LCMXO2-7000HE-4FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA |
|---|---|
| Quantity | 175 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-4FTG256I – MachXO2 FPGA, 6,864 logic elements, 206 I/Os
The LCMXO2-7000HE-4FTG256I is a MachXO2 family field-programmable gate array (FPGA) IC designed for industrial applications. It provides a flexible logic architecture with 6,864 logic elements and 206 I/Os in a compact 256‑LBGA footprint.
Designed for low-power, instant-on systems, the MachXO2 family offers embedded memory, on-chip configuration options and flexible I/O support, making this device suitable for control, interface and glue-logic roles across industrial and embedded markets.
Key Features
- Logic Capacity — 6,864 logic elements (cells) to implement glue logic, state machines and moderate-density custom functions.
- Embedded Memory — 245,760 total RAM bits available for system buffering, state storage and small data tables.
- I/O Density & Flexibility — 206 I/Os supporting a wide range of interfaces; on-chip features from the MachXO2 family include programmable sysIO buffers and programmable pull modes.
- Low-Voltage Core Supply — Core supply range of 1.14 V to 1.26 V to match system power rails and low-power design targets.
- Industrial Temperature Rating — Specified for operation from −40 °C to 100 °C for use in industrial environments.
- Package & Mounting — 256‑LBGA surface-mount package; supplier package specified as 256‑FTBGA (17×17 mm) for compact board-level integration.
- Non-Volatile, Reconfigurable Family Features — MachXO2 family capabilities include on-chip user flash memory, instant-on behavior and multiple programming interfaces (as described in the MachXO2 family datasheet).
- Power and I/O Options (Family) — Family-level ultra low power modes, programmable low-swing differential I/Os, and on-chip termination options enable efficient system-level power and signal management.
- Clocking & PLLs (Family) — Family features include multiple primary clocks and up to two analog PLLs with wide input-frequency support for flexible clocking.
- Regulatory & Environmental — RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Industrial Control — Implement custom control logic, sensor interfacing and I/O aggregation within industrial automation equipment that requires an extended temperature range.
- Interface Bridging & Glue Logic — Use the device to bridge buses, translate protocols and consolidate peripheral interfaces while minimizing board-level components.
- Human-Machine Interfaces — Drive and manage display and input interfaces with flexible I/O and embedded memory for buffering and timing control.
- Embedded System Integration — Provide system supervision, device management, and peripheral orchestration with instant-on configuration and on-chip non-volatile memory (family feature).
Unique Advantages
- High Logic Density in a Compact Package: 6,864 logic elements and 206 I/Os in a 256‑LBGA enable substantial functionality without a large PCB footprint.
- Industrial-Grade Operation: Rated for −40 °C to 100 °C to meet industrial environment requirements.
- Embedded Memory for System Tasks: 245,760 bits of on-chip RAM support buffering, FIFOs and local data storage without external memory.
- Low-Voltage Core: 1.14–1.26 V supply range supports low-power core designs and modern power architectures.
- Family-Level Configurability: MachXO2 family features such as on-chip user flash, instant-on configuration and programmable I/O broaden system design options and simplify deployment.
- RoHS Compliant: Conforms to RoHS environmental requirements for modern production workflows.
Why Choose LCMXO2-7000HE-4FTG256I?
This MachXO2 device combines moderate logic capacity, substantial embedded RAM and a high I/O count in a single, industrial-rated package—making it well suited for engineers who need reliable glue logic, interface consolidation and control functions without adding external components. The device’s low-voltage core, family-provided non-volatile configuration options and flexible I/O features support compact, power-conscious designs with robust environmental range.
For designs that require scalability within the MachXO2 family and access to family-level features such as on-chip flash and flexible clocking, the LCMXO2-7000HE-4FTG256I provides a balanced option for industrial and embedded system applications.
Request a quote or submit your requirements to get pricing and availability for the LCMXO2-7000HE-4FTG256I.

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