LCMXO2-7000HE-5BG332I

The LCMXO2-7000HE-5BG332I is a MachXO2 family FPGA from Lattice Semiconductor, offering a flexible logic architecture optimized for low-power, instant-on system functions. It combines 6,864 logic elements with on-chip non-volatile flash and embedded RAM to address bridging, control, and I/O-centric system tasks.

Designed for industrial applications, this device delivers a compact 332-ball BGA footprint, a broad I/O count and programmable I/O standards for system interfacing, plus extended operating temperature and a controlled low-voltage supply range for reliable integration into industrial systems.

Key Features

• Logic Capacity — 6,864 logic elements suitable for glue-logic, control, and mid-density FPGA tasks.
• Embedded and Distributed Memory — Approximately 240 kbits of on-chip embedded memory and up to 54 kbits of distributed RAM for buffering and small-data storage needs.
• On-Chip User Flash — Non-volatile user flash (family supports up to 256 kbits) with up to 100,000 write cycles, accessible via SPI, I2C and JTAG for configuration and in-field updates.
• High-Density I/O — 278 I/Os in the 332-ball BGA package with programmable sysIO buffer support for LVCMOS (1.2–3.3 V), LVTTL and multiple differential standards.
• Pre-Engineered Source-Synchronous I/O — DDR registers in I/O cells, dedicated gearing logic (including 7:1 gearing for display I/Os) and support for generic DDR and dedicated DDR/DDR2/LPDDR interfaces.
• Clocking and PLLs — Eight primary clocks and up to two analog PLLs with fractional-n synthesis and a wide input range (7 MHz to 400 MHz) for flexible timing architectures.
• Low Power and Power Management — Advanced low-power process with standby modes and microsecond-scale instant-on capability for fast system startup and reduced standby consumption.
• Package and Temperature — 332-ball package (listed as 332-FBGA and supplier package 332-CABGA 17×17) in an industrial-grade device with operating range −40 °C to 100 °C and a supply range of 1.14 V to 1.26 V.
• System-Level Functions — On-chip hardened SPI, I2C, timer/counter, oscillator and IEEE 1149.1 boundary scan with IEEE 1532 in-system programming support for manufacturing and field serviceability.
• Regulatory — RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s 6,864 logic elements and wide I/O support to implement protocol conversion and board-level glue logic between processors, sensors and memory.
• Display and Video I/O — Pre-engineered source-synchronous I/O, DDR registers and 7:1 gearing support display and panel interface requirements.
• Memory Controller and PHY Support — Dedicated DDR/DDR2/LPDDR support and DQS-capable interfaces enable on-board memory interfacing and buffering tasks.
• System Control and Peripheral Management — Embedded flash, on-chip SPI/I2C and timers are well suited for system control, boot management and peripheral supervision.

Unique Advantages

• Integrated Non-Volatile Configuration: On-chip user flash enables single-chip, instant-on systems and field reconfiguration without external PROM.
• High I/O Count in a Compact Package: 278 I/Os in a 332-ball package deliver a high pin count for dense board-level connectivity while keeping board footprint compact.
• Flexible I/O Standards: Programmable sysIO buffers and on-chip differential termination simplify interfacing to a wide range of single-ended and differential buses, reducing external components.
• Robust Industrial Operating Range: Industrial-grade operation from −40 °C to 100 °C with RoHS compliance supports deployment in demanding environments.
• Designed for Low-Power Systems: Advanced low-power process with standby modes and fast power-up behavior helps minimize system power and enable rapid startup.
• On-Chip System Support: Hardened SPI, I2C and timers plus boundary-scan and in-system programming options streamline development and manufacturing workflows.

Why Choose LCMXO2-7000HE-5BG332I?

The LCMXO2-7000HE-5BG332I delivers a balanced combination of mid-range logic capacity, substantial on-chip memory and extensive I/O configurability in an industrial-grade MachXO2 device. It targets designs that require reliable, instant-on programmable logic, flexible interface support and integrated non-volatile configuration memory.

This part is well suited for engineers and procurement teams building control, bridging, display and memory-interface subsystems who need a compact, power-conscious FPGA platform with on-chip system functions and manufacturing-friendly features such as boundary-scan and in-system programming.

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