LCMXO2-7000HE-4FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA

Quantity 175 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HE-4FTG256I – MachXO2 FPGA, 6,864 logic elements, 206 I/Os

The LCMXO2-7000HE-4FTG256I is a MachXO2 family field-programmable gate array (FPGA) IC designed for industrial applications. It provides a flexible logic architecture with 6,864 logic elements and 206 I/Os in a compact 256‑LBGA footprint.

Designed for low-power, instant-on systems, the MachXO2 family offers embedded memory, on-chip configuration options and flexible I/O support, making this device suitable for control, interface and glue-logic roles across industrial and embedded markets.

Key Features

  • Logic Capacity — 6,864 logic elements (cells) to implement glue logic, state machines and moderate-density custom functions.
  • Embedded Memory — 245,760 total RAM bits available for system buffering, state storage and small data tables.
  • I/O Density & Flexibility — 206 I/Os supporting a wide range of interfaces; on-chip features from the MachXO2 family include programmable sysIO buffers and programmable pull modes.
  • Low-Voltage Core Supply — Core supply range of 1.14 V to 1.26 V to match system power rails and low-power design targets.
  • Industrial Temperature Rating — Specified for operation from −40 °C to 100 °C for use in industrial environments.
  • Package & Mounting — 256‑LBGA surface-mount package; supplier package specified as 256‑FTBGA (17×17 mm) for compact board-level integration.
  • Non-Volatile, Reconfigurable Family Features — MachXO2 family capabilities include on-chip user flash memory, instant-on behavior and multiple programming interfaces (as described in the MachXO2 family datasheet).
  • Power and I/O Options (Family) — Family-level ultra low power modes, programmable low-swing differential I/Os, and on-chip termination options enable efficient system-level power and signal management.
  • Clocking & PLLs (Family) — Family features include multiple primary clocks and up to two analog PLLs with wide input-frequency support for flexible clocking.
  • Regulatory & Environmental — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Industrial Control — Implement custom control logic, sensor interfacing and I/O aggregation within industrial automation equipment that requires an extended temperature range.
  • Interface Bridging & Glue Logic — Use the device to bridge buses, translate protocols and consolidate peripheral interfaces while minimizing board-level components.
  • Human-Machine Interfaces — Drive and manage display and input interfaces with flexible I/O and embedded memory for buffering and timing control.
  • Embedded System Integration — Provide system supervision, device management, and peripheral orchestration with instant-on configuration and on-chip non-volatile memory (family feature).

Unique Advantages

  • High Logic Density in a Compact Package: 6,864 logic elements and 206 I/Os in a 256‑LBGA enable substantial functionality without a large PCB footprint.
  • Industrial-Grade Operation: Rated for −40 °C to 100 °C to meet industrial environment requirements.
  • Embedded Memory for System Tasks: 245,760 bits of on-chip RAM support buffering, FIFOs and local data storage without external memory.
  • Low-Voltage Core: 1.14–1.26 V supply range supports low-power core designs and modern power architectures.
  • Family-Level Configurability: MachXO2 family features such as on-chip user flash, instant-on configuration and programmable I/O broaden system design options and simplify deployment.
  • RoHS Compliant: Conforms to RoHS environmental requirements for modern production workflows.

Why Choose LCMXO2-7000HE-4FTG256I?

This MachXO2 device combines moderate logic capacity, substantial embedded RAM and a high I/O count in a single, industrial-rated package—making it well suited for engineers who need reliable glue logic, interface consolidation and control functions without adding external components. The device’s low-voltage core, family-provided non-volatile configuration options and flexible I/O features support compact, power-conscious designs with robust environmental range.

For designs that require scalability within the MachXO2 family and access to family-level features such as on-chip flash and flexible clocking, the LCMXO2-7000HE-4FTG256I provides a balanced option for industrial and embedded system applications.

Request a quote or submit your requirements to get pricing and availability for the LCMXO2-7000HE-4FTG256I.

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