LCMXO2-7000HE-4BG332I

The LCMXO2-7000HE-4BG332I is a MachXO2 family field programmable gate array (FPGA) in a 332-ball caBGA package designed for industrial applications. It provides mid-to-high density programmable logic with 6,864 logic elements, approximately 240 kbits of embedded RAM, and a large 278-pin I/O count for system glue logic, memory interfacing and high‑I/O integration. Key values include low standby power, non-volatile on-chip user flash, and flexible I/O and clocking options that simplify system-level design.

Key Features

• Core Logic — 6,864 logic elements suitable for mid-to-high density glue logic and control functions.
• Embedded Memory — Approximately 245,760 bits (≈240 kbits) of on-chip RAM and additional distributed RAM for FIFO and buffering requirements.
• I/O Capacity and Flexibility — 278 I/Os with programmable sysIO™ buffers supporting a wide range of standards and on-chip differential termination; pre‑engineered source-synchronous I/O and DDR registers in I/O cells.
• On-Chip Non-Volatile Memory — User flash memory and support for background programming and in-field updates (TransFR™ reconfiguration).
• Low Power — Ultra low power architecture with standby modes; family data notes standby power as low as 22 μW.
• Clocking and PLLs — Flexible on-chip clocking with eight primary clocks and up to two analog PLLs per device for fractional-N frequency synthesis and wide input frequency range.
• System Functions — Hardened peripherals including SPI, I2C, timer/counter, on-chip oscillator (5.5% accuracy), and IEEE 1149.1 boundary-scan support.
• Package and Environmental — 332-FBGA (332-CABGA, 17×17 mm) surface-mount package; industrial grade with operating temperature range −40°C to 100°C and RoHS compliance.
• Power Supply — Single supply operating range documented as 1.14 V to 1.26 V for the device.

Typical Applications

• Display and Video I/O — Use the device’s dedicated gearing and DDR I/O features to support display interfaces and high-speed source-synchronous signals.
• Memory Interface Bridging — Dedicated DDR/DDR2/LPDDR support and DDR registers in I/O cells enable memory interface glue logic and buffering.
• System Glue and Control — Replace complex discrete logic with compact programmable logic for bus bridging, protocol translation, and board-level control using on-chip SPI, I2C and timers.
• In-Field Upgradable Systems — TransFR™ reconfiguration and on-chip flash allow in-field logic updates and dual-boot options without removing the device.

Unique Advantages

• High I/O Count with Flexible Standards — 278 I/Os and programmable sysIO buffers reduce the need for external level translators and simplify multi-interface designs.
• Non-Volatile Instant-On — On-chip user flash provides single-chip, instant-on operation with background programming capabilities for secure, reliable boot.
• Low Standby Power — Ultra low-power family architecture and standby modes help minimize system idle power consumption.
• Robust Industrial Operation — Surface-mount 332-ball caBGA package and an operating range of −40°C to 100°C support demanding industrial environments.
• Field Serviceability — In-field reconfiguration enables updates and fixes in deployed systems without socket or board-level replacement.

Why Choose LCMXO2-7000HE-4BG332I?

The LCMXO2-7000HE-4BG332I positions itself as a versatile mid-to-high density FPGA option for industrial designs that require large I/O counts, embedded non-volatile memory, and low-power operation. It combines 6,864 logic elements, substantial on-chip RAM, flexible clocking and PLL options, and family-level features such as TransFR reconfiguration and hardened SPI/I2C blocks to streamline system design and long-term maintenance.

This device is well suited for engineers building display interfaces, memory bridges, board-level glue logic, and in-field-upgradeable control systems that demand deterministic behavior across a broad industrial temperature range.

Request a quote or submit a product inquiry to evaluate LCMXO2-7000HE-4BG332I for your next design project.