LCMXO2-7000HE-4TG144C

IC FPGA 114 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP

Quantity 1,671 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O114Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HE-4TG144C – MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP

The LCMXO2-7000HE-4TG144C is a MachXO2 family FPGA offering a flexible logic architecture with 6,864 logic elements and extensive I/O capability. Designed for low-power, instant-on systems, this commercial-grade device integrates embedded memory, on-chip user flash, and programmable I/O options to address control, connectivity and interface tasks across consumer and industrial applications.

Its combination of on-chip resources and single-chip non-volatile configuration makes it well suited for system glue logic, interface bridging, display and memory buffering, and general-purpose programmable control where compact footprint and low standby power are important.

Key Features

  • Core Logic  6,864 logic elements provide a flexible LUT-based architecture for implementing custom logic, glue functions and embedded controllers.
  • Embedded Memory  Approximately 245,760 bits of on-chip RAM (≈240 kbits) for distributed and block RAM usage, with dedicated FIFO control logic for buffering and data staging.
  • On-Chip User Flash  Family support for on-chip non-volatile user flash (UFM) enabling code and configuration storage with in-field reprogramming and background programming capability.
  • I/O and Interfaces  114 programmable I/Os with support for a broad range of buffer standards (as provided by the MachXO2 family), on-chip differential termination and hot-socketing support for flexible interface design.
  • Power and Standby  Advanced low-power design with standby modes; device supply range listed at 1.14 V to 1.26 V for core operation.
  • Clocking and PLLs  Flexible on-chip clocking architecture with multiple primary clocks and analog PLLs for fractional-n frequency synthesis (family-level feature).
  • Non-volatile, Reconfigurable  Single-chip, instant-on configuration with in-field reconfiguration capabilities and options for background programming and dual-boot with external SPI memory (family-level features).
  • Package and Operating Conditions  144-pin LQFP package (supplier lists 144-TQFP 20 × 20 mm) and commercial operating temperature range from 0 °C to 85 °C.
  • Standards and System Features  On-chip peripherals and hardened functions at the family level include SPI, I²C, timer/counter, oscillator and IEEE 1149.1 boundary scan support.

Typical Applications

  • Interface Bridging  Implement protocol conversion and glue logic between microcontrollers, sensors and peripherals using high I/O count and programmable I/O standards.
  • Display and Video I/O  Use pre-engineered source-synchronous I/O and DDR register support for display timing, buffering and signal gearing tasks.
  • Memory Buffering  Leverage embedded block RAM and FIFO control logic for temporary storage and data-rate matching between system blocks.
  • Embedded Control  Implement custom control functions, timing, and peripheral offloads with on-chip logic and user flash for field updates.

Unique Advantages

  • High integration in a single chip: Consolidates logic, embedded RAM and non-volatile configuration to reduce BOM and PCB area.
  • Low-power operation: Family-level low standby power and programmable power modes help reduce system energy consumption.
  • Instant-on, reconfigurable architecture: Non-volatile configuration and TransFR reconfiguration support in-field updates without external configuration ROM.
  • Flexible I/O with system-level features: Broad I/O support and on-chip peripherals simplify interface design and reduce external components.
  • Commercial-grade temperature range: Rated for 0 °C to 85 °C, suitable for a wide range of consumer and light industrial applications.

Why Choose LCMXO2-7000HE-4TG144C?

The LCMXO2-7000HE-4TG144C positions itself as a compact, low-power FPGA solution that balances logic density, embedded memory and versatile I/O in a single, non-volatile device. It is well suited to designers needing instant-on programmability, in-field update capability and a high I/O count within a 144-pin LQFP footprint.

This device is appropriate for system designers targeting interface logic, buffering, display and embedded control tasks where a single-chip, reconfigurable solution reduces component count and simplifies system architecture while offering the family-level features documented in the MachXO2 datasheet.

Request a quote or submit a request for pricing and availability to evaluate the LCMXO2-7000HE-4TG144C for your next design.

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