LCMXO2-7000HE-5BG256I

The LCMXO2-7000HE-5BG256I is a MachXO2 family field programmable gate array in a 256-ball LFBGA package designed for industrial-grade embedded applications. It provides 6,864 logic elements, a high I/O count of 206, and on-chip memory resources to implement glue logic, interface bridging, and system control functions.

Key platform attributes include low-power operation, on-chip non-volatile user flash, flexible I/O signaling and dedicated memory interfaces, with single-supply operation in the 1.14 V to 1.26 V range and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount 256-ball package.

Key Features

• Core Logic  6,864 logic elements for implementing combinational and sequential logic in embedded and system-level designs.
• Embedded and Distributed Memory  Total on-chip RAM of 245,760 bits (approximately 240 kbits). Family data shows up to 240 kbits of sysMEM Embedded Block RAM and up to 54 kbits of distributed RAM.
• On-Chip Non-Volatile Flash  On-chip user flash memory up to 256 kbits with support for background programming and up to 100,000 write cycles; accessible through standard interfaces including SPI, I2C and JTAG (as described in family datasheet).
• High-Performance I/O  206 I/Os with programmable sysIO buffers supporting a wide range of standards, including multiple single-ended and differential interfaces and on-chip differential termination. I/Os support source-synchronous DDR registers and dedicated gearing for display interfaces.
• Low Power  Built on an advanced 65 nm low-power process with ultra-low standby options (as low as 22 μW reported in family documentation) and programmable low-swing differential I/O options.
• Clocking and PLLs  Multiple primary clocks and up to two analog PLLs per device with fractional‑N synthesis and a wide input frequency range (7 MHz to 400 MHz), enabling flexible clocking schemes for high-speed interfaces.
• In‑field Reconfiguration & System Functions  Instant-on, TransFR reconfiguration for in-field logic updates, on-chip hardened functions (SPI, I2C, timer/counter), an internal oscillator and IEEE 1149.1 boundary-scan support.
• Package & Environmental  Surface-mount 256-ball LFBGA (supplier device package: 256-CABGA 14×14) in an industrial grade device with an operating temperature range of −40 °C to 100 °C. RoHS compliant.

Typical Applications

• Industrial Control  Use as glue logic, protocol bridging, or real-time control interface in industrial systems that require an industrial temperature range and rugged packaging.
• Display and Video Interfaces  High I/O count with pre‑engineered display gearing and DDR I/O support makes the device suitable for display controller front-ends and embedded graphics interfaces.
• Memory Interface and Bus Bridging  Dedicated DDR/DDR2/LPDDR memory support and DDR registers in I/O cells enable implementation of memory interface logic and bus translation functions.
• System Management and Boot Control  On-chip user flash and background programming support system boot, configuration management and in-field updates without external microcontroller intervention.

Unique Advantages

• Highly Integrated I/O and Memory  Combines a large I/O count with embedded block RAM and distributed RAM to reduce external components and simplify board designs.
• Non-Volatile On-Chip Storage  Integrated user flash (up to 256 kbits) enables secure single-chip configurations and background programming for field updates.
• Low Standby Power  Advanced low-power process and standby modes (family spec cites standby as low as 22 μW) help minimize power consumption in idle states.
• Flexible Clocking and PLLs  Multiple primary clocks and fractional-N PLL capability provide deterministic timing and flexible frequency synthesis for diverse interfaces.
• Industrial-Grade Operation  Designed for −40 °C to 100 °C operation and supplied in a surface-mount 256-ball package for robust deployment in industrial environments.

Why Choose LCMXO2-7000HE-5BG256I?

The LCMXO2-7000HE-5BG256I positions itself as a versatile, industrial-grade MachXO2 FPGA option that balances sizable logic capacity (6,864 logic elements) with generous memory resources and a high I/O count (206). Its integrated non-volatile flash, low-power characteristics, flexible I/O signaling and in-field reconfiguration capabilities make it well suited for system glue logic, interface bridging, display timing, and embedded control tasks.

For designers seeking a single-chip solution that combines configurability, on-chip storage and robust industrial operating range, this MachXO2 device offers a pragmatic platform that scales across a variety of embedded and system-level designs while reducing external BOM and simplifying configuration management.

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