LCMXO2-7000HC-6FTG256C

The LCMXO2-7000HC-6FTG256C is a MachXO2 family non-volatile FPGA offering flexible logic, extensive I/O and on-chip memory for commercial embedded designs. Built for applications that require instant-on configuration, adaptable I/O standards and low standby power, this device targets system control, interface bridging and display/memory interface roles.

Designed as a single-chip, reconfigurable solution, the device combines 6,864 logic elements, roughly 245,760 bits of on-chip RAM, and 206 programmable I/Os in a 256-ball LBGA package for compact, surface-mount system integration.

Key Features

• Core Logic  6,864 logic elements for implementating glue logic, state machines and mid-density FPGA functions.
• On-chip Memory  Approximately 245,760 bits of embedded memory combining block and distributed RAM for FIFOs, buffering and small data stores.
• I/O Capacity & Flexibility  206 I/Os with programmable sysIO buffers supporting a wide range of interfaces including multiple LVCMOS levels, LVDS-family signaling, SSTL/HSTL and more, plus on-chip differential termination and hot-socketing support.
• Non-volatile Configuration & Flash  On-chip user flash memory (family support up to 256 kbits) enabling instant-on, in-field reconfiguration and background programming via JTAG, SPI and I²C; memory endurance listed at 100,000 write cycles.
• Low Power Architecture  Advanced 65 nm low-power process with standby modes; family data cites standby power as low as 22 μW and programmable power-saving options.
• Clocking & PLLs  Multiple primary clocks and up to two analog PLLs per device (family level) for fractional-n frequency synthesis and flexible clock distribution for high-speed interfaces.
• Package, Voltage & Thermal  Surface-mount 256-LBGA (supplier package: 256-FTBGA, 17 × 17 mm), single-supply operation from 2.375 V to 3.465 V, and commercial operating temperature range 0 °C to 85 °C.
• System Features & Reliability  Hardened system functions (SPI, I²C, timer/counter), IEEE-1149.1 boundary scan and in-system programming support for field updates (TransFR reconfiguration) and system traceability.
• Compliance  RoHS compliant and provided in halogen-free packaging options at the family level.

Typical Applications

• Interface Bridging and Glue Logic  Use the device to consolidate protocol translation, bus bridging and board-level logic, leveraging the large I/O count and flexible I/O standards.
• Display and Video I/O  Pre-engineered source-synchronous I/O and DDR register support make it suitable for display interface gearing and timing-critical I/O tasks.
• Memory Interface Support  Dedicated DDR/DDR2/LPDDR memory support and FIFO control logic at the family level enable buffering and timing adaptation for memory subsystems.
• System Control and Configuration  On-chip non-volatile flash, instant-on capability and hardened timers/I²C/SPI make the part a compact option for system supervision and configuration storage.

Unique Advantages

• Instant-on non-volatile FPGA: Powers up configured within microseconds using on-chip flash, reducing system initialization complexity.
• High I/O with broad standards support: 206 programmable I/Os and sysIO buffer options let designers support diverse interfaces without external level shifters.
• Compact, single-chip solution: Combines programmable logic, memory and peripheral functions in a 256-LBGA package to reduce BOM and PCB area.
• Field reconfiguration: In-field logic updates and background programming via JTAG, SPI and I²C enable iterative development and deployed updates.
• Low-power standby modes: Advanced low-power process and configurable power-saving modes support energy-conscious designs.

Why Choose LCMXO2-7000HC-6FTG256C?

The LCMXO2-7000HC-6FTG256C positions itself as a versatile, mid-density FPGA for commercial embedded systems that require a combination of abundant I/O, non-volatile configuration and on-chip memory. Its feature set—including 6,864 logic elements, substantial embedded RAM and flexible, programmable I/Os—targets designs that need instant-on behavior, compact integration and in-field reconfigurability.

This device is well suited to engineers building interface-rich products, display controllers, memory interface assist circuits and system supervisors. The MachXO2 family-level capabilities such as hardened peripherals, low-power modes and reconfiguration support deliver scalability and long-term design flexibility.

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