building display interfaces, memory-aware buffering, system glue logic and remotely upgradeable platforms where compact packaging (256‑ball caBGA), a defined commercial temperature range and RoHS compliance are important.

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