LCMXO2-7000HE-4FTG256C

The LCMXO2-7000HE-4FTG256C is a MachXO2 family Field Programmable Gate Array (FPGA) IC that delivers flexible on-chip logic and I/O resources for system control, interface and glue logic applications. It provides 6,864 logic elements, 245,760 bits of on-chip RAM and up to 206 I/Os in a compact 256‑ball LBGA package, delivering a combination of integration, low-power operation and non-volatile configuration suitable for commercial electronic designs.

Key Features

• Core Logic  6,864 logic elements (LUT4-based architecture) for implementing combinational and sequential logic functions.
• On‑chip Memory  245,760 bits of total on-chip RAM. The MachXO2 family also provides embedded block RAM and distributed RAM options for buffering, FIFOs and small data stores.
• I/O Flexibility  Up to 206 I/Os with programmable sysIO buffer support and differential I/O options for a wide range of serial and parallel interfaces.
• Power and Supply  Single supply operation with a specified voltage range of 1.14 V to 1.26 V and low-power family features including very low standby power modes.
• Non‑volatile Configuration  On‑chip user flash memory and instant‑on configuration with background programming and in-field reconfiguration (TransFR) capabilities described for the MachXO2 family.
• Clocking and PLLs  Flexible on-chip clocking architecture with multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis (family-level feature).
• Package and Mounting  256‑LBGA surface-mount package (256‑FTBGA, 17×17 mm supplier package) for high I/O density in a compact footprint.
• Commercial Temperature Grade  Specified operating temperature range 0 °C to 85 °C for commercial applications.
• Standards and Programming Interfaces  Family-level support for JTAG, SPI and I2C programming and IEEE 1149.1 boundary scan and IEEE 1532 in-system programming compliance (MachXO2 family features).
• RoHS Compliant  Device is RoHS compliant for environmentally conscious designs.

Typical Applications

• System Glue Logic  Implement control, arbitration and protocol adaptation between subsystems using dense logic and plentiful I/Os.
• Interface Bridging  Resize, buffer or translate between memory and peripheral interfaces using on-chip RAM and flexible I/O standards.
• Display and High‑Speed I/O  Support source‑synchronous and DDR-style I/O implementations for display or high-speed peripheral interfaces (family-level I/O features).
• Low‑power Embedded Control  Use instant-on and low standby power modes for battery‑sensitive or power-managed commercial products.

Unique Advantages

• High Logic Density: 6,864 logic elements enable complex glue logic and control functions on a single device, reducing board-level components.
• Significant On‑Chip Memory: 245,760 bits of RAM provide local buffering and FIFO capability without external SRAM in many use cases.
• Extensive I/O Count: Up to 206 I/Os in a 256‑ball LBGA package give designers flexibility for multi‑interface systems while keeping a compact footprint.
• Non‑volatile, Reconfigurable: On‑chip user flash and family-level TransFR reconfiguration support enable field updates and secure single-chip configurations.
• Low‑Power Operation: MachXO2 family low standby power modes and power-saving features help meet power budgets for portable and energy-conscious designs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, appropriate for a wide range of commercial electronics applications.

Why Choose LCMXO2-7000HE-4FTG256C?

The LCMXO2-7000HE-4FTG256C positions itself as a flexible, low-power FPGA option for commercial embedded designs that require substantial logic capacity, abundant I/O and on-chip RAM with non-volatile configuration. Its combination of 6,864 logic elements, 245,760 bits of on-chip RAM and up to 206 I/Os in a 256‑LBGA package makes it well suited for system control, interface bridging and display or memory interface tasks where integration and reconfigurability reduce BOM and streamline design.

Designed with family-level features such as programmable I/O standards, PLL-based clocking and in-field reconfiguration, this device provides a scalable platform for evolving product requirements while maintaining commercial-grade temperature and RoHS compliance.

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