LCMXO2-7000HE-4TG144C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP |
|---|---|
| Quantity | 1,671 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 114 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-4TG144C – MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP
The LCMXO2-7000HE-4TG144C is a MachXO2 family FPGA offering a flexible logic architecture with 6,864 logic elements and extensive I/O capability. Designed for low-power, instant-on systems, this commercial-grade device integrates embedded memory, on-chip user flash, and programmable I/O options to address control, connectivity and interface tasks across consumer and industrial applications.
Its combination of on-chip resources and single-chip non-volatile configuration makes it well suited for system glue logic, interface bridging, display and memory buffering, and general-purpose programmable control where compact footprint and low standby power are important.
Key Features
- Core Logic 6,864 logic elements provide a flexible LUT-based architecture for implementing custom logic, glue functions and embedded controllers.
- Embedded Memory Approximately 245,760 bits of on-chip RAM (≈240 kbits) for distributed and block RAM usage, with dedicated FIFO control logic for buffering and data staging.
- On-Chip User Flash Family support for on-chip non-volatile user flash (UFM) enabling code and configuration storage with in-field reprogramming and background programming capability.
- I/O and Interfaces 114 programmable I/Os with support for a broad range of buffer standards (as provided by the MachXO2 family), on-chip differential termination and hot-socketing support for flexible interface design.
- Power and Standby Advanced low-power design with standby modes; device supply range listed at 1.14 V to 1.26 V for core operation.
- Clocking and PLLs Flexible on-chip clocking architecture with multiple primary clocks and analog PLLs for fractional-n frequency synthesis (family-level feature).
- Non-volatile, Reconfigurable Single-chip, instant-on configuration with in-field reconfiguration capabilities and options for background programming and dual-boot with external SPI memory (family-level features).
- Package and Operating Conditions 144-pin LQFP package (supplier lists 144-TQFP 20 × 20 mm) and commercial operating temperature range from 0 °C to 85 °C.
- Standards and System Features On-chip peripherals and hardened functions at the family level include SPI, I²C, timer/counter, oscillator and IEEE 1149.1 boundary scan support.
Typical Applications
- Interface Bridging Implement protocol conversion and glue logic between microcontrollers, sensors and peripherals using high I/O count and programmable I/O standards.
- Display and Video I/O Use pre-engineered source-synchronous I/O and DDR register support for display timing, buffering and signal gearing tasks.
- Memory Buffering Leverage embedded block RAM and FIFO control logic for temporary storage and data-rate matching between system blocks.
- Embedded Control Implement custom control functions, timing, and peripheral offloads with on-chip logic and user flash for field updates.
Unique Advantages
- High integration in a single chip: Consolidates logic, embedded RAM and non-volatile configuration to reduce BOM and PCB area.
- Low-power operation: Family-level low standby power and programmable power modes help reduce system energy consumption.
- Instant-on, reconfigurable architecture: Non-volatile configuration and TransFR reconfiguration support in-field updates without external configuration ROM.
- Flexible I/O with system-level features: Broad I/O support and on-chip peripherals simplify interface design and reduce external components.
- Commercial-grade temperature range: Rated for 0 °C to 85 °C, suitable for a wide range of consumer and light industrial applications.
Why Choose LCMXO2-7000HE-4TG144C?
The LCMXO2-7000HE-4TG144C positions itself as a compact, low-power FPGA solution that balances logic density, embedded memory and versatile I/O in a single, non-volatile device. It is well suited to designers needing instant-on programmability, in-field update capability and a high I/O count within a 144-pin LQFP footprint.
This device is appropriate for system designers targeting interface logic, buffering, display and embedded control tasks where a single-chip, reconfigurable solution reduces component count and simplifies system architecture while offering the family-level features documented in the MachXO2 datasheet.
Request a quote or submit a request for pricing and availability to evaluate the LCMXO2-7000HE-4TG144C for your next design.